WO2005018864A3 - Capillary with contained inner chamfer - Google Patents

Capillary with contained inner chamfer Download PDF

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Publication number
WO2005018864A3
WO2005018864A3 PCT/US2004/023657 US2004023657W WO2005018864A3 WO 2005018864 A3 WO2005018864 A3 WO 2005018864A3 US 2004023657 W US2004023657 W US 2004023657W WO 2005018864 A3 WO2005018864 A3 WO 2005018864A3
Authority
WO
WIPO (PCT)
Prior art keywords
capillary
bonding
working tip
inner chamfer
annular chamfer
Prior art date
Application number
PCT/US2004/023657
Other languages
French (fr)
Other versions
WO2005018864A2 (en
WO2005018864A8 (en
WO2005018864B1 (en
Inventor
Gil Perlberg
Arie Bahalul
Dan Mironescu
Moshe Amsalem
Jon Brunner
Original Assignee
Kulicke & Soffa Investments
Gil Perlberg
Arie Bahalul
Dan Mironescu
Moshe Amsalem
Jon Brunner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Investments, Gil Perlberg, Arie Bahalul, Dan Mironescu, Moshe Amsalem, Jon Brunner filed Critical Kulicke & Soffa Investments
Priority to JP2005518338A priority Critical patent/JP2006512788A/en
Priority to KR20047015437A priority patent/KR100668491B1/en
Publication of WO2005018864A2 publication Critical patent/WO2005018864A2/en
Publication of WO2005018864A3 publication Critical patent/WO2005018864A3/en
Publication of WO2005018864A8 publication Critical patent/WO2005018864A8/en
Publication of WO2005018864B1 publication Critical patent/WO2005018864B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/32—Wires
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/4845—Details of ball bonds
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    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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Abstract

A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip (404) at an end thereof. The working tip includes an annular chamfer (413) formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle (414) of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed (424) in the bonding tool.
PCT/US2004/023657 2003-08-12 2004-07-22 Capillary with contained inner chamfer WO2005018864A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005518338A JP2006512788A (en) 2003-08-12 2004-07-22 Capillary with internal bevel
KR20047015437A KR100668491B1 (en) 2003-08-12 2004-07-22 Capillary with contained inner chamfer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/639,302 US6910612B2 (en) 2001-07-17 2003-08-12 Capillary with contained inner chamfer
US10/639,302 2003-08-12

Publications (4)

Publication Number Publication Date
WO2005018864A2 WO2005018864A2 (en) 2005-03-03
WO2005018864A3 true WO2005018864A3 (en) 2005-04-28
WO2005018864A8 WO2005018864A8 (en) 2005-06-23
WO2005018864B1 WO2005018864B1 (en) 2005-07-28

Family

ID=34216321

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/023657 WO2005018864A2 (en) 2003-08-12 2004-07-22 Capillary with contained inner chamfer

Country Status (7)

Country Link
US (2) US6910612B2 (en)
JP (1) JP2006512788A (en)
KR (1) KR100668491B1 (en)
CN (1) CN100540200C (en)
MY (1) MY128845A (en)
TW (1) TW200507123A (en)
WO (1) WO2005018864A2 (en)

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US6910612B2 (en) * 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
US7249702B2 (en) * 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7407080B2 (en) * 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
US7320425B2 (en) * 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
US7597231B2 (en) * 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps
US20080314963A1 (en) * 2006-07-03 2008-12-25 Kulicke And Soffa Industries, Inc. Bonding Tool With Improved Finish
JP5893266B2 (en) * 2011-05-13 2016-03-23 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
US20130213552A1 (en) * 2012-02-20 2013-08-22 Branson Ultrasonics Corporation Vibratory welder having low thermal conductivity tool
JP5510691B2 (en) * 2012-09-26 2014-06-04 Ｔｏｔｏ株式会社 Bonding capillary
US9093515B2 (en) 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) * 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) * 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
CN109890514A (en) * 2016-07-26 2019-06-14 莫列斯有限公司 Capillary suitable for droplet generator
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
CN107301989A (en) * 2017-06-06 2017-10-27 深圳国民飞骧科技有限公司 A kind of method for determining bonding wire chip surface pad spacing

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JPH11186315A (en) * 1997-12-19 1999-07-09 Hitachi Ltd Wire-bonding device and manufacture of semiconductor device using thereof
US6325269B1 (en) * 1997-12-19 2001-12-04 Toto Ltd. Wire bonding capillary
US20030015567A1 (en) * 2001-07-17 2003-01-23 Gil Perlberg Ultra fine pitch capillary
US20040094606A1 (en) * 2001-07-17 2004-05-20 Gil Perlberg Capillary with contained inner chamfer

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CN100540200C (en) 2009-09-16
US20040094606A1 (en) 2004-05-20
WO2005018864A2 (en) 2005-03-03
WO2005018864A8 (en) 2005-06-23
US20050121494A1 (en) 2005-06-09
JP2006512788A (en) 2006-04-13
MY128845A (en) 2007-02-28
KR100668491B1 (en) 2007-01-16
CN1717294A (en) 2006-01-04
US6910612B2 (en) 2005-06-28
TW200507123A (en) 2005-02-16
US7004369B2 (en) 2006-02-28
KR20040099374A (en) 2004-11-26
WO2005018864B1 (en) 2005-07-28

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