WO2005038761A3 - Heat spreader for display device - Google Patents
Heat spreader for display device Download PDFInfo
- Publication number
- WO2005038761A3 WO2005038761A3 PCT/US2004/031367 US2004031367W WO2005038761A3 WO 2005038761 A3 WO2005038761 A3 WO 2005038761A3 US 2004031367 W US2004031367 W US 2004031367W WO 2005038761 A3 WO2005038761 A3 WO 2005038761A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- display device
- heat spreader
- surface area
- light emitting
- liquid crystal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/24—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/66—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
- Y10T428/1314—Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES04789001T ES2400183T3 (en) | 2003-10-14 | 2004-09-24 | Display device with heat diffuser |
EP12175440.2A EP2528424B1 (en) | 2003-10-14 | 2004-09-24 | Display device with heat spreader |
EP04789001A EP1673754B1 (en) | 2003-10-14 | 2004-09-24 | Display device with heat spreader |
PL04789001T PL1673754T3 (en) | 2003-10-14 | 2004-09-24 | Display device with heat spreader |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/685,103 US7138029B2 (en) | 2003-10-14 | 2003-10-14 | Heat spreader for plasma display panel |
US10/685,103 | 2003-10-14 | ||
US10/844,537 | 2004-05-12 | ||
US10/844,537 US7150914B2 (en) | 2003-10-14 | 2004-05-12 | Heat spreader for emissive display device |
US10/897,308 | 2004-07-22 | ||
US10/897,308 US7160619B2 (en) | 2003-10-14 | 2004-07-22 | Heat spreader for emissive display device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005038761A2 WO2005038761A2 (en) | 2005-04-28 |
WO2005038761A3 true WO2005038761A3 (en) | 2005-10-06 |
Family
ID=34468387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/031367 WO2005038761A2 (en) | 2003-10-14 | 2004-09-24 | Heat spreader for display device |
Country Status (7)
Country | Link |
---|---|
US (2) | US7160619B2 (en) |
EP (4) | EP2242346B1 (en) |
JP (3) | JP2005250441A (en) |
AT (1) | ATE540567T1 (en) |
ES (3) | ES2426252T3 (en) |
PL (3) | PL2242346T3 (en) |
WO (1) | WO2005038761A2 (en) |
Families Citing this family (44)
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US20070164424A1 (en) * | 2003-04-02 | 2007-07-19 | Nancy Dean | Thermal interconnect and interface systems, methods of production and uses thereof |
US7160619B2 (en) | 2003-10-14 | 2007-01-09 | Advanced Energy Technology Inc. | Heat spreader for emissive display device |
US7276273B2 (en) * | 2003-10-14 | 2007-10-02 | Advanced Energy Technology Inc. | Heat spreader for display device |
US7150914B2 (en) | 2003-10-14 | 2006-12-19 | Advanced Energy Technology Inc. | Heat spreader for emissive display device |
US20060070720A1 (en) * | 2004-09-17 | 2006-04-06 | Capp Joseph P | Heat riser |
US7799428B2 (en) * | 2004-10-06 | 2010-09-21 | Graftech International Holdings Inc. | Sandwiched thermal solution |
KR100696501B1 (en) * | 2005-03-23 | 2007-03-19 | 삼성에스디아이 주식회사 | Plasma display apparatus |
KR100696517B1 (en) * | 2005-05-02 | 2007-03-19 | 삼성에스디아이 주식회사 | Structure for heat dissipation of integrated circuit chip of plasma display module and plasma display module comprising the same |
US9104058B2 (en) * | 2005-06-27 | 2015-08-11 | Graftech International Holdings Inc. | Optimized frame system for a liquid crystal display device |
US9087669B2 (en) | 2005-06-27 | 2015-07-21 | Graftech International Holdings Inc. | Display device having improved properties |
US9081220B2 (en) | 2005-06-27 | 2015-07-14 | Graftech International Holdings Inc. | Optimized frame system for a display device |
US7365988B2 (en) * | 2005-11-04 | 2008-04-29 | Graftech International Holdings Inc. | Cycling LED heat spreader |
US20110091713A1 (en) * | 2005-12-21 | 2011-04-21 | Miller Douglas J | Fire Resistant Composite Panel |
KR100760770B1 (en) * | 2006-03-29 | 2007-09-21 | 삼성에스디아이 주식회사 | Plasma display device |
JP4730180B2 (en) * | 2006-04-07 | 2011-07-20 | パナソニック株式会社 | Cooling system |
JP4977424B2 (en) * | 2006-09-28 | 2012-07-18 | 株式会社カネカ | Graphite composite film |
US9795059B2 (en) | 2007-11-05 | 2017-10-17 | Laird Technologies, Inc. | Thermal interface materials with thin film or metallization |
US8230690B1 (en) | 2008-05-20 | 2012-07-31 | Nader Salessi | Modular LED lamp |
US10012375B1 (en) | 2008-05-20 | 2018-07-03 | Nader Salessi | Modular LED lamp |
JP5271879B2 (en) * | 2008-11-28 | 2013-08-21 | 富士高分子工業株式会社 | Thermal diffusion sheet and mounting method thereof |
US8955580B2 (en) | 2009-08-14 | 2015-02-17 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
TW201035513A (en) * | 2009-03-25 | 2010-10-01 | Wah Hong Ind Corp | Method for manufacturing heat dissipation interface device and product thereof |
US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US7965514B2 (en) | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US8081468B2 (en) * | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
JP5422664B2 (en) | 2009-10-21 | 2014-02-19 | パナソニック株式会社 | Acoustic signal processing apparatus, acoustic encoding apparatus, and acoustic decoding apparatus |
JP2011213583A (en) * | 2010-03-15 | 2011-10-27 | Sekisui Chem Co Ltd | Method for producing graphite intercalation compound |
DE102011081149A1 (en) * | 2011-08-17 | 2013-02-21 | Sgl Carbon Se | Heat sink and electrical energy storage |
US9797664B2 (en) * | 2012-02-20 | 2017-10-24 | Neograf Solutions, Llc | Composite heat spreader and battery module incorporating the same |
US9363932B2 (en) | 2012-06-11 | 2016-06-07 | Nanotek Instruments, Inc. | Integrated graphene film heat spreader for display devices |
US9899120B2 (en) | 2012-11-02 | 2018-02-20 | Nanotek Instruments, Inc. | Graphene oxide-coated graphitic foil and processes for producing same |
US9533889B2 (en) | 2012-11-26 | 2017-01-03 | Nanotek Instruments, Inc. | Unitary graphene layer or graphene single crystal |
KR20140093457A (en) * | 2013-01-18 | 2014-07-28 | 엘지전자 주식회사 | Heat discharging sheet |
US10566482B2 (en) | 2013-01-31 | 2020-02-18 | Global Graphene Group, Inc. | Inorganic coating-protected unitary graphene material for concentrated photovoltaic applications |
US10087073B2 (en) | 2013-02-14 | 2018-10-02 | Nanotek Instruments, Inc. | Nano graphene platelet-reinforced composite heat sinks and process for producing same |
EP2790474B1 (en) | 2013-04-09 | 2016-03-16 | Harman Becker Automotive Systems GmbH | Thermoelectric cooler/heater integrated in printed circuit board |
WO2016077683A1 (en) | 2014-11-14 | 2016-05-19 | Laird Technologies, Inc. | Solderable two piece board level shields |
US10744736B2 (en) | 2015-06-12 | 2020-08-18 | Neograf Solutions, Llc | Graphite composites and thermal management systems |
WO2017044712A1 (en) | 2015-09-11 | 2017-03-16 | Laird Technologies, Inc. | Devices for absorbing energy from electronic components |
US10193030B2 (en) | 2016-08-08 | 2019-01-29 | General Electric Company | Composite materials having red emitting phosphors |
KR20180052810A (en) * | 2016-11-10 | 2018-05-21 | 삼성디스플레이 주식회사 | Cover window for display device and display device comprising the same |
JP6899600B2 (en) | 2018-06-05 | 2021-07-07 | 株式会社大木工藝 | Sheet material for interior materials |
CN109713153B (en) * | 2018-11-21 | 2020-07-24 | 云谷(固安)科技有限公司 | Organic light emitting diode unit, display panel and preparation method thereof |
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-
2004
- 2004-07-22 US US10/897,308 patent/US7160619B2/en not_active Expired - Lifetime
- 2004-09-24 PL PL10166718T patent/PL2242346T3/en unknown
- 2004-09-24 ES ES11191427T patent/ES2426252T3/en active Active
- 2004-09-24 AT AT10166718T patent/ATE540567T1/en active
- 2004-09-24 EP EP10166718A patent/EP2242346B1/en not_active Revoked
- 2004-09-24 WO PCT/US2004/031367 patent/WO2005038761A2/en active Application Filing
- 2004-09-24 EP EP11191427.1A patent/EP2434857B1/en not_active Revoked
- 2004-09-24 PL PL11191427T patent/PL2434857T3/en unknown
- 2004-09-24 EP EP12175440.2A patent/EP2528424B1/en active Active
- 2004-09-24 PL PL04789001T patent/PL1673754T3/en unknown
- 2004-09-24 EP EP04789001A patent/EP1673754B1/en active Active
- 2004-09-24 ES ES04789001T patent/ES2400183T3/en active Active
- 2004-09-24 ES ES10166718T patent/ES2379769T3/en active Active
- 2004-10-14 JP JP2004300426A patent/JP2005250441A/en active Pending
-
2006
- 2006-12-18 US US11/590,115 patent/US7658999B2/en not_active Expired - Lifetime
-
2007
- 2007-10-22 JP JP2007273903A patent/JP2008102527A/en active Pending
-
2008
- 2008-08-08 JP JP2008205218A patent/JP2009042761A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
US5773133A (en) * | 1995-07-19 | 1998-06-30 | Sony Corporation | Magnetic recording medium |
US6060166A (en) * | 1998-02-05 | 2000-05-09 | Raytheon Company | Flexible graphite fiber thermal shunt |
US6075701A (en) * | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
Also Published As
Publication number | Publication date |
---|---|
JP2005250441A (en) | 2005-09-15 |
JP2008102527A (en) | 2008-05-01 |
EP2242346B1 (en) | 2012-01-04 |
WO2005038761A2 (en) | 2005-04-28 |
JP2009042761A (en) | 2009-02-26 |
US7658999B2 (en) | 2010-02-09 |
US20050079304A1 (en) | 2005-04-14 |
EP2434857A1 (en) | 2012-03-28 |
ES2400183T3 (en) | 2013-04-08 |
ES2426252T3 (en) | 2013-10-22 |
EP2528424A1 (en) | 2012-11-28 |
US20070077434A1 (en) | 2007-04-05 |
US7160619B2 (en) | 2007-01-09 |
EP2528424B1 (en) | 2018-12-26 |
ATE540567T1 (en) | 2012-01-15 |
PL1673754T3 (en) | 2013-05-31 |
EP2434857B1 (en) | 2013-06-05 |
PL2242346T3 (en) | 2012-06-29 |
PL2434857T3 (en) | 2013-10-31 |
EP1673754B1 (en) | 2012-12-12 |
ES2379769T3 (en) | 2012-05-03 |
EP1673754A2 (en) | 2006-06-28 |
EP2242346A1 (en) | 2010-10-20 |
EP1673754A4 (en) | 2008-08-06 |
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