WO2005043758A3 - Verfahren und vorrichtung zum aufschmelzlöten mit volumenstromsteuerung - Google Patents

Verfahren und vorrichtung zum aufschmelzlöten mit volumenstromsteuerung Download PDF

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Publication number
WO2005043758A3
WO2005043758A3 PCT/EP2004/012262 EP2004012262W WO2005043758A3 WO 2005043758 A3 WO2005043758 A3 WO 2005043758A3 EP 2004012262 W EP2004012262 W EP 2004012262W WO 2005043758 A3 WO2005043758 A3 WO 2005043758A3
Authority
WO
WIPO (PCT)
Prior art keywords
volume flow
soldering
flow control
reflow soldering
item
Prior art date
Application number
PCT/EP2004/012262
Other languages
English (en)
French (fr)
Other versions
WO2005043758A2 (de
Inventor
Hans Bell
Original Assignee
Rehm Anlagenbau Gmbh
Hans Bell
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rehm Anlagenbau Gmbh, Hans Bell filed Critical Rehm Anlagenbau Gmbh
Priority to DE502004010247T priority Critical patent/DE502004010247D1/de
Priority to EP04791023A priority patent/EP1678992B1/de
Priority to US10/577,680 priority patent/US7581668B2/en
Publication of WO2005043758A2 publication Critical patent/WO2005043758A2/de
Publication of WO2005043758A3 publication Critical patent/WO2005043758A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Abstract

In einem Aspekt der vorliegenden Erfindung ermöglicht die Reduzierung eines anfänglich grösseren Volumenstroms bei gleichbleibender oder zunehmender Temperatur eine rasche Erwärmung eines Lötgutes, wobei eine übermässige Erhitzung kleiner Bauelemente effizient verhindert wird. Die Steuerung des an dem Lötgut auftretenden wirksamen Wärmeübergangs mittels des Volumenstroms einer Konvektionsheizeinrichtung ermöglicht ausserdem ein äusserst flexibles Anpassen des Lötvorganges an spezielle Prozesserfordernisse, da eine Einstellung eines geänderten Volumenstroms in sehr rascher und präziser Weise steuerbar ist.
PCT/EP2004/012262 2003-10-30 2004-10-29 Verfahren und vorrichtung zum aufschmelzlöten mit volumenstromsteuerung WO2005043758A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE502004010247T DE502004010247D1 (de) 2003-10-30 2004-10-29 Verfahren zum aufschmelzlöten mit volumenstromsteuerung
EP04791023A EP1678992B1 (de) 2003-10-30 2004-10-29 Verfahren zum aufschmelzlöten mit volumenstromsteuerung
US10/577,680 US7581668B2 (en) 2003-10-30 2004-10-29 Method and device for reflow soldering with volume flow control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10350699.3 2003-10-30
DE10350699A DE10350699B3 (de) 2003-10-30 2003-10-30 Verfahren und Vorrichtung zum Aufschmelzlöten mit Volumenstromsteuerung

Publications (2)

Publication Number Publication Date
WO2005043758A2 WO2005043758A2 (de) 2005-05-12
WO2005043758A3 true WO2005043758A3 (de) 2005-08-11

Family

ID=34529919

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/012262 WO2005043758A2 (de) 2003-10-30 2004-10-29 Verfahren und vorrichtung zum aufschmelzlöten mit volumenstromsteuerung

Country Status (7)

Country Link
US (1) US7581668B2 (de)
EP (1) EP1678992B1 (de)
KR (1) KR100814999B1 (de)
CN (1) CN100536638C (de)
DE (2) DE10350699B3 (de)
RU (1) RU2329624C2 (de)
WO (1) WO2005043758A2 (de)

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Publication number Priority date Publication date Assignee Title
CN103286408B (zh) * 2012-02-24 2017-03-01 联想企业解决方案（新加坡）私人有限公司 一种热源系统
USD793153S1 (en) 2015-03-06 2017-08-01 Sharkninja Operating, Llc Blender
DE102016110040A1 (de) * 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
USD812963S1 (en) 2016-08-31 2018-03-20 Sharkninja Operating Llc Food processor and parts thereof
USD811804S1 (en) 2016-08-31 2018-03-06 Sharkninja Operating Llc Food processor and parts thereof
USD811805S1 (en) 2016-08-31 2018-03-06 Sharkninja Operating Llc Food processor and parts thereof
CN106628836A (zh) * 2017-02-23 2017-05-10 重庆江东机械有限责任公司 一种保温输送系统及其保温方法、应用
USD846341S1 (en) 2017-07-24 2019-04-23 Sharkninja Operating Llc Food processor and parts thereof
USD840745S1 (en) 2017-07-24 2019-02-19 Sharkninja Operating Llc Food processor
USD846342S1 (en) 2017-07-24 2019-04-23 Sharkninja Operating Llc Food processor and parts thereof
RU2698306C2 (ru) * 2018-04-04 2019-08-26 Акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнёва" Способ поверхностного монтажа электрорадиоизделий радиоэлектронной аппаратуры
CN110871299A (zh) * 2018-08-29 2020-03-10 伊利诺斯工具制品有限公司 回流焊炉的降温系统
DE102019213511A1 (de) 2019-09-05 2021-03-11 Rehm Thermal Systems Gmbh Reflow-Lötanlage zum kombinierten Konvektionslöten und Kondensationslöten
JP7145839B2 (ja) * 2019-12-18 2022-10-03 株式会社オリジン はんだ付け基板の製造方法及びはんだ付け装置
DE102021129131B4 (de) * 2021-11-09 2024-02-29 Ersa Gmbh Lötanlage, insbesondere eine Reflowlötanlage mit seitlich neben einem Prozesskanal vorgesehenen Lüftereinheiten

Citations (8)

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Publication number Priority date Publication date Assignee Title
EP0279604A2 (de) * 1987-02-20 1988-08-24 Hollis Automation Inc. Verfahren und Vorrichtung zum Aufschmelzlöten mittels fokussierter Konvektion
US5553768A (en) * 1993-09-21 1996-09-10 Air-Vac Engineering Company, Inc. Heat-control process and apparatus for attachment/detachment of soldered components
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
US6005224A (en) * 1997-10-30 1999-12-21 U.S. Philips Corporation Method of soldering components to at least one carrier
JP2001160675A (ja) * 1999-09-22 2001-06-12 Omron Corp リフロー装置とその制御方法
EP1133219A1 (de) * 1998-10-13 2001-09-12 Matsushita Electric Industrial Co., Ltd. Heizvorrichtung und heizverfahren
DE10133217A1 (de) * 2001-07-09 2003-01-23 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie
DE10256250A1 (de) * 2001-12-03 2003-08-21 Visteon Global Tech Inc System und Verfahren zum Montieren elektronischer Komponenten auf flexible Substrate

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US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
DE19639025C2 (de) 1996-09-23 1999-10-28 Siemens Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
DE29617213U1 (de) * 1996-10-02 1997-01-09 Smt Maschinengesellschaft Mbh Reflowlötanlage
RU2118585C1 (ru) 1997-09-11 1998-09-10 Воеводин Григорий Леонидович Способ монтажа деталей полупроводникового прибора к основанию и полупроводниковый прибор, полученный этим способом
DE19826417A1 (de) * 1998-06-16 1999-12-23 Heraeus Noblelight Gmbh Durchlaufofen
US6936793B1 (en) * 2002-04-17 2005-08-30 Novastar Technologiesm Inc. Oven apparatus and method of use thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0279604A2 (de) * 1987-02-20 1988-08-24 Hollis Automation Inc. Verfahren und Vorrichtung zum Aufschmelzlöten mittels fokussierter Konvektion
US5553768A (en) * 1993-09-21 1996-09-10 Air-Vac Engineering Company, Inc. Heat-control process and apparatus for attachment/detachment of soldered components
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
US6005224A (en) * 1997-10-30 1999-12-21 U.S. Philips Corporation Method of soldering components to at least one carrier
EP1133219A1 (de) * 1998-10-13 2001-09-12 Matsushita Electric Industrial Co., Ltd. Heizvorrichtung und heizverfahren
JP2001160675A (ja) * 1999-09-22 2001-06-12 Omron Corp リフロー装置とその制御方法
DE10133217A1 (de) * 2001-07-09 2003-01-23 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie
DE10256250A1 (de) * 2001-12-03 2003-08-21 Visteon Global Tech Inc System und Verfahren zum Montieren elektronischer Komponenten auf flexible Substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 23 10 February 2001 (2001-02-10) *

Also Published As

Publication number Publication date
WO2005043758A2 (de) 2005-05-12
RU2006113693A (ru) 2007-12-10
RU2329624C2 (ru) 2008-07-20
US7581668B2 (en) 2009-09-01
CN1902991A (zh) 2007-01-24
DE502004010247D1 (de) 2009-11-26
CN100536638C (zh) 2009-09-02
KR100814999B1 (ko) 2008-03-18
KR20060115884A (ko) 2006-11-10
EP1678992A2 (de) 2006-07-12
EP1678992B1 (de) 2009-10-14
US20080061116A1 (en) 2008-03-13
DE10350699B3 (de) 2005-06-30

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