WO2004112096A3 - Method and system for high volume transfer of dies to substrates - Google Patents

Method and system for high volume transfer of dies to substrates Download PDF

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Publication number
WO2004112096A3
WO2004112096A3 PCT/US2004/018577 US2004018577W WO2004112096A3 WO 2004112096 A3 WO2004112096 A3 WO 2004112096A3 US 2004018577 W US2004018577 W US 2004018577W WO 2004112096 A3 WO2004112096 A3 WO 2004112096A3
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WO
WIPO (PCT)
Prior art keywords
dies
substrates
die plate
transferred
web
Prior art date
Application number
PCT/US2004/018577
Other languages
French (fr)
Other versions
WO2004112096A2 (en
Inventor
Michael R Arneson
William R Bandy
Original Assignee
Symbol Technologies Inc
Michael R Arneson
William R Bandy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Symbol Technologies Inc, Michael R Arneson, William R Bandy filed Critical Symbol Technologies Inc
Priority to EP04754983A priority Critical patent/EP1642325A2/en
Publication of WO2004112096A2 publication Critical patent/WO2004112096A2/en
Publication of WO2004112096A3 publication Critical patent/WO2004112096A3/en

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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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Abstract

A method, system, and apparatus transfer of dies from wafers to substrates is described. Large quantities of dies can be transferred directly from a wafer to corresponding substrates of a web of substrates. In another aspect, large quantities of dies can be transferred from a support surface to corresponding substrates of a web of substrates. In another aspect, large quantities of dies can be transferred from a wafer or support surface to an intermediate surface, such as a die plate. The die plate may have cells formed therein in which the dies reside. Otherwise, the dies can reside on a surface of the die plate. The dies of the die plate can then be transferred to corresponding substrates of a web of substrates. A punch plate, punch roller, or expandable material can be used to transfer dies from the die plate to substrates.
PCT/US2004/018577 2003-06-12 2004-06-14 Method and system for high volume transfer of dies to substrates WO2004112096A2 (en)

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EP04754983A EP1642325A2 (en) 2003-06-12 2004-06-14 Method and system for high volume transfer of dies to substrates

Applications Claiming Priority (2)

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US47773503P 2003-06-12 2003-06-12
US60/477,735 2003-06-12

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WO2004112096A3 true WO2004112096A3 (en) 2006-08-03

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EP (1) EP1642325A2 (en)
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