WO2005081313A3 - A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same - Google Patents

A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Download PDF

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Publication number
WO2005081313A3
WO2005081313A3 PCT/US2005/003440 US2005003440W WO2005081313A3 WO 2005081313 A3 WO2005081313 A3 WO 2005081313A3 US 2005003440 W US2005003440 W US 2005003440W WO 2005081313 A3 WO2005081313 A3 WO 2005081313A3
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WO
WIPO (PCT)
Prior art keywords
die
thermoelectric elements
microelectronic assembly
cool
making
Prior art date
Application number
PCT/US2005/003440
Other languages
French (fr)
Other versions
WO2005081313A2 (en
Inventor
Shriram Ramanathan
Gregory Chrysler
Steven Towle
Original Assignee
Intel Corp
Shriram Ramanathan
Gregory Chrysler
Steven Towle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Shriram Ramanathan, Gregory Chrysler, Steven Towle filed Critical Intel Corp
Priority to CN2005800039104A priority Critical patent/CN1914725B/en
Priority to JP2006553163A priority patent/JP4464974B2/en
Publication of WO2005081313A2 publication Critical patent/WO2005081313A2/en
Publication of WO2005081313A3 publication Critical patent/WO2005081313A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
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    • H01L2924/0001—Technical content checked by a classifier
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Abstract

A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.
PCT/US2005/003440 2004-02-12 2005-02-02 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same WO2005081313A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2005800039104A CN1914725B (en) 2004-02-12 2005-02-02 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
JP2006553163A JP4464974B2 (en) 2004-02-12 2005-02-02 Microelectronic assembly having a thermoelectric element for cooling a die and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/778,514 US7589417B2 (en) 2004-02-12 2004-02-12 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
US10/778,514 2004-02-12

Publications (2)

Publication Number Publication Date
WO2005081313A2 WO2005081313A2 (en) 2005-09-01
WO2005081313A3 true WO2005081313A3 (en) 2005-11-24

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PCT/US2005/003440 WO2005081313A2 (en) 2004-02-12 2005-02-02 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Country Status (5)

Country Link
US (1) US7589417B2 (en)
JP (1) JP4464974B2 (en)
CN (1) CN1914725B (en)
TW (1) TWI324818B (en)
WO (1) WO2005081313A2 (en)

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Publication number Publication date
TW200529398A (en) 2005-09-01
US20050178423A1 (en) 2005-08-18
JP2007523478A (en) 2007-08-16
WO2005081313A2 (en) 2005-09-01
JP4464974B2 (en) 2010-05-19
CN1914725A (en) 2007-02-14
TWI324818B (en) 2010-05-11
US7589417B2 (en) 2009-09-15
CN1914725B (en) 2011-11-23

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