WO2005099957A3 - Pulsed laser processing with controlled thermal and physical alterations - Google Patents

Pulsed laser processing with controlled thermal and physical alterations Download PDF

Info

Publication number
WO2005099957A3
WO2005099957A3 PCT/US2005/008623 US2005008623W WO2005099957A3 WO 2005099957 A3 WO2005099957 A3 WO 2005099957A3 US 2005008623 W US2005008623 W US 2005008623W WO 2005099957 A3 WO2005099957 A3 WO 2005099957A3
Authority
WO
WIPO (PCT)
Prior art keywords
pulse
laser
laser processing
pulsed laser
controlled thermal
Prior art date
Application number
PCT/US2005/008623
Other languages
French (fr)
Other versions
WO2005099957A2 (en
Inventor
Tadashi Yamamoto
Donald J Harter
Rajesh S Patel
Alan Y Arai
Original Assignee
Imra America Inc
Tadashi Yamamoto
Donald J Harter
Rajesh S Patel
Alan Y Arai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imra America Inc, Tadashi Yamamoto, Donald J Harter, Rajesh S Patel, Alan Y Arai filed Critical Imra America Inc
Priority to JP2007506208A priority Critical patent/JP4788712B2/en
Publication of WO2005099957A2 publication Critical patent/WO2005099957A2/en
Publication of WO2005099957A3 publication Critical patent/WO2005099957A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses

Abstract

Laser machining of material using a burst of laser pulses, tailoring the pulse width, pulse separation, wavelength, and polarization to maximize the positive effect of thermal and physical changes achieved by the previous pulse on the laser matter interaction. The first laser pulse (31) width has a duration longer than a second laser pulse (32) width. The first pulse (31) and the second pulse (32) may have the same pulse energy or differing pulse energy.
PCT/US2005/008623 2004-03-31 2005-03-14 Pulsed laser processing with controlled thermal and physical alterations WO2005099957A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007506208A JP4788712B2 (en) 2004-03-31 2005-03-14 Pulsed laser treatment with controlled thermal and physical modification.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/813,389 2004-03-31
US10/813,389 US7491909B2 (en) 2004-03-31 2004-03-31 Pulsed laser processing with controlled thermal and physical alterations

Publications (2)

Publication Number Publication Date
WO2005099957A2 WO2005099957A2 (en) 2005-10-27
WO2005099957A3 true WO2005099957A3 (en) 2006-07-13

Family

ID=35053163

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/008623 WO2005099957A2 (en) 2004-03-31 2005-03-14 Pulsed laser processing with controlled thermal and physical alterations

Country Status (3)

Country Link
US (1) US7491909B2 (en)
JP (1) JP4788712B2 (en)
WO (1) WO2005099957A2 (en)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6275512B1 (en) 1998-11-25 2001-08-14 Imra America, Inc. Mode-locked multimode fiber laser pulse source
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US7173212B1 (en) * 2004-02-13 2007-02-06 Semak Vladimir V Method and apparatus for laser cutting and drilling of semiconductor materials and glass
US7486705B2 (en) 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
US7885311B2 (en) * 2007-03-27 2011-02-08 Imra America, Inc. Beam stabilized fiber laser
US7804043B2 (en) * 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
JP4649927B2 (en) * 2004-09-24 2011-03-16 アイシン精機株式会社 Laser-induced modification processing apparatus and method
US7508853B2 (en) 2004-12-07 2009-03-24 Imra, America, Inc. Yb: and Nd: mode-locked oscillators and fiber systems incorporated in solid-state short pulse laser systems
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
DE502006009433D1 (en) * 2006-03-03 2011-06-16 Fraunhofer Ges Forschung Device for the laser processing of a cornea
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
US20080006524A1 (en) * 2006-07-05 2008-01-10 Imra America, Inc. Method for producing and depositing nanoparticles
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
US20080187684A1 (en) * 2007-02-07 2008-08-07 Imra America, Inc. Method for depositing crystalline titania nanoparticles and films
DE102007056502B4 (en) * 2007-11-22 2010-07-29 Eads Deutschland Gmbh Method and device for building up residual stresses in a metallic workpiece
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
US20090141750A1 (en) * 2007-12-03 2009-06-04 Electro Scientific Industries, Inc. Systems and methods for link processing with ultrafast and nanosecond laser pulses
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
EP2252426A4 (en) 2008-03-21 2014-08-06 Imra America Inc Laser-based material processing methods and systems
US8125704B2 (en) * 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
US8309885B2 (en) * 2009-01-15 2012-11-13 Electro Scientific Industries, Inc. Pulse temporal programmable ultrafast burst mode laser for micromachining
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
WO2011018989A1 (en) 2009-08-11 2011-02-17 浜松ホトニクス株式会社 Laser machining device and laser machining method
US20120318776A1 (en) * 2009-09-24 2012-12-20 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9352416B2 (en) * 2009-11-03 2016-05-31 The Secretary, Department Of Atomic Energy, Govt. Of India Niobium based superconducting radio frequency(SCRF) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities
JP2011167709A (en) * 2010-02-17 2011-09-01 Mitsubishi Heavy Ind Ltd Welding method and superconduction accelerator
WO2011115243A1 (en) 2010-03-16 2011-09-22 アイシン精機株式会社 Pulse laser device, transparent member welding method, and transparent member welding device
CN102905839B (en) 2010-03-30 2016-03-09 Imra美国公司 Based on the materials processing apparatus and method of laser
JP5552373B2 (en) * 2010-06-02 2014-07-16 浜松ホトニクス株式会社 Laser processing method
US8211731B2 (en) * 2010-06-07 2012-07-03 Sunpower Corporation Ablation of film stacks in solar cell fabrication processes
WO2012005775A1 (en) * 2010-07-09 2012-01-12 Los Alamos National Security, Llc Laser induced breakdown spetroscopy instrumentation for real-time elemental analysis
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
KR20140018183A (en) 2010-09-16 2014-02-12 레이디안스, 아이엔씨. Laser based processing of layered materials
EP3650162B1 (en) * 2010-09-21 2021-10-27 Technical Institute of Physics and Chemistry, Chinese Academy of Sciences Laser micro/nano fabricating system and method of processing a metal ion solution
US8927897B2 (en) * 2010-11-17 2015-01-06 Rolls-Royce Corporation Laser maintenance tool
WO2012121920A2 (en) 2011-03-07 2012-09-13 Imra America, Inc. Optical pulse source with increased peak power
JP5862088B2 (en) * 2011-07-22 2016-02-16 アイシン精機株式会社 Laser cleaving method and laser cleaving apparatus
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
US8602845B2 (en) 2011-09-23 2013-12-10 United Technologies Corporation Strengthening by machining
US20140245608A1 (en) * 2011-10-07 2014-09-04 Canon Kabushiki Kaisha Method and apparatus for laser-beam processing and method for manufacturing ink jet head
JP6245678B2 (en) 2012-08-08 2017-12-13 住友重機械工業株式会社 Manufacturing method of semiconductor device
DE112013005821T5 (en) * 2012-10-16 2015-09-24 Imra America, Inc. Compact ultrashort pulse source amplifiers
EP2774712A1 (en) * 2013-03-07 2014-09-10 Siemens Aktiengesellschaft Laser method with different laser beam areas within a beam
JP5865303B2 (en) * 2013-07-12 2016-02-17 アイシン精機株式会社 Laser processing apparatus and laser processing method
CN104513004B (en) * 2013-09-30 2018-04-24 鸿富锦精密工业（深圳）有限公司 The cutting method of chemically reinforced glass
TWI624350B (en) 2013-11-08 2018-05-21 財團法人工業技術研究院 Powder shaping method and apparatus thereof
WO2015108991A2 (en) 2014-01-17 2015-07-23 Imra America, Inc. Laser-based modification of transparent materials
TWI564099B (en) 2014-12-24 2017-01-01 財團法人工業技術研究院 Composite beam generator and powder melting or sintering method using the same
DE112018002476T5 (en) 2017-07-25 2020-01-30 Imra America, Inc. MULTI PULSE GAIN
JP7096000B2 (en) * 2018-01-30 2022-07-05 浜松ホトニクス株式会社 Laser processing equipment and laser processing method
US20200316722A1 (en) * 2019-04-02 2020-10-08 Asm Technology Singapore Pte Ltd Optimised laser cutting
DE112020003796T8 (en) * 2019-08-06 2022-06-30 Panasonic Intellectual Property Management Co., Ltd. Dual wavelength laser systems and material processing using such systems
EP3991907A1 (en) * 2020-11-02 2022-05-04 Synova S.A. A method for turning a workpiece with a fluid-jet guided laser beam
EP4116030A1 (en) * 2021-07-09 2023-01-11 Aix-Marseille Université Method for optical writing in a semiconductor material, corresponding computer program product, storing medium and writing device
CN113601027A (en) * 2021-08-04 2021-11-05 广东工业大学 Double-laser composite invisible cutting method and processing system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326190A (en) * 2000-05-17 2001-11-22 Nec Corp Method and apparatus for processing thin film
US6399914B1 (en) * 2000-07-10 2002-06-04 Igor Troitski Method and laser system for production of high quality laser-induced damage images by using material processing made before and during image creation
US20020137311A1 (en) * 2000-12-21 2002-09-26 Mattson Technology, Inc. System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
US6574250B2 (en) * 2000-01-10 2003-06-03 Electro Scientific Industries, Inc. Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
US20030196995A1 (en) * 2002-04-18 2003-10-23 Dean Jennings Thermal flux processing by scanning
US20030216012A1 (en) * 2002-05-17 2003-11-20 Fujitsu Limited Method and apparatus for crystallizing semiconductor with laser beams
US20040214411A1 (en) * 2002-11-08 2004-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device, semiconductor device, and laser irradiation apparatus

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US576111A (en) * 1897-02-02 John henry green
US4306771A (en) 1980-05-27 1981-12-22 International Business Machines Corporation Optical pulse shaping device and method
JPH06114582A (en) * 1992-10-06 1994-04-26 Mitsui Petrochem Ind Ltd Pulse laser beam irradiating method for plated steel sheet
US5778016A (en) * 1994-04-01 1998-07-07 Imra America, Inc. Scanning temporal ultrafast delay methods and apparatuses therefor
US5656186A (en) 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
JP3156497B2 (en) * 1994-05-06 2001-04-16 松下電器産業株式会社 Processing method of metal film
US5742634A (en) 1994-08-24 1998-04-21 Imar Technology Co. Picosecond laser
US5539764A (en) 1994-08-24 1996-07-23 Jamar Technologies Co. Laser generated X-ray source
US5790574A (en) 1994-08-24 1998-08-04 Imar Technology Company Low cost, high average power, high brightness solid state laser
JP2682475B2 (en) 1994-11-17 1997-11-26 日本電気株式会社 Beam scanning type laser marking method and apparatus
US5756924A (en) 1995-09-28 1998-05-26 The Regents Of The University Of California Multiple laser pulse ignition method and apparatus
US5720894A (en) 1996-01-11 1998-02-24 The Regents Of The University Of California Ultrashort pulse high repetition rate laser system for biological tissue processing
US5761111A (en) 1996-03-15 1998-06-02 President And Fellows Of Harvard College Method and apparatus providing 2-D/3-D optical information storage and retrieval in transparent materials
GB9621049D0 (en) 1996-10-09 1996-11-27 Secr Defence Dielectric composites
US5911891A (en) * 1997-09-11 1999-06-15 Lsp Technologies, Inc. Laser shock peening with tailored multiple laser beams
JPH11145581A (en) * 1997-11-10 1999-05-28 Hitachi Seiko Ltd Method and equipment for drilling printed board
US6324195B1 (en) 1999-01-13 2001-11-27 Kaneka Corporation Laser processing of a thin film
EP1072350A1 (en) * 1999-07-12 2001-01-31 MDC Max Dätwyler AG Bleienbach Method and device for distributing the intensity in a laser beam
US7723642B2 (en) * 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US6281471B1 (en) 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US7671295B2 (en) 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US6541731B2 (en) 2000-01-25 2003-04-01 Aculight Corporation Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates
US6552301B2 (en) 2000-01-25 2003-04-22 Peter R. Herman Burst-ultrafast laser machining method
JP3522654B2 (en) * 2000-06-09 2004-04-26 住友重機械工業株式会社 Laser processing apparatus and processing method
JP2002040627A (en) 2000-07-24 2002-02-06 Nec Corp Method for correcting laser pattern and apparatus for correcting the same
US6806440B2 (en) * 2001-03-12 2004-10-19 Electro Scientific Industries, Inc. Quasi-CW diode pumped, solid-state UV laser system and method employing same
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
DE10125206B4 (en) * 2001-05-14 2005-03-10 Forschungsverbund Berlin Ev Process for direct microstructuring of materials
US6664498B2 (en) * 2001-12-04 2003-12-16 General Atomics Method and apparatus for increasing the material removal rate in laser machining
US6809291B1 (en) * 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
US7557977B2 (en) 2003-06-03 2009-07-07 Kilolambda Tech Ltd Laser pulse generator
WO2005018064A2 (en) 2003-08-19 2005-02-24 Electro Scientific Industries, Inc Generating sets of tailored laser pulses
US7038781B2 (en) * 2003-10-01 2006-05-02 Coherent, Inc. Time correlation of ultrafast laser pulses

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6574250B2 (en) * 2000-01-10 2003-06-03 Electro Scientific Industries, Inc. Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
JP2001326190A (en) * 2000-05-17 2001-11-22 Nec Corp Method and apparatus for processing thin film
US6399914B1 (en) * 2000-07-10 2002-06-04 Igor Troitski Method and laser system for production of high quality laser-induced damage images by using material processing made before and during image creation
US20020137311A1 (en) * 2000-12-21 2002-09-26 Mattson Technology, Inc. System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
US20030196995A1 (en) * 2002-04-18 2003-10-23 Dean Jennings Thermal flux processing by scanning
US20030216012A1 (en) * 2002-05-17 2003-11-20 Fujitsu Limited Method and apparatus for crystallizing semiconductor with laser beams
US20040214411A1 (en) * 2002-11-08 2004-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device, semiconductor device, and laser irradiation apparatus

Also Published As

Publication number Publication date
JP2007530292A (en) 2007-11-01
US20050218122A1 (en) 2005-10-06
JP4788712B2 (en) 2011-10-05
US7491909B2 (en) 2009-02-17
WO2005099957A2 (en) 2005-10-27

Similar Documents

Publication Publication Date Title
WO2005099957A3 (en) Pulsed laser processing with controlled thermal and physical alterations
WO2006079083A3 (en) Laser material micromachining with green femtosecond pulses
GB2452198A (en) Micromachining with short-pulsed, solid-state UV laser
WO2009120918A3 (en) Laser micromachining using programmable pulse shapes
WO2006094111A3 (en) Pulsed laser printing
WO2008027634A3 (en) Infrared laser wafer scribing using short pulses
WO2009008329A1 (en) Polarization plate
WO2010111089A3 (en) Laser micromachining with tailored bursts of short laser pulses
EP1836751A4 (en) LASER SYSTEM FOR GENERATION OF HIGH-POWER SUB- NANOSECOND PULSES WITH CONTROLABLE WAVELENGTHS IN 2-15 µm REGION
WO2005119860A3 (en) Method of providing consistent quality of target material removal by lasers having different output performance characteristics
WO2009100015A3 (en) Engineering flat surfaces on materials doped via pulsed laser irradiation
WO2010083091A3 (en) Pulse temporal programmable ultrafast burst mode laser for micromachining
AU6621101A (en) A security device
AU2002357031A1 (en) Method of laser milling
WO2006085992A3 (en) Radiation curable inkjet inks, method of manufacture, and methods of use thereof
AU2001278862A1 (en) High repetition rate gas discharge laser with precise pulse timing control
WO2010080189A9 (en) Absolute time encoded semi-active laser designation
WO2004086935A3 (en) System, apparatus and method for large area tissue ablation
WO2008135859A3 (en) Multiple output repetitively pulsed laser
DE60008760D1 (en) ANTHRAPYRIDONE COMPOUND, AQUEOUS MAGENTA INK COMPOSITION AND INK JET RECORDING METHOD
ATE548398T1 (en) RECORDING LIQUIDS
WO2009090643A3 (en) Laser surgical method
AU2003290431A1 (en) Substrate for ink jet head, ink jet head using the same, and manufacturing method thereof
Held et al. Quasi-CW solid state lasers expand their reach
WO2008003052A3 (en) Gemstone laser marking system and method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007506208

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase