WO2005035136A3 - Method and apparatus for dispensing a rinse solution on a substrate - Google Patents
Method and apparatus for dispensing a rinse solution on a substrate Download PDFInfo
- Publication number
- WO2005035136A3 WO2005035136A3 PCT/US2004/018927 US2004018927W WO2005035136A3 WO 2005035136 A3 WO2005035136 A3 WO 2005035136A3 US 2004018927 W US2004018927 W US 2004018927W WO 2005035136 A3 WO2005035136 A3 WO 2005035136A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rinse solution
- substrate
- nozzle array
- dispensing
- nozzle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2004800118987A CN1852778B (en) | 2003-09-30 | 2004-07-09 | Method and apparatus for dispensing a rinse solution on a substrate |
JP2006533789A JP4713483B2 (en) | 2003-09-30 | 2004-07-09 | Method and apparatus for dispensing a rinsing solution on a substrate. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/673,254 | 2003-09-30 | ||
US10/673,254 US7431040B2 (en) | 2003-09-30 | 2003-09-30 | Method and apparatus for dispensing a rinse solution on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005035136A2 WO2005035136A2 (en) | 2005-04-21 |
WO2005035136A3 true WO2005035136A3 (en) | 2006-01-26 |
Family
ID=34376571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/018927 WO2005035136A2 (en) | 2003-09-30 | 2004-07-09 | Method and apparatus for dispensing a rinse solution on a substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US7431040B2 (en) |
JP (1) | JP4713483B2 (en) |
KR (1) | KR101002383B1 (en) |
CN (1) | CN1852778B (en) |
TW (1) | TWI251868B (en) |
WO (1) | WO2005035136A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101610852B (en) * | 2007-02-08 | 2012-07-04 | Abb株式会社 | Air atomization coating device |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8277569B2 (en) * | 2004-07-01 | 2012-10-02 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus and substrate treating method |
US8480810B2 (en) * | 2005-12-30 | 2013-07-09 | Lam Research Corporation | Method and apparatus for particle removal |
JP2007222755A (en) * | 2006-02-22 | 2007-09-06 | Hoya Corp | Spin washing device and spin washing method |
JP4755573B2 (en) * | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | Processing apparatus and processing method, and surface treatment jig |
JP2010153809A (en) * | 2008-11-26 | 2010-07-08 | Sumco Corp | Method of making uniform distribution of layer of predetermined thickness formed on silicon wafer and, and method of making uniform distribution of thickness of the silicon wafer |
JP2011124343A (en) * | 2009-12-09 | 2011-06-23 | Tokyo Electron Ltd | Substrate processing apparatus, substrate processing method, and recording medium with recorded program for implementing the substrate processing method |
US8707974B2 (en) | 2009-12-11 | 2014-04-29 | United Microelectronics Corp. | Wafer cleaning device |
CN104624545A (en) * | 2009-12-24 | 2015-05-20 | 联华电子股份有限公司 | Wafer washing device and method |
US20110160919A1 (en) * | 2009-12-30 | 2011-06-30 | Orr David C | Mobile fluid delivery control system and method |
KR101412767B1 (en) * | 2010-08-19 | 2014-07-02 | 주식회사 엘지화학 | Apparatus for supplying fluid and system and method for cleaning thin film utilizing thereof |
CN102416391A (en) * | 2011-11-17 | 2012-04-18 | 北京七星华创电子股份有限公司 | Device and method for cleaning surface of wafer |
US20130284093A1 (en) * | 2012-04-30 | 2013-10-31 | Semes Co., Ltd. | Substrate treating apparatus |
CN106065495B (en) * | 2016-08-17 | 2018-10-23 | 上海大族新能源科技有限公司 | Diffusion source device |
US11369979B2 (en) * | 2017-08-10 | 2022-06-28 | Church & Dwight Co., Inc. | High impact spray nozzle |
CN111081585B (en) * | 2018-10-18 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Spray device and cleaning equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030005948A1 (en) * | 2001-05-31 | 2003-01-09 | M-Fsi Ltd. | Substrate Cleaning apparatus |
US20030168089A1 (en) * | 1999-10-06 | 2003-09-11 | Ichiro Katakabe | Method of and apparatus for cleaning substrate |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63164217A (en) * | 1986-12-26 | 1988-07-07 | Toshiba Corp | Method and apparatus for developing photoresist film |
JPH04128763A (en) * | 1990-09-19 | 1992-04-30 | Fujitsu Ltd | Resist developing device and method thereof |
JPH06267837A (en) * | 1993-03-16 | 1994-09-22 | Oki Electric Ind Co Ltd | Treatment liquid coater and its method |
JP3504023B2 (en) * | 1995-05-26 | 2004-03-08 | 株式会社ルネサステクノロジ | Cleaning device and cleaning method |
JPH0969509A (en) * | 1995-09-01 | 1997-03-11 | Matsushita Electron Corp | Cleaning/etching/drying system for semiconductor wafer and using method thereof |
US5975098A (en) * | 1995-12-21 | 1999-11-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of cleaning substrate |
KR100282160B1 (en) * | 1996-05-07 | 2001-03-02 | 가야시마 고조 | Substrate treatment device and processing method |
JP3183214B2 (en) * | 1997-05-26 | 2001-07-09 | 日本電気株式会社 | Cleaning method and cleaning device |
JPH11195635A (en) * | 1998-01-05 | 1999-07-21 | Rohm Co Ltd | Semiconductor wafer cleaning and drying device |
JP3563605B2 (en) * | 1998-03-16 | 2004-09-08 | 東京エレクトロン株式会社 | Processing equipment |
JP3612231B2 (en) * | 1999-02-10 | 2005-01-19 | 東京エレクトロン株式会社 | Nozzle device and developing method |
US6758938B1 (en) * | 1999-08-31 | 2004-07-06 | Micron Technology, Inc. | Delivery of dissolved ozone |
JP3953265B2 (en) * | 1999-10-06 | 2007-08-08 | 株式会社荏原製作所 | Substrate cleaning method and apparatus |
TW480612B (en) * | 1999-10-19 | 2002-03-21 | Steag Micro Tech Gmbh | Device and method for cleaning substrates |
US6688784B1 (en) * | 2000-10-25 | 2004-02-10 | Advanced Micro Devices, Inc. | Parallel plate development with multiple holes in top plate for control of developer flow and pressure |
KR100405449B1 (en) * | 2000-10-30 | 2003-11-15 | 삼성전자주식회사 | Cleaning apparatus for semiconducter wafer |
JP2002176026A (en) * | 2000-12-05 | 2002-06-21 | Ses Co Ltd | Method and device for single substrate cleaning |
JP3899854B2 (en) * | 2001-06-22 | 2007-03-28 | 松下電器産業株式会社 | Development method |
JP2003007664A (en) * | 2001-06-22 | 2003-01-10 | Ses Co Ltd | Method and apparatus for cleaning single wafer |
KR100418324B1 (en) * | 2001-12-01 | 2004-02-14 | 한국디엔에스 주식회사 | Wafer dryer for semiconductor cleaning apparatus |
US6770424B2 (en) * | 2002-12-16 | 2004-08-03 | Asml Holding N.V. | Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms |
-
2003
- 2003-09-30 US US10/673,254 patent/US7431040B2/en not_active Expired - Fee Related
-
2004
- 2004-07-09 KR KR1020067002075A patent/KR101002383B1/en not_active IP Right Cessation
- 2004-07-09 JP JP2006533789A patent/JP4713483B2/en not_active Expired - Fee Related
- 2004-07-09 CN CN2004800118987A patent/CN1852778B/en not_active Expired - Fee Related
- 2004-07-09 WO PCT/US2004/018927 patent/WO2005035136A2/en active Application Filing
- 2004-09-30 TW TW093129682A patent/TWI251868B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030168089A1 (en) * | 1999-10-06 | 2003-09-11 | Ichiro Katakabe | Method of and apparatus for cleaning substrate |
US20030005948A1 (en) * | 2001-05-31 | 2003-01-09 | M-Fsi Ltd. | Substrate Cleaning apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101610852B (en) * | 2007-02-08 | 2012-07-04 | Abb株式会社 | Air atomization coating device |
Also Published As
Publication number | Publication date |
---|---|
KR101002383B1 (en) | 2010-12-20 |
TW200522159A (en) | 2005-07-01 |
JP4713483B2 (en) | 2011-06-29 |
CN1852778A (en) | 2006-10-25 |
CN1852778B (en) | 2010-10-06 |
US20050067000A1 (en) | 2005-03-31 |
WO2005035136A2 (en) | 2005-04-21 |
TWI251868B (en) | 2006-03-21 |
JP2007507884A (en) | 2007-03-29 |
US7431040B2 (en) | 2008-10-07 |
KR20060061806A (en) | 2006-06-08 |
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