WO2005034198A3 - Methods and apparatus for an led light engine - Google Patents

Methods and apparatus for an led light engine Download PDF

Info

Publication number
WO2005034198A3
WO2005034198A3 PCT/US2004/032397 US2004032397W WO2005034198A3 WO 2005034198 A3 WO2005034198 A3 WO 2005034198A3 US 2004032397 W US2004032397 W US 2004032397W WO 2005034198 A3 WO2005034198 A3 WO 2005034198A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
led
light engine
led light
methods
Prior art date
Application number
PCT/US2004/032397
Other languages
French (fr)
Other versions
WO2005034198A2 (en
Inventor
Der Jeou Chou
Daniel Nelson
Thomas Kulaga
Original Assignee
Enertron Inc
Der Jeou Chou
Daniel Nelson
Thomas Kulaga
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enertron Inc, Der Jeou Chou, Daniel Nelson, Thomas Kulaga filed Critical Enertron Inc
Priority to JP2006528332A priority Critical patent/JP2007507115A/en
Publication of WO2005034198A2 publication Critical patent/WO2005034198A2/en
Publication of WO2005034198A3 publication Critical patent/WO2005034198A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/041—Optical design with conical or pyramidal surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

An LED light engine comprising a high thermal conductivity substrate (e.g., a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e.g., optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e.g., a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e.g., a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.
PCT/US2004/032397 2003-10-01 2004-09-30 Methods and apparatus for an led light engine WO2005034198A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006528332A JP2007507115A (en) 2003-10-01 2004-09-30 Method and apparatus for LED light engine

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US50785803P 2003-10-01 2003-10-01
US60/507,858 2003-10-01
US54074304P 2004-01-30 2004-01-30
US60/540,743 2004-01-30
US10/924,389 US6942360B2 (en) 2003-10-01 2004-08-23 Methods and apparatus for an LED light engine
US10/924,389 2004-08-23

Publications (2)

Publication Number Publication Date
WO2005034198A2 WO2005034198A2 (en) 2005-04-14
WO2005034198A3 true WO2005034198A3 (en) 2005-06-09

Family

ID=34397030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/032397 WO2005034198A2 (en) 2003-10-01 2004-09-30 Methods and apparatus for an led light engine

Country Status (6)

Country Link
US (2) US6942360B2 (en)
JP (1) JP2007507115A (en)
KR (1) KR20060066742A (en)
CN (1) CN1605790B (en)
TW (1) TWI245103B (en)
WO (1) WO2005034198A2 (en)

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