WO2005060379A3 - Chambers, systems, and methods for electrochemically processing microfeature workpieces - Google Patents

Chambers, systems, and methods for electrochemically processing microfeature workpieces Download PDF

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Publication number
WO2005060379A3
WO2005060379A3 PCT/US2004/017800 US2004017800W WO2005060379A3 WO 2005060379 A3 WO2005060379 A3 WO 2005060379A3 US 2004017800 W US2004017800 W US 2004017800W WO 2005060379 A3 WO2005060379 A3 WO 2005060379A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing
chambers
systems
methods
flow
Prior art date
Application number
PCT/US2004/017800
Other languages
French (fr)
Other versions
WO2005060379A2 (en
Inventor
Kyle M Hanson
John Klocke
Original Assignee
Semitool Inc
Kyle M Hanson
John Klocke
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/729,349 external-priority patent/US7351314B2/en
Priority claimed from US10/729,357 external-priority patent/US7351315B2/en
Application filed by Semitool Inc, Kyle M Hanson, John Klocke filed Critical Semitool Inc
Priority to JP2006542549A priority Critical patent/JP4448857B2/en
Priority to EP04754411A priority patent/EP1702018A4/en
Publication of WO2005060379A2 publication Critical patent/WO2005060379A2/en
Publication of WO2005060379A3 publication Critical patent/WO2005060379A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Abstract

Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.
PCT/US2004/017800 2003-12-05 2004-06-04 Chambers, systems, and methods for electrochemically processing microfeature workpieces WO2005060379A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006542549A JP4448857B2 (en) 2003-12-05 2004-06-04 Chambers, systems, and methods for electrochemically processing microfeature workpieces
EP04754411A EP1702018A4 (en) 2003-12-05 2004-06-04 Chambers, systems, and methods for electrochemically processing microfeature workpieces

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/729,349 2003-12-05
US10/729,357 2003-12-05
US10/729,349 US7351314B2 (en) 2003-12-05 2003-12-05 Chambers, systems, and methods for electrochemically processing microfeature workpieces
US10/729,357 US7351315B2 (en) 2003-12-05 2003-12-05 Chambers, systems, and methods for electrochemically processing microfeature workpieces

Publications (2)

Publication Number Publication Date
WO2005060379A2 WO2005060379A2 (en) 2005-07-07
WO2005060379A3 true WO2005060379A3 (en) 2006-08-17

Family

ID=34713893

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/017800 WO2005060379A2 (en) 2003-12-05 2004-06-04 Chambers, systems, and methods for electrochemically processing microfeature workpieces

Country Status (6)

Country Link
US (1) US7585398B2 (en)
EP (1) EP1702018A4 (en)
JP (1) JP4448857B2 (en)
KR (1) KR100840526B1 (en)
TW (1) TWI361509B (en)
WO (1) WO2005060379A2 (en)

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US7628898B2 (en) * 2001-03-12 2009-12-08 Semitool, Inc. Method and system for idle state operation
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US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
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US7585398B2 (en) 2009-09-08
US20050087439A1 (en) 2005-04-28
KR100840526B1 (en) 2008-06-23
TWI361509B (en) 2012-04-01
JP4448857B2 (en) 2010-04-14
JP2007534835A (en) 2007-11-29
WO2005060379A2 (en) 2005-07-07
US20090114533A9 (en) 2009-05-07
TW200520289A (en) 2005-06-16
EP1702018A2 (en) 2006-09-20
KR20060121274A (en) 2006-11-28

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