WO2005083154A3 - Cleaning of chamber components - Google Patents

Cleaning of chamber components Download PDF

Info

Publication number
WO2005083154A3
WO2005083154A3 PCT/US2004/042625 US2004042625W WO2005083154A3 WO 2005083154 A3 WO2005083154 A3 WO 2005083154A3 US 2004042625 W US2004042625 W US 2004042625W WO 2005083154 A3 WO2005083154 A3 WO 2005083154A3
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning
component
cooled
fracture
deposits
Prior art date
Application number
PCT/US2004/042625
Other languages
French (fr)
Other versions
WO2005083154A2 (en
Inventor
Marc O'donnell Schweitzer
Jennifer Watia Tiller
Brian T West
Karl Brueckner
Original Assignee
Applied Materials Inc
Marc O'donnell Schweitzer
Jennifer Watia Tiller
Brian T West
Karl Brueckner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Marc O'donnell Schweitzer, Jennifer Watia Tiller, Brian T West, Karl Brueckner filed Critical Applied Materials Inc
Priority to KR1020067017660A priority Critical patent/KR101105996B1/en
Publication of WO2005083154A2 publication Critical patent/WO2005083154A2/en
Publication of WO2005083154A3 publication Critical patent/WO2005083154A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts

Abstract

In a method of cleaning a surface of a substrate processing chamber component to remove process deposits, the component surface is cooled to a temperature below about -40°C to fracture the process deposits on the surface. The surface can be cooled by immersing the surface in a low temperature fluid, such as liquid nitrogen. In another version, the component surface is heated to fracture and delaminate the deposits, and optionally, subsequently rapidly cooled to form more fractures. The component surface cleaning can also be performed by bead blasting followed by a chemical cleaning step.
PCT/US2004/042625 2004-02-11 2004-12-15 Cleaning of chamber components WO2005083154A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020067017660A KR101105996B1 (en) 2004-02-11 2004-12-15 Cleaning of chamber components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/777,866 US7264679B2 (en) 2004-02-11 2004-02-11 Cleaning of chamber components
US10/777,866 2004-02-11

Publications (2)

Publication Number Publication Date
WO2005083154A2 WO2005083154A2 (en) 2005-09-09
WO2005083154A3 true WO2005083154A3 (en) 2006-02-16

Family

ID=34827530

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/042625 WO2005083154A2 (en) 2004-02-11 2004-12-15 Cleaning of chamber components

Country Status (5)

Country Link
US (1) US7264679B2 (en)
KR (1) KR101105996B1 (en)
CN (1) CN100549223C (en)
TW (1) TWI358077B (en)
WO (1) WO2005083154A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
US20060005767A1 (en) * 2004-06-28 2006-01-12 Applied Materials, Inc. Chamber component having knurled surface
CA2500611A1 (en) * 2005-03-04 2006-09-04 Quadra Industrial Services Ontario Inc. Method of removing the fused non-ferrous or ferrous metal stickers from slag pot ladles
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
WO2007022327A2 (en) * 2005-08-15 2007-02-22 Alcatel Lucent Bandwidth rate controlled content download functionality
US7762114B2 (en) 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US20070281396A1 (en) * 2006-06-01 2007-12-06 Hung-Tsung Hsu Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
US20080092806A1 (en) * 2006-10-19 2008-04-24 Applied Materials, Inc. Removing residues from substrate processing components
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US8292698B1 (en) * 2007-03-30 2012-10-23 Lam Research Corporation On-line chamber cleaning using dry ice blasting
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US20090000641A1 (en) * 2007-06-28 2009-01-01 Applied Materials, Inc. Methods and apparatus for cleaning deposition chamber parts using selective spray etch
US8043557B2 (en) * 2007-08-15 2011-10-25 American Air Liquide, Inc. Methods and systems for sanitizing or sterilizing a medical device using ultrasonic energy and liquid nitrogen
US20090044828A1 (en) * 2007-08-15 2009-02-19 Brahmbhatt Sudhir R Methods and Systems for Debonding an Undesirable Material from a Device Using Ultrasonic Energy and Liquid Nitrogen
WO2009086023A2 (en) * 2007-12-19 2009-07-09 Applied Materials, Inc. Methods for cleaning process kits and chambers, and for ruthenium recovery
CN102069083B (en) * 2010-12-03 2012-07-04 河南师范大学 Method for cleaning microporous aeration disc/pipe
CN103240233A (en) * 2012-02-01 2013-08-14 上海科秉电子科技有限公司 Method for washing inner shielding baffle
JP5965680B2 (en) * 2012-03-08 2016-08-10 東京エレクトロン株式会社 Processing chamber part cooling method, processing chamber part cooling program, and storage medium
JP5692167B2 (en) * 2012-06-05 2015-04-01 株式会社デンソー Method and apparatus for cleaning and removing contaminants from workpieces
US9117760B2 (en) * 2013-01-30 2015-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
KR102036325B1 (en) * 2013-02-13 2019-10-25 삼성디스플레이 주식회사 Thin film deposition device having deposition preventing unit and method for removing deposits thereof
CN103426802B (en) * 2013-08-22 2016-03-30 上海科秉电子科技有限公司 A kind of focusing ring of etching machine and shading ring use post-processing approach
WO2015061035A1 (en) * 2013-10-22 2015-04-30 Tosoh Smd, Inc. Optimized textured surfaces and methods of optimizing
DE102015003942A1 (en) * 2015-03-26 2016-09-29 Linde Aktiengesellschaft Deburring of molded parts, in particular rubber moldings
JP5940199B1 (en) * 2015-06-26 2016-06-29 株式会社日立国際電気 Semiconductor device manufacturing method, substrate processing apparatus, and program
CN106467982A (en) * 2015-08-20 2017-03-01 上海志骑信息科技有限公司 Cleaning spinneret or the method for sintered metal mesh
US10138545B2 (en) * 2016-02-05 2018-11-27 Sci Engineered Materials, Inc. Process for the removal of contaminants from sputtering target substrates
US20180311707A1 (en) * 2017-05-01 2018-11-01 Lam Research Corporation In situ clean using high vapor pressure aerosols
US11810766B2 (en) 2018-07-05 2023-11-07 Applied Materials, Inc. Protection of aluminum process chamber components
DE102019203661A1 (en) * 2019-03-19 2020-09-24 Coperion Gmbh Housing cleaning device for cleaning a housing of a screw machine
CN110318038A (en) * 2019-06-19 2019-10-11 江苏华恒新能源有限公司 A method of for accessory separation deposition membrane layer in vacuum coating cavity
US11365475B2 (en) 2019-08-02 2022-06-21 Applied Materials Inc. Physical vapor deposition chamber cleaning processes
CN112845397A (en) * 2020-12-31 2021-05-28 河南科技大学第一附属医院 Dry cleaning type cleaner for glass cutting pipe
US20240096664A1 (en) * 2022-09-15 2024-03-21 Applied Materials, Inc. On-board cleaning of tooling parts in hybrid bonding tool

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3934379A (en) * 1974-09-03 1976-01-27 Wisconsin Alumni Research Foundation Removal of built up layers of organic coatings
US4627197A (en) * 1983-12-08 1986-12-09 Air Products And Chemicals, Inc. Process control for cryogenic decoating
EP0633443A1 (en) * 1993-06-14 1995-01-11 International Business Machines Corporation Heat exchanger
US6408860B1 (en) * 2000-09-21 2002-06-25 Trw Inc. Method for cleaning phosphorus from an MBE chamber

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US547649A (en) * 1895-10-08 Brake-slack adjuster
JPS5710370A (en) 1980-06-18 1982-01-19 Yashima:Kk Method for stripping paint by liquid nitrogen
JPS63155729A (en) 1986-12-19 1988-06-28 Hitachi Electronics Eng Co Ltd Method and apparatus for cleaning silicon wafer at low temperature
JPH02257613A (en) 1989-03-30 1990-10-18 Fujitsu Ltd Removal of contamination by fine particle
JPH03190131A (en) 1989-12-19 1991-08-20 Iwatani Internatl Corp Cleaning device of semiconductor substrate
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
JP3357037B2 (en) 1990-08-31 2002-12-16 沖電気工業株式会社 Semiconductor substrate cleaning method
US5401319A (en) * 1992-08-27 1995-03-28 Applied Materials, Inc. Lid and door for a vacuum chamber and pretreatment therefor
US5456758A (en) * 1993-04-26 1995-10-10 Sematech, Inc. Submicron particle removal using liquid nitrogen
DE4322360A1 (en) 1993-07-05 1995-01-12 Bosch Siemens Hausgeraete Built-in cooker
JPH0766119A (en) 1993-08-25 1995-03-10 M C Electron Kk Method for removing photoresist film
US5474649A (en) 1994-03-08 1995-12-12 Applied Materials, Inc. Plasma processing apparatus employing a textured focus ring
WO1996027323A1 (en) * 1995-03-07 1996-09-12 John Dumergue Charters Apparatus for dilating a body cavity
EP0803900A3 (en) * 1996-04-26 1999-12-29 Applied Materials, Inc. Surface preparation to enhance the adhesion of a dielectric layer
US6082373A (en) * 1996-07-05 2000-07-04 Kabushiki Kaisha Toshiba Cleaning method
US5908510A (en) * 1996-10-16 1999-06-01 International Business Machines Corporation Residue removal by supercritical fluids
JPH1116858A (en) * 1997-06-21 1999-01-22 Tokyo Electron Ltd Method of cleaning and processing film forming device
JP2910761B1 (en) * 1998-05-29 1999-06-23 日本電気株式会社 Method for cleaning the inside of a pipe of a semiconductor device manufacturing apparatus
US6805952B2 (en) * 2000-12-29 2004-10-19 Lam Research Corporation Low contamination plasma chamber components and methods for making the same
US6933508B2 (en) * 2002-03-13 2005-08-23 Applied Materials, Inc. Method of surface texturizing
US6812471B2 (en) * 2002-03-13 2004-11-02 Applied Materials, Inc. Method of surface texturizing
CN1665609A (en) 2002-04-05 2005-09-07 波克股份有限公司 Fluid assisted cryogenic cleaning
US6852173B2 (en) * 2002-04-05 2005-02-08 Boc, Inc. Liquid-assisted cryogenic cleaning

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3934379A (en) * 1974-09-03 1976-01-27 Wisconsin Alumni Research Foundation Removal of built up layers of organic coatings
US4627197A (en) * 1983-12-08 1986-12-09 Air Products And Chemicals, Inc. Process control for cryogenic decoating
EP0633443A1 (en) * 1993-06-14 1995-01-11 International Business Machines Corporation Heat exchanger
US6408860B1 (en) * 2000-09-21 2002-06-25 Trw Inc. Method for cleaning phosphorus from an MBE chamber

Also Published As

Publication number Publication date
TWI358077B (en) 2012-02-11
CN100549223C (en) 2009-10-14
WO2005083154A2 (en) 2005-09-09
US20050172984A1 (en) 2005-08-11
KR20070003892A (en) 2007-01-05
US7264679B2 (en) 2007-09-04
KR101105996B1 (en) 2012-01-18
TW200527495A (en) 2005-08-16
CN1914352A (en) 2007-02-14

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