WO2005036314A3 - Method and system of diagnosing a processing system using adaptive multivariate analysis - Google Patents

Method and system of diagnosing a processing system using adaptive multivariate analysis Download PDF

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Publication number
WO2005036314A3
WO2005036314A3 PCT/US2004/025599 US2004025599W WO2005036314A3 WO 2005036314 A3 WO2005036314 A3 WO 2005036314A3 US 2004025599 W US2004025599 W US 2004025599W WO 2005036314 A3 WO2005036314 A3 WO 2005036314A3
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WO
WIPO (PCT)
Prior art keywords
data
processing system
diagnosing
additional
pca
Prior art date
Application number
PCT/US2004/025599
Other languages
French (fr)
Other versions
WO2005036314A2 (en
Inventor
Kevin Andrew Chamness
Original Assignee
Tokyo Electron Ltd
Kevin Andrew Chamness
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Kevin Andrew Chamness filed Critical Tokyo Electron Ltd
Priority to JP2006526083A priority Critical patent/JP4699367B2/en
Priority to EP04809545A priority patent/EP1665076A4/en
Priority to KR1020067005122A priority patent/KR101047971B1/en
Publication of WO2005036314A2 publication Critical patent/WO2005036314A2/en
Publication of WO2005036314A3 publication Critical patent/WO2005036314A3/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations

Abstract

A method and system of monitoring a processing system and for processing a substrate during the course of semiconductor manufacturing. As such, data is acquired from the processing system for a plurality of observations (510), the data including a plurality of data parameters. A principal components analysis (PCA) model is constructed from the data and includes centering coefficients (520). Additional data is acquired from the processing system (550), the additional data including an additional observation of the plurality of data parameters. The centering coefficients are adjusted to produce updated adaptive centering coefficients for each of the data parameters in the PCA model. The updated adaptive centering coefficients are applied to each of the data parameters in the PCA model (560). At least one statistical quantity is determined from the additional data using the PCA model (560). A control limit is set for the statistical quantity (570) and compared to the statistical quantity (580).
PCT/US2004/025599 2003-09-12 2004-08-27 Method and system of diagnosing a processing system using adaptive multivariate analysis WO2005036314A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006526083A JP4699367B2 (en) 2003-09-12 2004-08-27 Method and apparatus for diagnosing processing equipment using adaptive multivariable analysis
EP04809545A EP1665076A4 (en) 2003-09-12 2004-08-27 Method and system of diagnosing a processing system using adaptive multivariate analysis
KR1020067005122A KR101047971B1 (en) 2003-09-12 2004-08-27 Diagnostic Method and Apparatus for Processing Systems Using Adaptive Multivariate Analysis

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/660,697 2003-09-12
US10/660,697 US7328126B2 (en) 2003-09-12 2003-09-12 Method and system of diagnosing a processing system using adaptive multivariate analysis

Publications (2)

Publication Number Publication Date
WO2005036314A2 WO2005036314A2 (en) 2005-04-21
WO2005036314A3 true WO2005036314A3 (en) 2005-11-10

Family

ID=34273706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/025599 WO2005036314A2 (en) 2003-09-12 2004-08-27 Method and system of diagnosing a processing system using adaptive multivariate analysis

Country Status (7)

Country Link
US (1) US7328126B2 (en)
EP (1) EP1665076A4 (en)
JP (1) JP4699367B2 (en)
KR (1) KR101047971B1 (en)
CN (1) CN100476798C (en)
TW (1) TWI261738B (en)
WO (1) WO2005036314A2 (en)

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Also Published As

Publication number Publication date
WO2005036314A2 (en) 2005-04-21
US7328126B2 (en) 2008-02-05
TW200515112A (en) 2005-05-01
CN1849599A (en) 2006-10-18
CN100476798C (en) 2009-04-08
KR20060123098A (en) 2006-12-01
EP1665076A4 (en) 2007-06-20
KR101047971B1 (en) 2011-07-13
TWI261738B (en) 2006-09-11
EP1665076A2 (en) 2006-06-07
JP4699367B2 (en) 2011-06-08
US20050060103A1 (en) 2005-03-17
JP2007505494A (en) 2007-03-08

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