WO2005039254A3 - Electrical circuit apparatus and method for assembling same - Google Patents

Electrical circuit apparatus and method for assembling same Download PDF

Info

Publication number
WO2005039254A3
WO2005039254A3 PCT/US2004/030755 US2004030755W WO2005039254A3 WO 2005039254 A3 WO2005039254 A3 WO 2005039254A3 US 2004030755 W US2004030755 W US 2004030755W WO 2005039254 A3 WO2005039254 A3 WO 2005039254A3
Authority
WO
WIPO (PCT)
Prior art keywords
aperture
substrate
solder
heat sink
electrical circuit
Prior art date
Application number
PCT/US2004/030755
Other languages
French (fr)
Other versions
WO2005039254A2 (en
Inventor
John M Waldvogel
Brian R Bielick
Herman J Miller
Cannon Billy J Van
Original Assignee
Motorola Inc
John M Waldvogel
Brian R Bielick
Herman J Miller
Cannon Billy J Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc, John M Waldvogel, Brian R Bielick, Herman J Miller, Cannon Billy J Van filed Critical Motorola Inc
Priority to EP04784579.7A priority Critical patent/EP1671524B1/en
Publication of WO2005039254A2 publication Critical patent/WO2005039254A2/en
Publication of WO2005039254A3 publication Critical patent/WO2005039254A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Abstract

An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
PCT/US2004/030755 2003-10-02 2004-09-17 Electrical circuit apparatus and method for assembling same WO2005039254A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04784579.7A EP1671524B1 (en) 2003-10-02 2004-09-17 Electrical circuit apparatus and method for assembling same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/677,458 US6842341B1 (en) 2003-10-02 2003-10-02 Electrical circuit apparatus and method for assembling same
US10/677,458 2003-10-02

Publications (2)

Publication Number Publication Date
WO2005039254A2 WO2005039254A2 (en) 2005-04-28
WO2005039254A3 true WO2005039254A3 (en) 2005-06-16

Family

ID=33553024

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/030755 WO2005039254A2 (en) 2003-10-02 2004-09-17 Electrical circuit apparatus and method for assembling same

Country Status (6)

Country Link
US (2) US6842341B1 (en)
EP (1) EP1671524B1 (en)
CN (1) CN100508707C (en)
MY (1) MY136905A (en)
TW (1) TWI250832B (en)
WO (1) WO2005039254A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6842341B1 (en) * 2003-10-02 2005-01-11 Motorola, Inc. Electrical circuit apparatus and method for assembling same
US6861746B1 (en) * 2003-10-02 2005-03-01 Motorola, Inc. Electrical circuit apparatus and methods for assembling same
DE10361683A1 (en) * 2003-12-30 2005-07-28 Siemens Ag Display for the display of programmable barcodes
US7433192B2 (en) * 2004-12-29 2008-10-07 Agere Systems Inc. Packaging for electronic modules
US7215204B2 (en) * 2004-12-29 2007-05-08 Agere Systems Inc. Intelligent high-power amplifier module
US7195145B2 (en) * 2005-07-13 2007-03-27 Motorola, Inc. Electrical circuit apparatus and method for assembling same
US7259446B2 (en) * 2005-08-25 2007-08-21 Motorola, Inc. Heat sink packaging assembly for electronic components
DE102006001188A1 (en) * 2006-01-10 2007-07-12 Robert Bosch Gmbh Arrangement for cooling power components on printed circuit boards and method for producing the same
CN101090599B (en) * 2006-06-16 2010-05-26 鸿富锦精密工业（深圳）有限公司 Circuit board
US9801285B2 (en) * 2012-03-20 2017-10-24 Alpha Assembly Solutions Inc. Solder preforms and solder alloy assembly methods
DE102012020838A1 (en) * 2012-10-24 2014-04-24 Schoeller-Electronics Gmbh circuit board
US8995933B2 (en) 2013-06-21 2015-03-31 Motorola Solutions, Inc. Radio frequency transistor and matching circuit grounding and thermal management apparatus
US9607964B2 (en) * 2014-03-28 2017-03-28 Intel Corporation Method and materials for warpage thermal and interconnect solutions
US10103692B2 (en) * 2014-05-22 2018-10-16 Commscope Technologies Llc Vapor chamber amplifier module
DE102015200989A1 (en) * 2015-01-22 2016-07-28 Robert Bosch Gmbh Connecting arrangement between a carrier element and an electronic circuit component and circuit carrier
US9860987B2 (en) * 2015-02-13 2018-01-02 Deere & Company Electronic assembly with one or more heat sinks
US9693488B2 (en) * 2015-02-13 2017-06-27 Deere & Company Electronic assembly with one or more heat sinks
EP4266842A1 (en) * 2022-04-22 2023-10-25 Comet AG Printed-circuit-board structure and method for manufacturing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030001A (en) * 1975-11-19 1977-06-14 E-Systems, Inc. Co-planar lead connections to microstrip switching devices
US6011692A (en) * 1997-08-25 2000-01-04 Telefonaktiebolaget Lm Ericsson Chip supporting element
US6449158B1 (en) * 2001-12-20 2002-09-10 Motorola, Inc. Method and apparatus for securing an electronic power device to a heat spreader
US6537857B2 (en) * 2001-05-07 2003-03-25 St Assembly Test Service Ltd. Enhanced BGA grounded heatsink
US6635958B2 (en) * 2001-12-03 2003-10-21 Dover Capital Formation Group Surface mount ceramic package

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US3750269A (en) * 1970-07-06 1973-08-07 Texas Instruments Inc Method of mounting electronic devices
FR2599893B1 (en) * 1986-05-23 1996-08-02 Ricoh Kk METHOD FOR MOUNTING AN ELECTRONIC MODULE ON A SUBSTRATE AND INTEGRATED CIRCUIT CARD
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
JPH04233258A (en) * 1990-07-23 1992-08-21 Internatl Business Mach Corp <Ibm> Ultrasmall electronic circuit package
JP2901091B2 (en) * 1990-09-27 1999-06-02 株式会社日立製作所 Semiconductor device
US5263245A (en) * 1992-01-27 1993-11-23 International Business Machines Corporation Method of making an electronic package with enhanced heat sinking
US5646444A (en) 1995-10-05 1997-07-08 Motorola, Inc. Apparatus and method for mounting a component to an electrical circuit
JPH1022589A (en) * 1996-04-29 1998-01-23 Ibiden Co Ltd Electronic-part mounting substrate and its manufacture
SE509570C2 (en) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperature compensating means and procedure for mounting electronics on a circuit board
WO1998049875A1 (en) * 1997-04-30 1998-11-05 Motorola Inc. Method of attaching metallic objects to a printed circuit board
US6292374B1 (en) * 1998-05-29 2001-09-18 Lucent Technologies, Inc. Assembly having a back plate with inserts
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
SE517455C2 (en) * 1999-12-15 2002-06-11 Ericsson Telefon Ab L M Power transistor module, power amplifier and method of manufacture thereof
JP2003152288A (en) * 2001-11-14 2003-05-23 Nissan Motor Co Ltd Flexible board, circuit board and method for mounting electronic component
US6787895B1 (en) * 2001-12-07 2004-09-07 Skyworks Solutions, Inc. Leadless chip carrier for reduced thermal resistance
US6842341B1 (en) * 2003-10-02 2005-01-11 Motorola, Inc. Electrical circuit apparatus and method for assembling same
US6861746B1 (en) * 2003-10-02 2005-03-01 Motorola, Inc. Electrical circuit apparatus and methods for assembling same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030001A (en) * 1975-11-19 1977-06-14 E-Systems, Inc. Co-planar lead connections to microstrip switching devices
US6011692A (en) * 1997-08-25 2000-01-04 Telefonaktiebolaget Lm Ericsson Chip supporting element
US6537857B2 (en) * 2001-05-07 2003-03-25 St Assembly Test Service Ltd. Enhanced BGA grounded heatsink
US6635958B2 (en) * 2001-12-03 2003-10-21 Dover Capital Formation Group Surface mount ceramic package
US6449158B1 (en) * 2001-12-20 2002-09-10 Motorola, Inc. Method and apparatus for securing an electronic power device to a heat spreader

Non-Patent Citations (1)

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Title
See also references of EP1671524A4 *

Also Published As

Publication number Publication date
EP1671524A2 (en) 2006-06-21
US6842341B1 (en) 2005-01-11
TW200526098A (en) 2005-08-01
US7063249B2 (en) 2006-06-20
EP1671524A4 (en) 2009-08-05
CN1864450A (en) 2006-11-15
US20050092814A1 (en) 2005-05-05
EP1671524B1 (en) 2015-11-04
TWI250832B (en) 2006-03-01
CN100508707C (en) 2009-07-01
MY136905A (en) 2008-11-28
WO2005039254A2 (en) 2005-04-28

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