WO2004082882A1 - レーザ溶接方法およびレーザ溶接装置 - Google Patents

レーザ溶接方法およびレーザ溶接装置 Download PDF

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Publication number
WO2004082882A1
WO2004082882A1 PCT/JP2004/003636 JP2004003636W WO2004082882A1 WO 2004082882 A1 WO2004082882 A1 WO 2004082882A1 JP 2004003636 W JP2004003636 W JP 2004003636W WO 2004082882 A1 WO2004082882 A1 WO 2004082882A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser welding
optical fiber
value
welding method
welding device
Prior art date
Application number
PCT/JP2004/003636
Other languages
English (en)
French (fr)
Inventor
Shinichi Nakayama
Takahiro Nagashima
Original Assignee
Miyachi Technos Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyachi Technos Corporation filed Critical Miyachi Technos Corporation
Priority to EP04721654A priority Critical patent/EP1604771A1/en
Priority to US10/548,999 priority patent/US7259352B2/en
Publication of WO2004082882A1 publication Critical patent/WO2004082882A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
PCT/JP2004/003636 2003-03-19 2004-03-18 レーザ溶接方法およびレーザ溶接装置 WO2004082882A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04721654A EP1604771A1 (en) 2003-03-19 2004-03-18 Laser welding method and laser welding device
US10/548,999 US7259352B2 (en) 2003-03-19 2004-03-18 Laser welding method and laser welding device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-075004 2003-03-19
JP2003075004A JP3862664B2 (ja) 2003-03-19 2003-03-19 レーザ溶接方法およびレーザ溶接装置

Publications (1)

Publication Number Publication Date
WO2004082882A1 true WO2004082882A1 (ja) 2004-09-30

Family

ID=33027855

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/003636 WO2004082882A1 (ja) 2003-03-19 2004-03-18 レーザ溶接方法およびレーザ溶接装置

Country Status (4)

Country Link
US (1) US7259352B2 (ja)
EP (1) EP1604771A1 (ja)
JP (1) JP3862664B2 (ja)
WO (1) WO2004082882A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007307597A (ja) * 2006-05-19 2007-11-29 Disco Abrasive Syst Ltd レーザー加工装置
US9352420B2 (en) 2007-10-10 2016-05-31 Ronald Peter Whitfield Laser cladding device with an improved zozzle
WO2009077870A2 (en) 2007-10-10 2009-06-25 Ronald Peter Whitfield Laser cladding device with an improved nozzle
US8800480B2 (en) 2007-10-10 2014-08-12 Ronald Peter Whitfield Laser cladding device with an improved nozzle
US8378255B2 (en) 2007-11-19 2013-02-19 Miyachi Corporation Laser beam irradiation apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08267264A (ja) * 1995-01-25 1996-10-15 Lumonics Ltd レーザシステム
JP2000321470A (ja) * 1999-05-17 2000-11-24 Nec Corp 光ファイバおよびレーザ加工機
JP2003285189A (ja) * 2002-03-26 2003-10-07 Nippon Steel Corp レーザ加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4564736A (en) * 1984-05-07 1986-01-14 General Electric Company Industrial hand held laser tool and laser system
JP3494517B2 (ja) 1995-03-17 2004-02-09 ミヤチテクノス株式会社 固体レーザ装置
US5938952A (en) * 1997-01-22 1999-08-17 Equilasers, Inc. Laser-driven microwelding apparatus and process
JP4987199B2 (ja) * 2001-09-05 2012-07-25 株式会社東芝 光伝送装置、レーザ光発生・伝送装置及びレーザ加工装置
JP3498075B2 (ja) * 2001-09-14 2004-02-16 川崎重工業株式会社 薄板のレーザ溶接用出力ヘッド
JP2003200286A (ja) * 2001-12-28 2003-07-15 Fujitsu Ltd レーザマイクロスポット溶接装置
JP4357944B2 (ja) * 2003-12-05 2009-11-04 トヨタ自動車株式会社 固体レーザ加工装置およびレーザ溶接方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08267264A (ja) * 1995-01-25 1996-10-15 Lumonics Ltd レーザシステム
JP2000321470A (ja) * 1999-05-17 2000-11-24 Nec Corp 光ファイバおよびレーザ加工機
JP2003285189A (ja) * 2002-03-26 2003-10-07 Nippon Steel Corp レーザ加工装置

Also Published As

Publication number Publication date
EP1604771A1 (en) 2005-12-14
JP3862664B2 (ja) 2006-12-27
JP2004276108A (ja) 2004-10-07
US20060201919A1 (en) 2006-09-14
US7259352B2 (en) 2007-08-21

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