WO2005010948A2 - Cleaning process and apparatus for silicate materials - Google Patents
Cleaning process and apparatus for silicate materials Download PDFInfo
- Publication number
- WO2005010948A2 WO2005010948A2 PCT/US2004/023597 US2004023597W WO2005010948A2 WO 2005010948 A2 WO2005010948 A2 WO 2005010948A2 US 2004023597 W US2004023597 W US 2004023597W WO 2005010948 A2 WO2005010948 A2 WO 2005010948A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- recited
- treating
- grit
- nozzle
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020067001653A KR101145470B1 (en) | 2003-07-24 | 2004-07-22 | Cleaning process and apparatus for silicate materials |
JP2006521240A JP4774367B2 (en) | 2003-07-24 | 2004-07-22 | Method for treating the surface of a quartz semiconductor manufacturing substrate |
CN2004800276459A CN1882714B (en) | 2003-07-24 | 2004-07-22 | Cleaning process and apparatus for silicate materials |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/627,185 US7045072B2 (en) | 2003-07-24 | 2003-07-24 | Cleaning process and apparatus for silicate materials |
US10/627,185 | 2003-07-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005010948A2 true WO2005010948A2 (en) | 2005-02-03 |
WO2005010948A3 WO2005010948A3 (en) | 2005-09-15 |
Family
ID=34080589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/023597 WO2005010948A2 (en) | 2003-07-24 | 2004-07-22 | Cleaning process and apparatus for silicate materials |
Country Status (7)
Country | Link |
---|---|
US (2) | US7045072B2 (en) |
JP (1) | JP4774367B2 (en) |
KR (1) | KR101145470B1 (en) |
CN (2) | CN101901743B (en) |
SG (1) | SG145688A1 (en) |
TW (1) | TWI251873B (en) |
WO (1) | WO2005010948A2 (en) |
Families Citing this family (25)
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US20050161061A1 (en) * | 2003-09-17 | 2005-07-28 | Hong Shih | Methods for cleaning a set of structures comprising yttrium oxide in a plasma processing system |
US7754609B1 (en) | 2003-10-28 | 2010-07-13 | Applied Materials, Inc. | Cleaning processes for silicon carbide materials |
US7846349B2 (en) * | 2004-12-22 | 2010-12-07 | Applied Materials, Inc. | Solution for the selective removal of metal from aluminum substrates |
DE102005005196B4 (en) * | 2005-02-03 | 2009-04-23 | Heraeus Quarzglas Gmbh & Co. Kg | Method for producing a component made of quartz glass for use in semiconductor production and component obtained by the method |
US7514125B2 (en) * | 2006-06-23 | 2009-04-07 | Applied Materials, Inc. | Methods to improve the in-film defectivity of PECVD amorphous carbon films |
US7789969B2 (en) * | 2006-11-01 | 2010-09-07 | Applied Materials, Inc. | Methods and apparatus for cleaning chamber components |
WO2009086023A2 (en) * | 2007-12-19 | 2009-07-09 | Applied Materials, Inc. | Methods for cleaning process kits and chambers, and for ruthenium recovery |
US8398779B2 (en) * | 2009-03-02 | 2013-03-19 | Applied Materials, Inc. | Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates |
CN103451748B (en) * | 2012-05-28 | 2016-01-13 | 中国科学院宁波材料技术与工程研究所 | A kind of cleaning method of polyacrylonitrile fibril spinning spinneret |
US9517873B1 (en) | 2012-09-28 | 2016-12-13 | Air Liquide Electronics U.S. Lp | Clean storage packaging article and method for making and using |
CN103011611B (en) * | 2012-12-24 | 2017-03-15 | 上海申和热磁电子有限公司 | A kind of surface treatment method of quasiconductor quartz |
US20160017263A1 (en) * | 2013-03-14 | 2016-01-21 | Applied Materials, Inc. | Wet cleaning of a chamber component |
US9561982B2 (en) * | 2013-04-30 | 2017-02-07 | Corning Incorporated | Method of cleaning glass substrates |
WO2014208353A1 (en) * | 2013-06-24 | 2014-12-31 | 三菱電機株式会社 | Method for producing substrate for solar photovoltaic power generators and apparatus for producing substrate for solar photovoltaic power generators |
CN104419236A (en) * | 2013-08-29 | 2015-03-18 | 江苏远大光学科技有限公司 | Lens treating liquid medicine |
CN104423063A (en) * | 2013-08-29 | 2015-03-18 | 江苏远大光学科技有限公司 | Glasses lens treatment method |
KR101529571B1 (en) * | 2014-02-20 | 2015-06-18 | 주식회사 원익큐엔씨 | Surface treatment for quartz materials, composition for surface treatment of quartz materials and quartz materials manufactured by the same |
KR101606793B1 (en) * | 2014-08-04 | 2016-03-28 | 주식회사 원익큐엔씨 | Surface treatment for quartz jigs for cvd, composition for surface treatment of quartz jigs and quartz jigs manufactured by the same |
DE102014216325A1 (en) * | 2014-08-18 | 2016-02-18 | Wacker Chemie Ag | Process for producing polycrystalline silicon |
US9406534B2 (en) * | 2014-09-17 | 2016-08-02 | Lam Research Corporation | Wet clean process for cleaning plasma processing chamber components |
CN104465415A (en) * | 2014-11-28 | 2015-03-25 | 上海华力微电子有限公司 | Method for overcoming peeling defect |
CN106971969A (en) * | 2017-05-11 | 2017-07-21 | 济源石晶光电频率技术有限公司 | Quartz wafer decontamination plant and quartz wafer decontamination method |
CA3166638A1 (en) | 2019-12-31 | 2021-07-08 | Cold Jet, Llc | Method and apparatus for enhanced blast stream |
CN113770100A (en) * | 2020-07-15 | 2021-12-10 | 英迪那米(徐州)半导体科技有限公司 | Semiconductor part cleaning process |
CN113149450A (en) * | 2021-05-11 | 2021-07-23 | 沈阳偶得科技有限公司 | Method for manufacturing hill-shaped surface by quartz product in LPCVD (low pressure chemical vapor deposition) process |
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US20030096562A1 (en) * | 2001-04-11 | 2003-05-22 | Olympus Optical Co., Ltd. | Polishing apparatus, polishing method, control program for causing computer to execute polishing, and recording medium |
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-
2003
- 2003-07-24 US US10/627,185 patent/US7045072B2/en not_active Expired - Lifetime
-
2004
- 2004-07-22 SG SG200805490-0A patent/SG145688A1/en unknown
- 2004-07-22 CN CN201010151738XA patent/CN101901743B/en active Active
- 2004-07-22 JP JP2006521240A patent/JP4774367B2/en active Active
- 2004-07-22 CN CN2004800276459A patent/CN1882714B/en active Active
- 2004-07-22 WO PCT/US2004/023597 patent/WO2005010948A2/en active Application Filing
- 2004-07-22 KR KR1020067001653A patent/KR101145470B1/en active IP Right Grant
- 2004-07-26 TW TW093122255A patent/TWI251873B/en active
-
2005
- 2005-02-17 US US11/061,013 patent/US7452475B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4957583A (en) * | 1989-04-28 | 1990-09-18 | Analog Devices, Inc. | Apparatus for etching patterned substrates |
US6368410B1 (en) * | 1999-06-28 | 2002-04-09 | General Electric Company | Semiconductor processing article |
US20030096562A1 (en) * | 2001-04-11 | 2003-05-22 | Olympus Optical Co., Ltd. | Polishing apparatus, polishing method, control program for causing computer to execute polishing, and recording medium |
Also Published As
Publication number | Publication date |
---|---|
CN101901743A (en) | 2010-12-01 |
TWI251873B (en) | 2006-03-21 |
SG145688A1 (en) | 2008-09-29 |
CN101901743B (en) | 2012-09-19 |
US20050167393A1 (en) | 2005-08-04 |
CN1882714A (en) | 2006-12-20 |
US20050016958A1 (en) | 2005-01-27 |
US7045072B2 (en) | 2006-05-16 |
JP4774367B2 (en) | 2011-09-14 |
US7452475B2 (en) | 2008-11-18 |
JP2006528841A (en) | 2006-12-21 |
KR20060114680A (en) | 2006-11-07 |
WO2005010948A3 (en) | 2005-09-15 |
TW200516656A (en) | 2005-05-16 |
CN1882714B (en) | 2010-06-16 |
KR101145470B1 (en) | 2012-05-15 |
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