WO2005113376A1 - Getter deposition for vacuum packaging - Google Patents
Getter deposition for vacuum packaging Download PDFInfo
- Publication number
- WO2005113376A1 WO2005113376A1 PCT/US2005/016788 US2005016788W WO2005113376A1 WO 2005113376 A1 WO2005113376 A1 WO 2005113376A1 US 2005016788 W US2005016788 W US 2005016788W WO 2005113376 A1 WO2005113376 A1 WO 2005113376A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- package
- getter
- deposited
- substrate
- cavity
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
- B65D81/2007—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum
- B65D81/2038—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum with means for establishing or improving vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Definitions
- This application claims priority to US Provisional Application Serial No. 60/570,554, filed May 13, 2004 and entitled, "Thin Film Getter Deposition For Vacuum Packaging.”
- This invention relates to getters, and more particularly, to getters that can be sputtered or otherwise deposited on inside surfaces of a vacuum sealed cavity or chamber.
- Background MEMS devices such as gyroscopes and other devices such as LR detectors often have a need for a good quality and stable vacuum environment to achieve defined performance levels for extended periods of time (e.g. up to 20 years).
- a getter is often placed within the vacuum cavity housing the device.
- Standard industry getters such as screened or sintered getters, often generate particles in conditions of High G mechanical shock or excessive mechanical vibration. Such particles can be detrimental to the function of the MEMS or other device housed within the vacuum cavity.
- many standard industry getters such as screened or sintered getters, are provided on a plate or other substrate, which is then welded or otherwise secured to the inside of the device package. This can be a time consuming and tedious process, and in some cases, can reduce the reliability and increase the cost of the resulting product.
- This invention relates to getters, and more particularly, to thin film getters that can be deposited on inside surfaces of a vacuum sealed cavity or chamber.
- the thin film getter can be deposited using, for example, sputtering, resistive evaporation, e- beam evaporation, or any other suitable deposition technique.
- a thin film getter can be provided in a vacuum sealed chamber housing a MEMS device, an infrared (TR) detection device such as microbolometer device, as well as many other type of devices that are housed in a reduced pressure or vacuum sealed cavity.
- TR infrared
- the thin film getter may be deposited directly on, for example, an inner surface of a device package such as a Leadless Chip Carrier (LCC) package or a wire bond package, on an inner surface of a wafer or other substrate facing a vacuum cavity when wafer level packaging is used, or on the inner surface of any other vacuum sealed chamber that houses a device or circuit.
- the thin film getter may be fired (i.e. activated) by the application of heat such as in a vacuum or inert gas prior to, during or after the vacuum seal is created.
- Figure 1 is a schematic cross-sectional side view of an illustrative device package with a thin film getter deposited on the back-side of the package lid;
- Figure 2 is a schematic cross-sectional side view of an illustrative device package with a thin film getter deposited on the back-side of the package lid and on the bottom wall of the device receiving cavity;
- Figure 3 is a schematic cross-sectional side view of an illustrative device package with a thin film getter deposited on the side walls of the device receiving cavity;
- Figure 4 is a schematic cross-sectional side view of an illustrative device package with a thin film getter deposited on the back side of the device itself;
- Figure 5 is a top view of an illustrative device package lid with a thin film getter deposited thereon;
- Figure 6 is a schematic cross-sectional side view of an illustrative top wafer and bottom wafer prior to wafer bonding, wherein the top wafer includes a thin film getter
- Description Figure 1 is a schematic cross-sectional side view of an illustrative device package with a thin film getter.
- the illustrative package is generally shown at 10, and includes a package housing 12 and a package lid 14 that define a device receiving cavity 16.
- the package is a Leadless Chip Carrier (LCC) package adapted for flip chip die bonding, but it may be any type of package that uses any type of die attach and/or wire bonding, as desired.
- the package housing 12 includes a number of bond pads 20a and 20b, which may be electrically connected to corresponding surface mount pads 22a and 22b.
- the surface mount pads 22a and 22b are typically aligned with and adapted to be bonded (e.g.
- the illustrative package housing 12 is configured to be flip-chip bonded to a device 24, however, other types of die bonding, die configurations and/or bonding techniques may be used.
- the device 24 is only shown schematically, and may be any type of device that might benefit from a reduced pressure or vacuum environment.
- the device 24 may be a MEMS device such as a gyroscope, an accelerometer, or any other type of MEMS device.
- the device 24 may be an IR detection device such as a microbolometer, or any other type of device, as desired.
- the illustrative device 24 includes a number of pads 28a and 28b, which are in registration with bond pads 20a and 20b of the package housing 12.
- the illustrative device 24 is shown flipped over, so that the pads 28a and 28b can be bonded to bond pads 20a and 20b, as is done in conventional flip-chip packaging.
- the package housing 12 and package lid 14 define a device receiving cavity 16.
- the device receiving cavity 16 may be exposed to a reduced pressure or vacuum, and the package lid 14 may be secured to the package housing 12, leaving a reduced pressure or vacuum environment in the device receiving cavity 16.
- a thin film getter 30 is deposited directly on the back side of the package lid 14.
- the thin film getter 30 is also patterned using a suitable patterning process.
- Figure 5 is a top view of an illustrative device package lid 14 with a thin film getter deposited and patterned thereon.
- the thin film getter 30 may be deposited in any number of ways including, for example, sputtering, evaporation such as resistive or e-beam evaporation, vapor deposition, atomic layer deposition, or any other suitable deposition technique.
- the thin film getter 30 may chemically adsorb many or all gases that are anticipated to enter or outgas into the device receiving cavity 16 including, for example, H 2 O, O 2 , CO, CO 2 , N 2 , H 2 and/or any other gases, as desired.
- the thin film, getter 30 may include any desired chemical composition, hi some cases, the thin film getter 30 may be Zirconium (Zr) and may be deposited using sputtering techniques. Zr possesses many chemical characteristics which may make it an attractive selection for the thin film getter 30.
- the thin film getter 30 may be Titanium (Ti), Boron (B), Cobalt (Co), Calcium (Ca), Strontium (Sr), Thorium( Th), combinations thereof, or any other suitable getter element, compounds or material, Generally, the thin film getter 30 may be any desired chemical composition deposited by using any desired deposition technique. In some embodiments, the thin film getter 30 is deposited in a stable form, and does not become active until fired, hi some cases, the thin film getter 30 may be fired through the application of heat. With respect to the illustrative embodiment of Figure
- the thin film getter 30 may be fired during the package sealing process where elevated temperature may be applied.
- the illustrative embodiment shown in Figure 2 is similar to that shown in Figure 1, but further includes a thin film getter 32 deposited directly on the bottom surface 34 of the package housing 12.
- the illustrative embodiment shown in Figure 3 is similar to that shown in Figures 1 and 2, but includes thin film getters 38 and 40 deposited on the side walls 44 and 46 of the package housing 12. As can be seen, it is contemplated that one or more thin film getters may be deposited anywhere in the device receiving cavity 16, including on the package housing 12 or package lid 14, as desired.
- Figure 4 is a schematic cross-sectional side view of an illustrative device package with a thin film getter 50 deposited on the back side 52 of the device itself 54.
- the device 54 is sawed from a wafer, and has one or more device components (not shown) fabricated on the front side 56 of the device 54.
- the thin film getter 50 is deposited on the back side of the wafer, either prior to or after sawing.
- the device 54 is then mounted in the package as described above, and in one embodiment, the thin film getter 50 is fired before, during or after the package sealing process.
- the thin film getter may be deposited on the front side 56 of the device, such as adjacent to the one or more device components that are fabricated on the front side 56 of the device 54.
- Figure 6 is a schematic cross-sectional side view of an illustrative top wafer 60 and bottom wafer 62, prior to wafer bonding, wherein the top wafer 60 includes a thin film getter 64 deposited thereon.
- the illustrative top wafer 60 and bottom wafer 62 may be made from any suitable material or material combination including, for example, silicon, glass, etc.
- the bottom wafer 62 has a number of MEMs components or devices 66 provided thereon.
- the top wafer 60 includes a recess 68, but this is not required in all embodiments, h the illustrative embodiment, the thin film getter 64 is deposited in the recess 68 of the top wafer. However, it is contemplated that the thin film getter may be deposited anywhere in the cavity that it will be exposed to the vacuum sealed cavity (see Figure
- Figure 7 is a schematic cross-sectional side view of the illustrative top wafer 60 and bottom wafer 62 of Figure 6 after wafer bonding.
- the top wafer 60 and bottom wafer 62 are exposed to a reduced pressure or vacuum environment, and then they are bonded together, thereby leaving a reduced pressure or vacuum environment in the cavity that contains the MEMs components or devices 66.
- the thin film getter 64 may be fired before, during or after the wafer bonding process.
- Figure 8 is a schematic cross-sectional side view of an illustrative MEMS gyroscope with a lower sense plate 70 on a lower substrate 72, a device layer 74 and an upper sense plate 76 on an upper substrate 78 prior to bonding the lower substrate 72, the device layer 74 and the upper substrate 78.
- the upper substrate 78 includes a patterned thin film getter 80
- the lower substrate 72 includes a patterned thin film getter 82. While thin film getters are shown on both the upper substrate 78 and lower substrate 72, it is contemplated that only the upper or lower substrates may include a thin film getter.
- a thin film getter may extend over the upper sense plate 76 and/or lower sense plate 70, if desired.
- a thin film getter may be provided on the device layer 74, such as adjacent to the MEMS mechanism defined therein.
- Figure 9 is a schematic cross-sectional side view of the illustrative MEMS gyroscope of Figure 8 after the lower substrate 72, the device layer 74 and the upper substrate 78 are bonded together in a vacuum environment.
- the thin film getters may be fired before, during or after the wafer bonding process.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05749763A EP1751029A1 (en) | 2004-05-13 | 2005-05-13 | Getter deposition for vacuum packaging |
JP2007513405A JP2007537040A (en) | 2004-05-13 | 2005-05-13 | Attachment of getter for vacuum package |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57055404P | 2004-05-13 | 2004-05-13 | |
US60/570,554 | 2004-05-13 | ||
US10/932,906 | 2004-09-02 | ||
US10/932,906 US20050253283A1 (en) | 2004-05-13 | 2004-09-02 | Getter deposition for vacuum packaging |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005113376A1 true WO2005113376A1 (en) | 2005-12-01 |
Family
ID=34969914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/016788 WO2005113376A1 (en) | 2004-05-13 | 2005-05-13 | Getter deposition for vacuum packaging |
Country Status (5)
Country | Link |
---|---|
US (2) | US20050253283A1 (en) |
EP (1) | EP1751029A1 (en) |
JP (1) | JP2007537040A (en) |
KR (1) | KR20070024590A (en) |
WO (1) | WO2005113376A1 (en) |
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Also Published As
Publication number | Publication date |
---|---|
KR20070024590A (en) | 2007-03-02 |
JP2007537040A (en) | 2007-12-20 |
EP1751029A1 (en) | 2007-02-14 |
US20050253283A1 (en) | 2005-11-17 |
US20060214247A1 (en) | 2006-09-28 |
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