WO2004104130A3 - Epoxy adhesives and bonded substrates - Google Patents

Epoxy adhesives and bonded substrates Download PDF

Info

Publication number
WO2004104130A3
WO2004104130A3 PCT/US2004/008672 US2004008672W WO2004104130A3 WO 2004104130 A3 WO2004104130 A3 WO 2004104130A3 US 2004008672 W US2004008672 W US 2004008672W WO 2004104130 A3 WO2004104130 A3 WO 2004104130A3
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy adhesives
epoxide
bonded substrates
amine
adhesives
Prior art date
Application number
PCT/US2004/008672
Other languages
French (fr)
Other versions
WO2004104130A2 (en
Inventor
Ming Cheng
Ying-Yuh Lu
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to EP04785455A priority Critical patent/EP1627024A2/en
Priority to JP2006532333A priority patent/JP2007505200A/en
Publication of WO2004104130A2 publication Critical patent/WO2004104130A2/en
Publication of WO2004104130A3 publication Critical patent/WO2004104130A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Abstract

Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about -40 °C or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
PCT/US2004/008672 2003-05-19 2004-03-19 Epoxy adhesives and bonded substrates WO2004104130A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04785455A EP1627024A2 (en) 2003-05-19 2004-03-19 Epoxy adhesives and bonded substrates
JP2006532333A JP2007505200A (en) 2003-05-19 2004-03-19 Epoxy adhesive and bonding substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/440,591 2003-05-19
US10/440,591 US7071263B2 (en) 2003-05-19 2003-05-19 Epoxy adhesives and bonded substrates

Publications (2)

Publication Number Publication Date
WO2004104130A2 WO2004104130A2 (en) 2004-12-02
WO2004104130A3 true WO2004104130A3 (en) 2005-02-03

Family

ID=33449813

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/008672 WO2004104130A2 (en) 2003-05-19 2004-03-19 Epoxy adhesives and bonded substrates

Country Status (6)

Country Link
US (1) US7071263B2 (en)
EP (1) EP1627024A2 (en)
JP (1) JP2007505200A (en)
KR (1) KR20060013667A (en)
CN (1) CN100591740C (en)
WO (1) WO2004104130A2 (en)

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US7199165B2 (en) * 2003-06-26 2007-04-03 L & L Products, Inc. Expandable material
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US7391569B2 (en) * 2004-12-29 2008-06-24 3M Innovative Properties Company Projection system including intrinsic polarizer
EP1695990A1 (en) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
US7357511B2 (en) * 2005-03-23 2008-04-15 3M Innovative Properties Company Stress birefringence compensation in polarizing beamsplitters and systems using same
US7491287B2 (en) * 2006-06-09 2009-02-17 3M Innovative Properties Company Bonding method with flowable adhesive composition
EP2181156A1 (en) * 2007-08-17 2010-05-05 Dow Global Technologies Inc. Two part crash durable epoxy adhesives
CN101925664B (en) * 2007-12-27 2013-05-29 3M创新有限公司 Urea-based pressure sensitive adhesives
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
KR20110045046A (en) * 2008-08-11 2011-05-03 다우 글로벌 테크놀로지스 엘엘씨 1-part epoxy resin structural adhesives containing elastomer tougheners capped with phenol and hydroxy-terminated acrylate or hydroxy-terminated methacrylate
KR101747980B1 (en) 2009-05-15 2017-06-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Urethane-based pressure sensitive adhesives
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
US8173745B2 (en) 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
BR112012022319B1 (en) 2010-03-04 2020-01-28 Zephyros Inc composite structural laminate
US20110294963A1 (en) * 2010-05-27 2011-12-01 Far East University Method of toughening epoxy resin and toughened epoxy resin composite
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
EP2718370A4 (en) * 2011-06-08 2015-05-27 Huntsman Adv Mat Americas Inc Curing agents providing a low ratio of thin-film cure time to gel time
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
EP3262093B1 (en) 2015-02-27 2019-01-09 3M Innovative Properties Company Two-part structural adhesive
WO2016193032A1 (en) * 2015-06-02 2016-12-08 Basf Se Diglycidyl ethers of tetrahydrofuran diglycol derivatives and oligomers thereof as curable epoxy resins
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN109689826B (en) 2016-09-14 2021-10-29 3M创新有限公司 Fast curing optical adhesives
US10752816B2 (en) * 2017-01-25 2020-08-25 Nitto Shinko Corporation Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive
CN110255568B (en) * 2019-06-28 2022-06-10 广西大学 Internal and external double-layer amino modified SiO2Aerogel synthesis method and application thereof

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EP0561048A2 (en) * 1992-03-16 1993-09-22 Hughes Aircraft Company Superior thermal transfer adhesive

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Also Published As

Publication number Publication date
JP2007505200A (en) 2007-03-08
CN1791652A (en) 2006-06-21
WO2004104130A2 (en) 2004-12-02
CN100591740C (en) 2010-02-24
KR20060013667A (en) 2006-02-13
EP1627024A2 (en) 2006-02-22
US7071263B2 (en) 2006-07-04
US20040234774A1 (en) 2004-11-25

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