WO2005098975A3 - Methods for packaging a light emitting device and packaged light emitting devices - Google Patents

Methods for packaging a light emitting device and packaged light emitting devices Download PDF

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Publication number
WO2005098975A3
WO2005098975A3 PCT/US2005/010034 US2005010034W WO2005098975A3 WO 2005098975 A3 WO2005098975 A3 WO 2005098975A3 US 2005010034 W US2005010034 W US 2005010034W WO 2005098975 A3 WO2005098975 A3 WO 2005098975A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
packaging
methods
emitting device
reflective cavity
Prior art date
Application number
PCT/US2005/010034
Other languages
French (fr)
Other versions
WO2005098975A2 (en
Inventor
Thomas G Coleman
James Ibbetson
Michael Leung
Gerald H Negley
Eric Tarsa
Original Assignee
Cree Inc
Andrews Peter S
Thomas G Coleman
James Ibbetson
Michael Leung
Gerald H Negley
Eric Tarsa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc, Andrews Peter S, Thomas G Coleman, James Ibbetson, Michael Leung, Gerald H Negley, Eric Tarsa filed Critical Cree Inc
Priority to DE602005021622T priority Critical patent/DE602005021622D1/en
Priority to EP05729958A priority patent/EP1730784B1/en
Priority to KR1020127008718A priority patent/KR101278361B1/en
Priority to KR1020067022560A priority patent/KR101166592B1/en
Priority to JP2007506286A priority patent/JP5357423B2/en
Priority to AT05729958T priority patent/ATE470242T1/en
Publication of WO2005098975A2 publication Critical patent/WO2005098975A2/en
Publication of WO2005098975A3 publication Critical patent/WO2005098975A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing Of Micro-Capsules (AREA)

Abstract

Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.
PCT/US2005/010034 2004-03-31 2005-03-24 Methods for packaging a light emitting device and packaged light emitting devices WO2005098975A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE602005021622T DE602005021622D1 (en) 2004-03-31 2005-03-24 METHOD FOR CAPSULEING A LIGHT-EMITTING COMPONENT AND CAPSUED LIGHT-EMITTING COMPONENTS
EP05729958A EP1730784B1 (en) 2004-03-31 2005-03-24 Methods for packaging a light emitting device and packaged light emitting devices
KR1020127008718A KR101278361B1 (en) 2004-03-31 2005-03-24 Methods for packaging a light emitting device and packaged light emitting devices
KR1020067022560A KR101166592B1 (en) 2004-03-31 2005-03-24 Methods for packaging a light emitting device and packaged light emitting devices
JP2007506286A JP5357423B2 (en) 2004-03-31 2005-03-24 Method for packaging light emitting device and packaged light emitting device
AT05729958T ATE470242T1 (en) 2004-03-31 2005-03-24 METHOD FOR ENCAPSULATING A LIGHT-EMITTING COMPONENT AND ENCAPSULATED LIGHT-EMITTING COMPONENTS

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55792404P 2004-03-31 2004-03-31
US60/557,924 2004-03-31
US11/044,126 US7279346B2 (en) 2004-03-31 2005-01-27 Method for packaging a light emitting device by one dispense then cure step followed by another
US11/044,126 2005-01-27

Publications (2)

Publication Number Publication Date
WO2005098975A2 WO2005098975A2 (en) 2005-10-20
WO2005098975A3 true WO2005098975A3 (en) 2006-08-24

Family

ID=35053329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/010034 WO2005098975A2 (en) 2004-03-31 2005-03-24 Methods for packaging a light emitting device and packaged light emitting devices

Country Status (8)

Country Link
US (3) US7279346B2 (en)
EP (1) EP1730784B1 (en)
JP (1) JP5357423B2 (en)
KR (2) KR101278361B1 (en)
AT (1) ATE470242T1 (en)
DE (1) DE602005021622D1 (en)
TW (1) TWI405338B (en)
WO (1) WO2005098975A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008676B2 (en) 2006-05-26 2011-08-30 Cree, Inc. Solid state light emitting device and method of making same

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