US2273505A
(en)
*
|
|
1942-02-17 |
|
Container |
US2039593A
(en)
|
1935-06-20 |
1936-05-05 |
Theodore N Hubbuch |
Heat transfer coil
|
US2600103A
(en)
|
1948-02-19 |
1952-06-10 |
Feck John Franz |
Means for absorbing ice pressure
|
US3267859A
(en)
|
1964-02-18 |
1966-08-23 |
Sakari T Jutila |
Liquid dielectric pump
|
US3361195A
(en)
|
1966-09-23 |
1968-01-02 |
Westinghouse Electric Corp |
Heat sink member for a semiconductor device
|
US3524497A
(en)
*
|
1968-04-04 |
1970-08-18 |
Ibm |
Heat transfer in a liquid cooling system
|
US3554669A
(en)
|
1968-12-04 |
1971-01-12 |
Gen Electric |
Electric-fluid energy converter
|
US3771219A
(en)
|
1970-02-05 |
1973-11-13 |
Sharp Kk |
Method for manufacturing semiconductor device
|
US3654988A
(en)
|
1970-02-24 |
1972-04-11 |
American Standard Inc |
Freeze protection for outdoor cooler
|
DE2102254B2
(en)
|
1971-01-19 |
1973-05-30 |
Robert Bosch Gmbh, 7000 Stuttgart |
COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
|
FR2216537B1
(en)
|
1973-02-06 |
1975-03-07 |
Gaz De France |
|
US3852806A
(en)
*
|
1973-05-02 |
1974-12-03 |
Gen Electric |
Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
|
US3823572A
(en)
|
1973-08-15 |
1974-07-16 |
American Air Filter Co |
Freeze protection device in heat pump system
|
US3923426A
(en)
|
1974-08-15 |
1975-12-02 |
Alza Corp |
Electroosmotic pump and fluid dispenser including same
|
US4072188A
(en)
|
1975-07-02 |
1978-02-07 |
Honeywell Information Systems Inc. |
Fluid cooling systems for electronic systems
|
US4138996A
(en)
|
1977-07-28 |
1979-02-13 |
Rheem Manufacturing Company |
Solar heater freeze protection system
|
US4312012A
(en)
|
1977-11-25 |
1982-01-19 |
International Business Machines Corp. |
Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
|
US4203488A
(en)
*
|
1978-03-01 |
1980-05-20 |
Aavid Engineering, Inc. |
Self-fastened heat sinks
|
US4235285A
(en)
*
|
1979-10-29 |
1980-11-25 |
Aavid Engineering, Inc. |
Self-fastened heat sinks
|
US4345267A
(en)
*
|
1980-03-31 |
1982-08-17 |
Amp Incorporated |
Active device substrate connector having a heat sink
|
US4573067A
(en)
|
1981-03-02 |
1986-02-25 |
The Board Of Trustees Of The Leland Stanford Junior University |
Method and means for improved heat removal in compact semiconductor integrated circuits
|
US4450472A
(en)
|
1981-03-02 |
1984-05-22 |
The Board Of Trustees Of The Leland Stanford Junior University |
Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
|
US4574876A
(en)
|
1981-05-11 |
1986-03-11 |
Extracorporeal Medical Specialties, Inc. |
Container with tapered walls for heating or cooling fluids
|
US4485429A
(en)
|
1982-06-09 |
1984-11-27 |
Sperry Corporation |
Apparatus for cooling integrated circuit chips
|
US4494171A
(en)
|
1982-08-24 |
1985-01-15 |
Sundstrand Corporation |
Impingement cooling apparatus for heat liberating device
|
US4516632A
(en)
|
1982-08-31 |
1985-05-14 |
The United States Of America As Represented By The United States Deparment Of Energy |
Microchannel crossflow fluid heat exchanger and method for its fabrication
|
US4467861A
(en)
|
1982-10-04 |
1984-08-28 |
Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr |
Heat-transporting device
|
JPS59136265A
(en)
*
|
1983-01-25 |
1984-08-04 |
Sharp Corp |
Liquid supplier
|
GB8323065D0
(en)
|
1983-08-26 |
1983-09-28 |
Rca Corp |
Flux free photo-detector soldering
|
US4567505A
(en)
|
1983-10-27 |
1986-01-28 |
The Board Of Trustees Of The Leland Stanford Junior University |
Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
|
JPH0673364B2
(en)
|
1983-10-28 |
1994-09-14 |
株式会社日立製作所 |
Integrated circuit chip cooler
|
JPS60203421A
(en)
*
|
1984-03-29 |
1985-10-15 |
Kyoraku Co Ltd |
Manufacture of container having flexible wall surface
|
US4561040A
(en)
|
1984-07-12 |
1985-12-24 |
Ibm Corporation |
Cooling system for VLSI circuit chips
|
US4893174A
(en)
|
1985-07-08 |
1990-01-09 |
Hitachi, Ltd. |
High density integration of semiconductor circuit
|
US4758926A
(en)
|
1986-03-31 |
1988-07-19 |
Microelectronics And Computer Technology Corporation |
Fluid-cooled integrated circuit package
|
US4716494A
(en)
*
|
1986-11-07 |
1987-12-29 |
Amp Incorporated |
Retention system for removable heat sink
|
US4868712A
(en)
|
1987-02-04 |
1989-09-19 |
Woodman John K |
Three dimensional integrated circuit package
|
US4903761A
(en)
|
1987-06-03 |
1990-02-27 |
Lockheed Missiles & Space Company, Inc. |
Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
|
US5016138A
(en)
|
1987-10-27 |
1991-05-14 |
Woodman John K |
Three dimensional integrated circuit package
|
US4894709A
(en)
|
1988-03-09 |
1990-01-16 |
Massachusetts Institute Of Technology |
Forced-convection, liquid-cooled, microchannel heat sinks
|
US4896719A
(en)
|
1988-05-11 |
1990-01-30 |
Mcdonnell Douglas Corporation |
Isothermal panel and plenum
|
US4908112A
(en)
|
1988-06-16 |
1990-03-13 |
E. I. Du Pont De Nemours & Co. |
Silicon semiconductor wafer for analyzing micronic biological samples
|
JPH028424A
(en)
*
|
1988-06-28 |
1990-01-11 |
Tsukasa Morii |
Water supply device
|
US4866570A
(en)
|
1988-08-05 |
1989-09-12 |
Ncr Corporation |
Apparatus and method for cooling an electronic device
|
US4938280A
(en)
|
1988-11-07 |
1990-07-03 |
Clark William E |
Liquid-cooled, flat plate heat exchanger
|
CA2002213C
(en)
|
1988-11-10 |
1999-03-30 |
Iwona Turlik |
High performance integrated circuit chip package and method of making same
|
US5145001A
(en)
|
1989-07-24 |
1992-09-08 |
Creare Inc. |
High heat flux compact heat exchanger having a permeable heat transfer element
|
US5009760A
(en)
|
1989-07-28 |
1991-04-23 |
Board Of Trustees Of The Leland Stanford Junior University |
System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
|
CH681168A5
(en)
|
1989-11-10 |
1993-01-29 |
Westonbridge Int Ltd |
Micro-pump for medicinal dosing
|
US4978638A
(en)
*
|
1989-12-21 |
1990-12-18 |
International Business Machines Corporation |
Method for attaching heat sink to plastic packaged electronic component
|
US5083194A
(en)
|
1990-01-16 |
1992-01-21 |
Cray Research, Inc. |
Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
|
US5179500A
(en)
|
1990-02-27 |
1993-01-12 |
Grumman Aerospace Corporation |
Vapor chamber cooled electronic circuit card
|
DE4006152A1
(en)
|
1990-02-27 |
1991-08-29 |
Fraunhofer Ges Forschung |
MICROMINIATURIZED PUMP
|
US5070040A
(en)
|
1990-03-09 |
1991-12-03 |
University Of Colorado Foundation, Inc. |
Method and apparatus for semiconductor circuit chip cooling
|
US5016090A
(en)
|
1990-03-21 |
1991-05-14 |
International Business Machines Corporation |
Cross-hatch flow distribution and applications thereof
|
US5096388A
(en)
|
1990-03-22 |
1992-03-17 |
The Charles Stark Draper Laboratory, Inc. |
Microfabricated pump
|
US5043797A
(en)
|
1990-04-03 |
1991-08-27 |
General Electric Company |
Cooling header connection for a thyristor stack
|
US5265670A
(en)
|
1990-04-27 |
1993-11-30 |
International Business Machines Corporation |
Convection transfer system
|
JPH07114250B2
(en)
|
1990-04-27 |
1995-12-06 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
Heat transfer system
|
US5088005A
(en)
|
1990-05-08 |
1992-02-11 |
Sundstrand Corporation |
Cold plate for cooling electronics
|
US5161089A
(en)
|
1990-06-04 |
1992-11-03 |
International Business Machines Corporation |
Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
|
US5203401A
(en)
|
1990-06-29 |
1993-04-20 |
Digital Equipment Corporation |
Wet micro-channel wafer chuck and cooling method
|
US5057908A
(en)
|
1990-07-10 |
1991-10-15 |
Iowa State University Research Foundation, Inc. |
High power semiconductor device with integral heat sink
|
US5420067A
(en)
|
1990-09-28 |
1995-05-30 |
The United States Of America As Represented By The Secretary Of The Navy |
Method of fabricatring sub-half-micron trenches and holes
|
US5099910A
(en)
|
1991-01-15 |
1992-03-31 |
Massachusetts Institute Of Technology |
Microchannel heat sink with alternating flow directions
|
US5099311A
(en)
|
1991-01-17 |
1992-03-24 |
The United States Of America As Represented By The United States Department Of Energy |
Microchannel heat sink assembly
|
JPH06342990A
(en)
|
1991-02-04 |
1994-12-13 |
Internatl Business Mach Corp <Ibm> |
Integrated cooling system
|
US5131233A
(en)
|
1991-03-08 |
1992-07-21 |
Cray Computer Corporation |
Gas-liquid forced turbulence cooling
|
US5263251A
(en)
|
1991-04-02 |
1993-11-23 |
Microunity Systems Engineering |
Method of fabricating a heat exchanger for solid-state electronic devices
|
US5125451A
(en)
|
1991-04-02 |
1992-06-30 |
Microunity Systems Engineering, Inc. |
Heat exchanger for solid-state electronic devices
|
US5232047A
(en)
|
1991-04-02 |
1993-08-03 |
Microunity Systems Engineering, Inc. |
Heat exchanger for solid-state electronic devices
|
US5294830A
(en)
*
|
1991-05-21 |
1994-03-15 |
International Business Machines Corporation |
Apparatus for indirect impingement cooling of integrated circuit chips
|
US5199487A
(en)
*
|
1991-05-31 |
1993-04-06 |
Hughes Aircraft Company |
Electroformed high efficiency heat exchanger and method for making
|
US5239200A
(en)
|
1991-08-21 |
1993-08-24 |
International Business Machines Corporation |
Apparatus for cooling integrated circuit chips
|
US5228502A
(en)
|
1991-09-04 |
1993-07-20 |
International Business Machines Corporation |
Cooling by use of multiple parallel convective surfaces
|
JP3161635B2
(en)
|
1991-10-17 |
2001-04-25 |
ソニー株式会社 |
Ink jet print head and ink jet printer
|
US5386143A
(en)
|
1991-10-25 |
1995-01-31 |
Digital Equipment Corporation |
High performance substrate, electronic package and integrated circuit cooling process
|
JPH05217121A
(en)
|
1991-11-22 |
1993-08-27 |
Internatl Business Mach Corp <Ibm> |
Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
|
US5142970A
(en)
|
1992-02-24 |
1992-09-01 |
Erkenbrack Kenneth B |
Apparatus for storing matter out of contact with gas
|
US5218515A
(en)
|
1992-03-13 |
1993-06-08 |
The United States Of America As Represented By The United States Department Of Energy |
Microchannel cooling of face down bonded chips
|
US5239443A
(en)
|
1992-04-23 |
1993-08-24 |
International Business Machines Corporation |
Blind hole cold plate cooling system
|
US5317805A
(en)
|
1992-04-28 |
1994-06-07 |
Minnesota Mining And Manufacturing Company |
Method of making microchanneled heat exchangers utilizing sacrificial cores
|
US5275237A
(en)
|
1992-06-12 |
1994-01-04 |
Micron Technology, Inc. |
Liquid filled hot plate for precise temperature control
|
US5308429A
(en)
|
1992-09-29 |
1994-05-03 |
Digital Equipment Corporation |
System for bonding a heatsink to a semiconductor chip package
|
DE4240082C1
(en)
|
1992-11-28 |
1994-04-21 |
Erno Raumfahrttechnik Gmbh |
Heat pipe
|
US5316077A
(en)
|
1992-12-09 |
1994-05-31 |
Eaton Corporation |
Heat sink for electrical circuit components
|
US5269372A
(en)
|
1992-12-21 |
1993-12-14 |
International Business Machines Corporation |
Intersecting flow network for a cold plate cooling system
|
US5398848A
(en)
*
|
1993-02-08 |
1995-03-21 |
Padamsee; Alimohamed C. |
Portable liquid container
|
US5397919A
(en)
|
1993-03-04 |
1995-03-14 |
Square Head, Inc. |
Heat sink assembly for solid state devices
|
JP3477781B2
(en)
|
1993-03-23 |
2003-12-10 |
セイコーエプソン株式会社 |
IC card
|
US5436793A
(en)
|
1993-03-31 |
1995-07-25 |
Ncr Corporation |
Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
|
US5459352A
(en)
|
1993-03-31 |
1995-10-17 |
Unisys Corporation |
Integrated circuit package having a liquid metal-aluminum/copper joint
|
US5427174A
(en)
|
1993-04-30 |
1995-06-27 |
Heat Transfer Devices, Inc. |
Method and apparatus for a self contained heat exchanger
|
US5380956A
(en)
|
1993-07-06 |
1995-01-10 |
Sun Microsystems, Inc. |
Multi-chip cooling module and method
|
US5514906A
(en)
|
1993-11-10 |
1996-05-07 |
Fujitsu Limited |
Apparatus for cooling semiconductor chips in multichip modules
|
US5441613A
(en)
|
1993-12-03 |
1995-08-15 |
Dionex Corporation |
Methods and apparatus for real-time monitoring, measurement and control of electroosmotic flow
|
KR100353020B1
(en)
*
|
1993-12-28 |
2003-01-10 |
쇼와 덴코 가부시키가이샤 |
Multilayer Heat Exchanger
|
US5534471A
(en)
|
1994-01-12 |
1996-07-09 |
Air Products And Chemicals, Inc. |
Ion transport membranes with catalyzed mixed conducting porous layer
|
US5383340A
(en)
|
1994-03-24 |
1995-01-24 |
Aavid Laboratories, Inc. |
Two-phase cooling system for laptop computers
|
US5544696A
(en)
|
1994-07-01 |
1996-08-13 |
The United States Of America As Represented By The Secretary Of The Air Force |
Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
|
US5641400A
(en)
|
1994-10-19 |
1997-06-24 |
Hewlett-Packard Company |
Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems
|
US5508234A
(en)
|
1994-10-31 |
1996-04-16 |
International Business Machines Corporation |
Microcavity structures, fabrication processes, and applications thereof
|
JP3355824B2
(en)
|
1994-11-04 |
2002-12-09 |
株式会社デンソー |
Corrugated fin heat exchanger
|
US5585069A
(en)
|
1994-11-10 |
1996-12-17 |
David Sarnoff Research Center, Inc. |
Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
|
US5632876A
(en)
|
1995-06-06 |
1997-05-27 |
David Sarnoff Research Center, Inc. |
Apparatus and methods for controlling fluid flow in microchannels
|
US5548605A
(en)
|
1995-05-15 |
1996-08-20 |
The Regents Of The University Of California |
Monolithic microchannel heatsink
|
US5575929A
(en)
|
1995-06-05 |
1996-11-19 |
The Regents Of The University Of California |
Method for making circular tubular channels with two silicon wafers
|
US5696405A
(en)
|
1995-10-13 |
1997-12-09 |
Lucent Technologies Inc. |
Microelectronic package with device cooling
|
US5685966A
(en)
|
1995-10-20 |
1997-11-11 |
The United States Of America As Represented By The Secretary Of The Navy |
Bubble capture electrode configuration
|
US5675473A
(en)
|
1996-02-23 |
1997-10-07 |
Motorola, Inc. |
Apparatus and method for shielding an electronic module from electromagnetic radiation
|
US5692558A
(en)
|
1996-07-22 |
1997-12-02 |
Northrop Grumman Corporation |
Microchannel cooling using aviation fuels for airborne electronics
|
US5731954A
(en)
*
|
1996-08-22 |
1998-03-24 |
Cheon; Kioan |
Cooling system for computer
|
JPH1084139A
(en)
*
|
1996-09-09 |
1998-03-31 |
Technova:Kk |
Thermoelectric conversion device
|
US5839290A
(en)
*
|
1997-01-24 |
1998-11-24 |
United States Of America As Represented By The Secretary Of The Navy |
Organic/inorganic composite wicks for caillary pumped loops
|
US6116257A
(en)
*
|
1997-03-28 |
2000-09-12 |
New Technology Management Co., Ltd. |
Micromotors, linear motors, micropumps, methods of using the same, microactuators, methods of controlling flow properties of fluids, and apparatuses for controlling flow properties of fluids
|
US6154226A
(en)
*
|
1997-05-13 |
2000-11-28 |
Sarnoff Corporation |
Parallel print array
|
US6106685A
(en)
*
|
1997-05-13 |
2000-08-22 |
Sarnoff Corporation |
Electrode combinations for pumping fluids
|
US5901037A
(en)
*
|
1997-06-18 |
1999-05-04 |
Northrop Grumman Corporation |
Closed loop liquid cooling for semiconductor RF amplifier modules
|
US6907921B2
(en)
*
|
1998-06-18 |
2005-06-21 |
3M Innovative Properties Company |
Microchanneled active fluid heat exchanger
|
US6012902A
(en)
*
|
1997-09-25 |
2000-01-11 |
Caliper Technologies Corp. |
Micropump
|
US6227287B1
(en)
*
|
1998-05-25 |
2001-05-08 |
Denso Corporation |
Cooling apparatus by boiling and cooling refrigerant
|
US6196307B1
(en)
*
|
1998-06-17 |
2001-03-06 |
Intersil Americas Inc. |
High performance heat exchanger and method
|
US6103199A
(en)
*
|
1998-09-15 |
2000-08-15 |
Aclara Biosciences, Inc. |
Capillary electroflow apparatus and method
|
JP3810043B2
(en)
*
|
1998-09-30 |
2006-08-16 |
ペルメレック電極株式会社 |
Chrome plating electrode
|
US6388385B1
(en)
*
|
1999-03-19 |
2002-05-14 |
Fei Company |
Corrugated style anode element for ion pumps
|
US6338385B1
(en)
*
|
1999-04-16 |
2002-01-15 |
Hydril Company |
Retrievable downhole adjustable choke
|
US6253836B1
(en)
*
|
1999-05-24 |
2001-07-03 |
Compaq Computer Corporation |
Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus
|
US6131650A
(en)
*
|
1999-07-20 |
2000-10-17 |
Thermal Corp. |
Fluid cooled single phase heat sink
|
US6396706B1
(en)
*
|
1999-07-30 |
2002-05-28 |
Credence Systems Corporation |
Self-heating circuit board
|
US6675875B1
(en)
*
|
1999-08-06 |
2004-01-13 |
The Ohio State University |
Multi-layered micro-channel heat sink, devices and systems incorporating same
|
US6693320B1
(en)
*
|
1999-08-30 |
2004-02-17 |
Micron Technology, Inc. |
Capacitor structures with recessed hemispherical grain silicon
|
US6360814B1
(en)
*
|
1999-08-31 |
2002-03-26 |
Denso Corporation |
Cooling device boiling and condensing refrigerant
|
US6729383B1
(en)
*
|
1999-12-16 |
2004-05-04 |
The United States Of America As Represented By The Secretary Of The Navy |
Fluid-cooled heat sink with turbulence-enhancing support pins
|
JP2001185306A
(en)
*
|
1999-12-28 |
2001-07-06 |
Jst Mfg Co Ltd |
Connector for module
|
US6272012B1
(en)
*
|
2000-02-03 |
2001-08-07 |
Crystal Group Inc. |
System and method for cooling compact PCI circuit cards in a computer
|
DE60140837D1
(en)
*
|
2000-04-19 |
2010-02-04 |
Thermal Form & Function Inc |
Cooling plate with cooling fins with a vaporizing coolant
|
US6787052B1
(en)
*
|
2000-06-19 |
2004-09-07 |
Vladimir Vaganov |
Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
|
JP2002081745A
(en)
*
|
2000-09-01 |
2002-03-22 |
Rinnai Corp |
Expansion absorption material and freezing damage prevention apparatus
|
US6578626B1
(en)
*
|
2000-11-21 |
2003-06-17 |
Thermal Corp. |
Liquid cooled heat exchanger with enhanced flow
|
US6478258B1
(en)
*
|
2000-11-21 |
2002-11-12 |
Space Systems/Loral, Inc. |
Spacecraft multiple loop heat pipe thermal system for internal equipment panel applications
|
US6739142B2
(en)
*
|
2000-12-04 |
2004-05-25 |
Amos Korin |
Membrane desiccation heat pump
|
JP3658316B2
(en)
*
|
2000-12-19 |
2005-06-08 |
株式会社日立製作所 |
COOLING METHOD, COOLING SYSTEM, AND INFORMATION PROCESSING DEVICE
|
JP2002227770A
(en)
*
|
2001-02-02 |
2002-08-14 |
Matsushita Electric Ind Co Ltd |
Small pump
|
US6443704B1
(en)
*
|
2001-03-02 |
2002-09-03 |
Jafar Darabi |
Electrohydrodynamicly enhanced micro cooling system for integrated circuits
|
US20020134543A1
(en)
*
|
2001-03-20 |
2002-09-26 |
Motorola, Inc |
Connecting device with local heating element and method for using same
|
US6825127B2
(en)
*
|
2001-07-24 |
2004-11-30 |
Zarlink Semiconductor Inc. |
Micro-fluidic devices
|
US6770183B1
(en)
*
|
2001-07-26 |
2004-08-03 |
Sandia National Laboratories |
Electrokinetic pump
|
US6942018B2
(en)
*
|
2001-09-28 |
2005-09-13 |
The Board Of Trustees Of The Leland Stanford Junior University |
Electroosmotic microchannel cooling system
|
US6581388B2
(en)
*
|
2001-11-27 |
2003-06-24 |
Sun Microsystems, Inc. |
Active temperature gradient reducer
|
US6527835B1
(en)
*
|
2001-12-21 |
2003-03-04 |
Sandia Corporation |
Chemical preconcentrator with integral thermal flow sensor
|
US6679315B2
(en)
*
|
2002-01-14 |
2004-01-20 |
Marconi Communications, Inc. |
Small scale chip cooler assembly
|
US6719535B2
(en)
*
|
2002-01-31 |
2004-04-13 |
Eksigent Technologies, Llc |
Variable potential electrokinetic device
|
US7209355B2
(en)
*
|
2002-05-15 |
2007-04-24 |
Matsushita Electric Industrial Co., Ltd. |
Cooling device and an electronic apparatus including the same
|
US6836131B2
(en)
*
|
2002-08-16 |
2004-12-28 |
Credence Systems Corp. |
Spray cooling and transparent cooling plate thermal management system
|
DE10243026B3
(en)
*
|
2002-09-13 |
2004-06-03 |
Oliver Laing |
Device for local cooling or heating of an object
|
US6714412B1
(en)
*
|
2002-09-13 |
2004-03-30 |
International Business Machines Corporation |
Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
|
US6894899B2
(en)
*
|
2002-09-13 |
2005-05-17 |
Hong Kong Cheung Tat Electrical Co. Ltd. |
Integrated fluid cooling system for electronic components
|
US6881039B2
(en)
*
|
2002-09-23 |
2005-04-19 |
Cooligy, Inc. |
Micro-fabricated electrokinetic pump
|
US6807056B2
(en)
*
|
2002-09-24 |
2004-10-19 |
Hitachi, Ltd. |
Electronic equipment
|
DE10246990A1
(en)
*
|
2002-10-02 |
2004-04-22 |
Atotech Deutschland Gmbh |
Microstructure cooler and its use
|
US20040068322A1
(en)
*
|
2002-10-04 |
2004-04-08 |
Ferree Bret A. |
Reduced-friction artificial joints and components therefor
|
US20040112571A1
(en)
*
|
2002-11-01 |
2004-06-17 |
Cooligy, Inc. |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
|
JP2006516068A
(en)
*
|
2002-11-01 |
2006-06-15 |
クーリギー インコーポレイテッド |
Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat generating device
|
US7000684B2
(en)
*
|
2002-11-01 |
2006-02-21 |
Cooligy, Inc. |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
|
US20060060333A1
(en)
*
|
2002-11-05 |
2006-03-23 |
Lalit Chordia |
Methods and apparatuses for electronics cooling
|
US6981849B2
(en)
*
|
2002-12-18 |
2006-01-03 |
Intel Corporation |
Electro-osmotic pumps and micro-channels
|
US6934154B2
(en)
*
|
2003-03-31 |
2005-08-23 |
Intel Corporation |
Micro-channel heat exchangers and spreaders
|
US6903929B2
(en)
*
|
2003-03-31 |
2005-06-07 |
Intel Corporation |
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
|
US7508672B2
(en)
*
|
2003-09-10 |
2009-03-24 |
Qnx Cooling Systems Inc. |
Cooling system
|
US7009842B2
(en)
*
|
2004-01-30 |
2006-03-07 |
Isothermal Systems Research, Inc. |
Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
|
US7327570B2
(en)
*
|
2004-12-22 |
2008-02-05 |
Hewlett-Packard Development Company, L.P. |
Fluid cooled integrated circuit module
|