WO2005040726A3 - Sensor positioning systems and methods - Google Patents

Sensor positioning systems and methods Download PDF

Info

Publication number
WO2005040726A3
WO2005040726A3 PCT/US2004/032927 US2004032927W WO2005040726A3 WO 2005040726 A3 WO2005040726 A3 WO 2005040726A3 US 2004032927 W US2004032927 W US 2004032927W WO 2005040726 A3 WO2005040726 A3 WO 2005040726A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensors
methods
positioning systems
sensor positioning
template
Prior art date
Application number
PCT/US2004/032927
Other languages
French (fr)
Other versions
WO2005040726A2 (en
Inventor
Mei H Sun
Richard Schwaninger
Wayne G Renken
Original Assignee
Sensarray Corp
Mei H Sun
Richard Schwaninger
Wayne G Renken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensarray Corp, Mei H Sun, Richard Schwaninger, Wayne G Renken filed Critical Sensarray Corp
Publication of WO2005040726A2 publication Critical patent/WO2005040726A2/en
Publication of WO2005040726A3 publication Critical patent/WO2005040726A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments

Abstract

Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.
PCT/US2004/032927 2003-10-16 2004-10-05 Sensor positioning systems and methods WO2005040726A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/688,300 2003-10-16
US10/688,300 US6915589B2 (en) 2003-10-16 2003-10-16 Sensor positioning systems and methods

Publications (2)

Publication Number Publication Date
WO2005040726A2 WO2005040726A2 (en) 2005-05-06
WO2005040726A3 true WO2005040726A3 (en) 2005-09-09

Family

ID=34521140

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/032927 WO2005040726A2 (en) 2003-10-16 2004-10-05 Sensor positioning systems and methods

Country Status (3)

Country Link
US (1) US6915589B2 (en)
TW (1) TWI354774B (en)
WO (1) WO2005040726A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6889568B2 (en) * 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US7757574B2 (en) * 2002-01-24 2010-07-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
US8604361B2 (en) * 2005-12-13 2013-12-10 Kla-Tencor Corporation Component package for maintaining safe operating temperature of components
US7638798B2 (en) * 2006-08-24 2009-12-29 Coherent, Inc. Laminated wafer sensor system for UV dose measurement
US8079758B2 (en) * 2007-10-25 2011-12-20 Sebacs Co., Ltd. Temperature computing instrument and method for calibrating temperature of sensor part used therefor
US9063252B2 (en) * 2009-03-13 2015-06-23 Saudi Arabian Oil Company System, method, and nanorobot to explore subterranean geophysical formations
EP2365390A3 (en) 2010-03-12 2017-10-04 ASML Netherlands B.V. Lithographic apparatus and method
US8681493B2 (en) 2011-05-10 2014-03-25 Kla-Tencor Corporation Heat shield module for substrate-like metrology device
US10216100B2 (en) 2015-07-16 2019-02-26 Asml Netherlands B.V. Inspection substrate and an inspection method
US10272851B2 (en) * 2015-10-08 2019-04-30 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicle emblem alignment and installation tools and methods of use
CN107850495B (en) * 2016-04-19 2020-06-30 东京毅力科创株式会社 Substrate for temperature measurement and temperature measurement system
US10460966B2 (en) 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
US10393594B2 (en) * 2016-08-12 2019-08-27 Qualcomm Incorporated Thermopile mesh
EP3435048A1 (en) * 2017-07-25 2019-01-30 Heraeus Sensor Technology GmbH Sensor for measuring a spatial temperature profile and method for producing a sensor unit

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584780A (en) * 1984-10-23 1986-04-29 Pressey John R Layout template for electrical panel
US5548372A (en) * 1993-08-11 1996-08-20 Cray Research, Inc. PCB tooling apparatus for forming patterns on both sides of a substrate
US5855076A (en) * 1997-03-07 1999-01-05 Ericsson, Inc. Layout template for telecommunications switching cabinets
US6079875A (en) * 1997-09-04 2000-06-27 Alcatel Apparatus for measuring the temperature of an object with a temperature sensor and method of making the temperature sensor
US6325536B1 (en) * 1998-07-10 2001-12-04 Sensarray Corporation Integrated wafer temperature sensors
US6751493B2 (en) * 2002-01-09 2004-06-15 Unilead International, Inc. Universal electrocardiogram sensor positioning mask with repositionable sensors and method for employing same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455749A (en) * 1979-08-07 1984-06-26 Hayward C Michael Matrix board
US4964737A (en) 1989-03-17 1990-10-23 Ibm Removable thermocouple template for monitoring temperature of multichip modules
US5363561A (en) * 1993-05-17 1994-11-15 Essary Karen P Pillow template apparatus
US6214525B1 (en) * 1996-09-06 2001-04-10 International Business Machines Corp. Printed circuit board with circuitized cavity and methods of producing same
US6555408B1 (en) 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
WO2001095375A1 (en) * 2000-06-06 2001-12-13 The Penn State Research Foundation An electro-fluidic assembly process for integration of electronic devices onto a substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584780A (en) * 1984-10-23 1986-04-29 Pressey John R Layout template for electrical panel
US5548372A (en) * 1993-08-11 1996-08-20 Cray Research, Inc. PCB tooling apparatus for forming patterns on both sides of a substrate
US5855076A (en) * 1997-03-07 1999-01-05 Ericsson, Inc. Layout template for telecommunications switching cabinets
US6079875A (en) * 1997-09-04 2000-06-27 Alcatel Apparatus for measuring the temperature of an object with a temperature sensor and method of making the temperature sensor
US6325536B1 (en) * 1998-07-10 2001-12-04 Sensarray Corporation Integrated wafer temperature sensors
US6751493B2 (en) * 2002-01-09 2004-06-15 Unilead International, Inc. Universal electrocardiogram sensor positioning mask with repositionable sensors and method for employing same

Also Published As

Publication number Publication date
TWI354774B (en) 2011-12-21
US20050081398A1 (en) 2005-04-21
US6915589B2 (en) 2005-07-12
TW200526928A (en) 2005-08-16
WO2005040726A2 (en) 2005-05-06

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