WO2004112093A3 - Method and apparatus to process substrates with megasonic energy - Google Patents

Method and apparatus to process substrates with megasonic energy Download PDF

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Publication number
WO2004112093A3
WO2004112093A3 PCT/US2004/017672 US2004017672W WO2004112093A3 WO 2004112093 A3 WO2004112093 A3 WO 2004112093A3 US 2004017672 W US2004017672 W US 2004017672W WO 2004112093 A3 WO2004112093 A3 WO 2004112093A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
energy
accordance
megasonic energy
alternative embodiment
Prior art date
Application number
PCT/US2004/017672
Other languages
French (fr)
Other versions
WO2004112093A2 (en
Inventor
Garry L Montierth
Henry R Miranda
Sharyl L Maraviov
Ahmed A Busnaina
Original Assignee
P C T Systems Inc
Garry L Montierth
Henry R Miranda
Sharyl L Maraviov
Ahmed A Busnaina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P C T Systems Inc, Garry L Montierth, Henry R Miranda, Sharyl L Maraviov, Ahmed A Busnaina filed Critical P C T Systems Inc
Priority to EP04754302A priority Critical patent/EP1635960A2/en
Publication of WO2004112093A2 publication Critical patent/WO2004112093A2/en
Publication of WO2004112093A3 publication Critical patent/WO2004112093A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/54—Control of the diagnostic device
    • A61B8/546—Control of the diagnostic device involving monitoring or regulation of device temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/91—Ultrasonic

Abstract

A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.
PCT/US2004/017672 2003-06-06 2004-06-04 Method and apparatus to process substrates with megasonic energy WO2004112093A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04754302A EP1635960A2 (en) 2003-06-06 2004-06-04 Method and apparatus to process substrates with megasonic energy

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
US47684503P 2003-06-06 2003-06-06
US47652703P 2003-06-06 2003-06-06
US60/476,527 2003-06-06
US60/476,845 2003-06-06
US51005403P 2003-10-08 2003-10-08
US60/510,054 2003-10-08
US51725503P 2003-11-03 2003-11-03
US60/517,255 2003-11-03
US52543503P 2003-11-26 2003-11-26
US60/525,435 2003-11-26
US52894103P 2003-12-10 2003-12-10
US60/528,941 2003-12-10
US53019403P 2003-12-16 2003-12-16
US60/530,194 2003-12-16
US54638304P 2004-02-20 2004-02-20
US60/546,383 2004-02-20

Publications (2)

Publication Number Publication Date
WO2004112093A2 WO2004112093A2 (en) 2004-12-23
WO2004112093A3 true WO2004112093A3 (en) 2005-11-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/017672 WO2004112093A2 (en) 2003-06-06 2004-06-04 Method and apparatus to process substrates with megasonic energy

Country Status (3)

Country Link
US (4) US7238085B2 (en)
EP (1) EP1635960A2 (en)
WO (1) WO2004112093A2 (en)

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US7238085B2 (en) 2007-07-03
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