WO2004068598A3 - Phosphor converted light emitting devices - Google Patents

Phosphor converted light emitting devices Download PDF

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Publication number
WO2004068598A3
WO2004068598A3 PCT/US2004/002161 US2004002161W WO2004068598A3 WO 2004068598 A3 WO2004068598 A3 WO 2004068598A3 US 2004002161 W US2004002161 W US 2004002161W WO 2004068598 A3 WO2004068598 A3 WO 2004068598A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting devices
converted light
phosphor converted
phosphor material
Prior art date
Application number
PCT/US2004/002161
Other languages
French (fr)
Other versions
WO2004068598A2 (en
Inventor
Michael F Weber
Andrew J Ouderkirk
Original Assignee
3M Innovative Properties Co
Michael F Weber
Andrew J Ouderkirk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Michael F Weber, Andrew J Ouderkirk filed Critical 3M Innovative Properties Co
Priority to EP04705629A priority Critical patent/EP1588432A2/en
Priority to JP2006503044A priority patent/JP2006515962A/en
Publication of WO2004068598A2 publication Critical patent/WO2004068598A2/en
Publication of WO2004068598A3 publication Critical patent/WO2004068598A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

A light source including a layer of phosphor material, an LED capable of emitting light that excites the phosphor material, an interference reflector positioned to reflect at least some light emitted by the LED that has not passed through the phosphor material, onto the layer of phosphor material.
PCT/US2004/002161 2003-01-27 2004-01-27 Phosphor converted light emitting devices WO2004068598A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04705629A EP1588432A2 (en) 2003-01-27 2004-01-27 Phosphor converted light emitting devices
JP2006503044A JP2006515962A (en) 2003-01-27 2004-01-27 Phosphor conversion light emitting device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US44327403P 2003-01-27 2003-01-27
US44323503P 2003-01-27 2003-01-27
US44323203P 2003-01-27 2003-01-27
US60/443,274 2003-01-27
US60/443,232 2003-01-27
US60/443,235 2003-01-27

Publications (2)

Publication Number Publication Date
WO2004068598A2 WO2004068598A2 (en) 2004-08-12
WO2004068598A3 true WO2004068598A3 (en) 2004-11-04

Family

ID=32830867

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2004/002161 WO2004068598A2 (en) 2003-01-27 2004-01-27 Phosphor converted light emitting devices
PCT/US2004/002086 WO2004068597A2 (en) 2003-01-27 2004-01-27 Phosphor based light sources utilizing total internal reflection
PCT/US2004/002205 WO2004068602A2 (en) 2003-01-27 2004-01-27 Phosphor based light sources having a reflective polarizer

Family Applications After (2)

Application Number Title Priority Date Filing Date
PCT/US2004/002086 WO2004068597A2 (en) 2003-01-27 2004-01-27 Phosphor based light sources utilizing total internal reflection
PCT/US2004/002205 WO2004068602A2 (en) 2003-01-27 2004-01-27 Phosphor based light sources having a reflective polarizer

Country Status (6)

Country Link
US (2) US7157839B2 (en)
EP (3) EP1588432A2 (en)
JP (3) JP2006515962A (en)
KR (3) KR101079443B1 (en)
TW (5) TW200507298A (en)
WO (3) WO2004068598A2 (en)

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