WO2004108585A3 - Microelectromechanical systems having trench isolated contacts, and methods for fabricating same - Google Patents

Microelectromechanical systems having trench isolated contacts, and methods for fabricating same Download PDF

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Publication number
WO2004108585A3
WO2004108585A3 PCT/US2004/009661 US2004009661W WO2004108585A3 WO 2004108585 A3 WO2004108585 A3 WO 2004108585A3 US 2004009661 W US2004009661 W US 2004009661W WO 2004108585 A3 WO2004108585 A3 WO 2004108585A3
Authority
WO
WIPO (PCT)
Prior art keywords
mechanical structures
contact area
chamber
silicon
encapsulates
Prior art date
Application number
PCT/US2004/009661
Other languages
French (fr)
Other versions
WO2004108585A2 (en
Inventor
Aaron Partridge
Markus Lutz
Silvia Kronmueller
Original Assignee
Bosch Gmbh Robert
Aaron Partridge
Markus Lutz
Silvia Kronmueller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Aaron Partridge, Markus Lutz, Silvia Kronmueller filed Critical Bosch Gmbh Robert
Priority to JP2006509463A priority Critical patent/JP4895805B2/en
Priority to EP04785662.0A priority patent/EP1633673B1/en
Priority to CA2514230A priority patent/CA2514230C/en
Priority to EP19151217.7A priority patent/EP3527529A1/en
Publication of WO2004108585A2 publication Critical patent/WO2004108585A2/en
Publication of WO2004108585A3 publication Critical patent/WO2004108585A3/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0176—Chemical vapour Deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer

Abstract

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures (12) encapsulated in a chamber prior to final packaging and a contact area (24) disposed at least partially outside the chamber (26), the contact area (24) is electrically isolated from nearby electrically conducting regions by way of dielectric isolation trench (46) that is disposed around the contact area. The material (28) that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
PCT/US2004/009661 2003-06-04 2004-03-30 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same WO2004108585A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006509463A JP4895805B2 (en) 2003-06-04 2004-03-30 Micro-electromechanical system having contacts separated by trenches and method of manufacturing the same
EP04785662.0A EP1633673B1 (en) 2003-06-04 2004-03-30 Method for fabricating microelectromechanical systems having trench isolated contacts
CA2514230A CA2514230C (en) 2003-06-04 2004-03-30 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same
EP19151217.7A EP3527529A1 (en) 2003-06-04 2004-03-30 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/455,555 2003-06-04
US10/455,555 US6936491B2 (en) 2003-06-04 2003-06-04 Method of fabricating microelectromechanical systems and devices having trench isolated contacts

Publications (2)

Publication Number Publication Date
WO2004108585A2 WO2004108585A2 (en) 2004-12-16
WO2004108585A3 true WO2004108585A3 (en) 2005-06-02

Family

ID=33489973

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/009661 WO2004108585A2 (en) 2003-06-04 2004-03-30 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

Country Status (5)

Country Link
US (2) US6936491B2 (en)
EP (2) EP1633673B1 (en)
JP (1) JP4895805B2 (en)
CA (1) CA2514230C (en)
WO (1) WO2004108585A2 (en)

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* Cited by examiner, † Cited by third party
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