WO2006014196A1 - System and method for encapsulation and protection of components - Google Patents
System and method for encapsulation and protection of components Download PDFInfo
- Publication number
- WO2006014196A1 WO2006014196A1 PCT/US2005/016541 US2005016541W WO2006014196A1 WO 2006014196 A1 WO2006014196 A1 WO 2006014196A1 US 2005016541 W US2005016541 W US 2005016541W WO 2006014196 A1 WO2006014196 A1 WO 2006014196A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- barrier system
- component assembly
- margin portion
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to a system and method for encapsulating and protecting a component assembly and, more particularly, to a system and method that uses elastomers to protectively surround and encase at least a portion of the component assembly.
- encapsulation to protectively surround a component has traditionally been achieved by encasing the component with a hard polymeric casing and thereafter using silicone, polyurethane, epoxy, or hot melt adhesive to encase the component within the hard casing.
- the polyurethane or epoxy encapsulating materials are typically injected into the casing at a low pressure to surround the electronics and then is cured in place to position the electronics within the casing.
- a problem with known encapsulation methods includes the corrosion or degradation of the sensitive electrical components when moisture penetrates the encapsulant and contacts the components. Moreover, in applications when the component assembly is subject to vibration, the electrical components may debond from the encapsulant. This results in an entry being created for moisture or debris within the encapsulant.
- Another problem with the traditionally manufactured assemblies includes providing a sealed, hard outer casing, which is often the most expensive constituent of the package.
- the hard casing design is usually manufactured by first creating a series of molds that are significantly expensive and not subject to easy design modification. Also, during the assembly process there are multiple steps required to position and encapsulate the component to the casing at additional added expense.
- U.S. Patent 5,755,026 One such example of a known component assembly is disclosed by U.S. Patent 5,755,026.
- a plastic foam is formed to a desired shape to surround the components.
- multiple steps are required to form such an enclosure and the foam filler does not offer enough protection from contamination or impact.
- U.S. Patent 5,736,190 is more complex method of fighting moisture and debris, using a reaction of two oligomers to create a cured co-polymer layer around an electrical component.
- this patent is directed at being a moisture barrier and does not provide for any protection from physical damages or impacts that could occur to the component.
- U.S. Patent 6,458,628 discloses a semiconductor chip attachment with a dielectric layer.
- the dielectric layer is attached to the semiconductor with a thixotropic fluid that is cured to form an encapsulant.
- a thixotropic fluid that is cured to form an encapsulant.
- U.S. Patent 6,439,698 discloses a method for creating a dual function encapsulating material.
- the disclosed epoxy material has two cure mechanisms. After the material is applied to the electrical connections, a first cure is initiated by radiation to crosslink the epoxy materials and encapsulate the electrical connections. Then a second cure is performed with heat to adhere the electrical connections to the body of a cartridge.
- the process by which the materials are joined tends to be time consuming resulting in a multiple step process which is expensive to implement.
- the apparatus comprises a RFID device and a barrier system adapted to encase at least a portion of the RFID component assembly.
- the barrier system includes a first layer defining a first set of physical properties and including a first margin portion and a second layer defining a second set of physical properties and including a second margin portion, the first margin portion being interlinked to the second margin portion to form continuous transitory material therebetween.
- Another aspect of the present disclosure is directed to a method for manufacturing an apparatus for providing a RFID.
- This method comprises constructing a RFED device configured to transmit a radio frequency transparently, arranging a barrier system around the RFID device to encase at least a portion of the RFID device, interlinking a first layer and a second layer of the barrier system, and causing the first layer and the second layer to conform to the shape of the RFID device.
- Another aspect of the present disclosure is directed to a method for protecting a RFID device from environmental and physical impact.
- This method comprises arranging a barrier system to encase at least a portion of the RFID device, interlinking a first layer with a second layer of the barrier system, and causing the first layer and the second layer to conform to the shape of the RFID device.
- the RFID device comprises a barrier system adapted to encase at least a portion of the RFID device.
- the barrier system includes a first layer defining a first set of physical properties and including a first margin portion, and a second layer defining a second set of physical properties and including a second margin portion.
- the first margin portion is interlinked to the second margin portion to form a continuous transitory material therebetween.
- the RFID device has a first layer defining a first set of physical properties and including a first margin portion and a second layer defining a second set of physical properties and including a second margin portion.
- the first margin portion is interlinked to the second margin portion to form a continuous transitory material therebetween.
- the method comprises the second layer receiving an impact and the first layer responsively absorbing the vibration and movement of the second layer into the first layer.
- Fig. 1 is a perspective view of an exemplary embodiment of a component protection package according to the present disclosure with a cutaway portion to show the encased component assembly;
- Fig. 2 is a cross-sectional view of the exemplary embodiment of the component protection package shown in Fig. 1 ;
- Fig. 3 is a close-up view of the interlinked layers of the cross- sectional view of the exemplary embodiment of the component protection package shown in Fig. 2;
- Fig. 4 is a cross-sectional view of a second embodiment of a component protection package according to the present disclosure.
- Fig. 5 is a cross-sectional view of a third embodiment of a component protection package according to the present disclosure.
- Fig. 6 is a cross sectional view of a component protection package according to one embodiment of the present disclosure attached to a machine.
- Fig. 1 illustrates a component protection package consistent with an exemplary embodiment of the present disclosure, which is generally designated by 100.
- the component protection package 100 includes a barrier system 110 surrounding a component assembly 105 such as a circuit board, for example.
- the component assembly 105 may be any number of items that could be subject to harsh environments and impacts or vibrations.
- Fig. 2 is a cross-sectional view of the exemplary embodiment of the component protection package shown in Fig. 1.
- the barrier system 110 includes a first layer 120 that may be overlayed, at least in part, by a second layer 130.
- the barrier system also comprises an inner surface 125 that may contact the component assembly 105 and an outer surface 135.
- the first layer 120 that has been adapted to surround the component assembly 105 generally has a pliable structure.
- the inner surface 125 of the barrier system 110 may generally be in contact with the component assembly 105 and may be physically or chemically bonded to the component assembly 105.
- the structure of the second layer 130 that may overlay the first layer 120 may generally be rigid and the outer surface 135 may constitute a hard outer shell of the barrier system 110.
- Fig. 3 is a close-up view of the interlinked layers of the cross- sectional view of the exemplary embodiment of the component protection package shown in Fig. 2.
- the first layer 120 includes a first margin portion 123 that comes into contact with the second margin portion 133 of the second layer 130.
- the first margin portion 123 of the first layer 120 may be interlinked to the second margin portion 133 of the second layer 130 such that the layers are not prone to delamination. This is generally because of a continuous transitory material that may be formed where the first margin portion 123 of the first layer 120 interlinks with the second margin portion 133 of the second layer 130.
- the first layer 120 and the second layer 130 are structured and arranged to encase the component assembly 105.
- These layers may generally be comprised of elastomers or similar materials that have the necessary structure and are capable of being interlinked together to encase the component assembly 105 and provide multiple degrees of protection to the component assembly 105. Proper selection of these materials may allow for the first margin portion 123 to be interlinked to the second margin portion 133 such that the transitory material is formed having physical characteristics, different from that of the materials comprising the first layer 120 and the second layer 130.
- the first layer 120 may comprise a first elastomer and the second layer 130 may comprise a second elastomer.
- the first elastomer may be formulated for low stiffness, lower than that of the second elastomer, to give it a pliable structure.
- the second elastomer may be formulated for a high stiffness, higher than that of the first elastomer, to create a rigid structure.
- the stiffness of elastomers and other similar materials may be measured using the material Shore hardness.
- the first elastomer may typically have a Shore A hardness between 25 and 60.
- the second elastomer may typically have a Shore D hardness between 35 and 80.
- the second elastomer may generally be selected having a similar base elastomer to the first elastomer with a similar cross-linking agent.
- the cross-linking agent is what generally causes the molecules within the first elastomer to become irreversibly connected to the molecules in the second elastomer.
- the cross-linking agent is activated once it reaches its activation temperature and should be selected such that it has an activation temperature at a low enough temperature so that the temperature would not damage the chosen component assembly 105.
- the cross-linking agent may be, but is not limited to, peroxide based or sulfur based cross-linking agents.
- One method of formulating the first elastomer is to use high plasticizer loadings in a lightly filled elastomer.
- One method for formulating the second elastomer is to use high filler loadings in an elastomer and thermoplastic polymer blend.
- the thermoplastic polymer should be chosen so that it is compatible with the elastomer and has a glass transition temperature below the cross-linking temperature of the formulation and below the desired maximum processing temperature.
- the thermoplastic polymer can be any one of a number of materials, such as thermoplastic epoxy, amorphous polyamide, styrenic, cellulosic, and non-crystalline polyesters, for example, or any other material known by those of ordinary skill in the art.
- a variety of polymer combinations have also been found acceptable for the first elastomer and the second elastomer.
- a first combination of polymers could consist of using millable polyurethane with dioctylsebacate or aliphatic oil as a plasticizer for the first elastomer and millable polyurethane with thermoplastic epoxy for the second elastomer.
- Another combination of polymers could consist of using nitrile rubber with oligomeric polyisoprene as a plasticizer for the first elastomer and nitrile rubber with high temperature polyamide hot melt adhesive for the second elastomer.
- Another combination of polymers could consist of using nitrile rubber with oligomeric polyisoprene as a plasticizer for the first elastomer and nitrile PVC copolymer with additional PVC powder for stiffening and thermoplastic properties for the second elastomer.
- nitrile rubber with oligomeric polyisoprene as a plasticizer for the first elastomer
- nitrile PVC copolymer with additional PVC powder for stiffening and thermoplastic properties for the second elastomer.
- Proper selection of materials may also enable various component assemblies 105 to be encased by the barrier system 110.
- RFID radio frequency identification
- the materials chosen for the first layer 120 and the second layer 130 would be very important to their operation. In instances such as this, materials would need to be selected that are transparent to the transmission of those radio frequencies.
- the barrier system 110 is structured and arranged about the component assembly 105 such that it is protectively surrounded, the component assembly 105 may also have such inherent rigidity and strength that it may increase the overall rigidity and strength of the barrier system 110. Depending on the size and shape of the component assembly 105 and where it is used, the barrier system 110, by incorporating the structure and functionality of the component assembly 105, may be more resilient to physical damage due to bending or impact.
- Figs. 4 and 5 are cross-sectional views of a second embodiment and a third embodiment of a component protection package 100. These component protection packages 100 differ from Fig. 2 in the degree to which the first layer 120 and the second layer 130 extend about the component assembly 105.
- Fig. 4 shows a component protection package with the barrier system 110 being structured and arranged about the component assembly 105 such that one side of the component assembly is not encased.
- Fig. 5 shows a component protection package where the first layer 120 is structured and arranged about the component assembly 105 on all sides and the second layer 130 is structured and arranged about the first layer 120 on all sides.
- first and second layers such as, for example, the first layer 120 and the second layer 130 may include distinct sub-layers designed for additional protection of the component assembly 105. These additional sub-layers may also be designated separately as an interlinked layer of the encapsulation system, or one of a plurality of layers designed for additional protection of the component assembly 105 such that there may be an additional generally pliable outer layer. Furthermore, each of the layers previously described are interchangeable such that the first layer 120 may be generally rigid while the second layer 130 may be generally pliable.
- a method of creating a barrier system to protect a component therein comprises causing a first layer of the barrier system to be interlinked with a second layer of the barrier system and causing the first layer and the second layer to be molded so as to surround the component.
- the materials and the processing method are selected. Selection of the materials and processing method may be done such that the first margin portion 123 of the first layer 120 may be interlinked to the second margin portion 133 of the second layer 130 and the inner surface 125 may be formed to the component assembly 105.
- the degree of protection and the amount of the component assembly 105 that will be encased may be determined based upon foreseeable use.
- the first layer 120 may be adapted to protectively surround the component 105.
- the second layer 130 may be structured and arranged to encase the first layer 120 and the component assembly 105 as needed. Curing may then occur using one of a number of methods including, but not limited to applying heat, pressure, ultraviolet light, or other cure mechanism to the component protection package 100. Compression molding may be used to apply pressure and heat to the mold, but the molding and curing will depend upon the selected materials and their processing characteristics as well as a preferred geometry of the encapsulants. Other molding techniques to mold the layers may include, but is not limited to transfer molding and injection molding.
- the component protection package 100 may be removed from the mold. It may be necessary to establish a maximum processing temperature for the selected component assembly 105 to ensure that the materials and associated cure operation have a cure temperature that is not above the maximum allowable temperature of the component assembly 105 being protected.
- the component protection package 100 comprises a barrier system 110 and a component assembly 105.
- the barrier system 110 has a first layer 120 that is interlinked to a second layer 130 to conform to the shape of the component assembly 105 and encase at least a part of the component assembly 105. More specifically, interlinking a first margin portion 123 of the first layer 120 and a second margin portion 133 of the second layer 130 creates the barrier system 110.
- the first layer 120 and the second layer 130 may work together to prevent damage that each layer alone may not prevent. For example, if something impacts the outer surface of the barrier system 135, the second layer 130 will accept the blow and damage while the first layer 120 will absorb vibrations and movement of the second layer 130 into the first layer 120.
- the first layer 120 may be adapted to surround the component and protect the component from environmental damage due to moisture, dirt, dust, debris, diesel fuel, vibration, oil, etc.
- the second layer 130 may be structured and arranged to encase the first layer 120 and the component assembly 105 to protect the component assembly 105 from physical damage due to handling, impacts, or other damage that the first layer 120 cannot protect.
- the second layer 130 may be required to withstand the same environmental problems as the first layer 120 such that the second layer 130 does not break down and become less resilient to physical damage.
- the present disclosure provides an improved system and method for encapsulating and protecting a component assembly 105 from environmental and physical damage.
- This barrier system 110 serves to protect the component assembly 105 from physical impacts and harsh environments that can result in damage.
- the barrier system 110 has greater impact strength than many competing enclosures while at the same time providing excellent resistance to vibration, moisture, and debris.
- Embodiments of the present disclosure are applicable to a number of situations where electronic components are susceptible to a number of severe environments or physical situations.
- component assemblies 105 such as sensors, monitors, and the like in severe environments, such as in the oil pan of an engine, in a fuel tank, in underwater applications, in areas with high rates of corrosion, and the like.
- the component protection package 100 may be placed in areas that may be subject to physical abuse, such as where high vibration levels exist, on machines, on machine implements, and the like.
- component protection package 100 may be attached to an item 99 such as a machine, a machine implement, a piece of equipment, an equipment attachment, a part, a container, and the like.
- communications may be necessary and preferably done by wireless communication means, such as by satellite, cellular, and other radio frequency technologies.
- RFE radio frequency
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007519203A JP2008508574A (en) | 2004-07-02 | 2005-05-12 | System and method for encapsulating and protecting components |
EP05747658A EP1766680A1 (en) | 2004-07-02 | 2005-05-12 | System and method for encapsulation and protection of components |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/884,722 US7390551B2 (en) | 2004-07-02 | 2004-07-02 | System and method for encapsulation and protection of components |
US10/884,722 | 2004-07-02 | ||
US11/034,081 | 2005-01-12 | ||
US11/034,081 US7210635B2 (en) | 2004-07-02 | 2005-01-12 | System and method for encapsulation and protection of components |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006014196A1 true WO2006014196A1 (en) | 2006-02-09 |
Family
ID=34969423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/016541 WO2006014196A1 (en) | 2004-07-02 | 2005-05-12 | System and method for encapsulation and protection of components |
Country Status (4)
Country | Link |
---|---|
US (1) | US7210635B2 (en) |
EP (1) | EP1766680A1 (en) |
JP (1) | JP2008508574A (en) |
WO (1) | WO2006014196A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009000889A1 (en) * | 2007-06-26 | 2008-12-31 | Nokia Corporation | Protecting a functional component and a protected functional component |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070197299A1 (en) * | 2006-02-14 | 2007-08-23 | Ubi-Trak | Secure Gaming Chip |
WO2007110254A1 (en) * | 2006-03-29 | 2007-10-04 | International Business Machines Corporation | Rfid tag application method and adapted tag |
JP5143451B2 (en) * | 2007-03-15 | 2013-02-13 | オンセミコンダクター・トレーディング・リミテッド | Semiconductor device and manufacturing method thereof |
CN101739586A (en) * | 2009-12-31 | 2010-06-16 | 上海杰远环保科技有限公司 | Composite multilayer radio frequency identification transmitting component and method for manufacturing same |
DE102012220693A1 (en) * | 2012-11-13 | 2014-05-15 | Trumpf Medizin Systeme Gmbh + Co. Kg | Protective device for a HMI device |
JP2014183302A (en) * | 2013-03-21 | 2014-09-29 | Mitsubishi Electric Corp | Semiconductor module and method of manufacturing the same |
US9626620B2 (en) | 2013-06-05 | 2017-04-18 | Haemonetics Corporation | Frangible RFID tag and method of producing same |
EP3010816B1 (en) | 2013-06-18 | 2019-05-08 | Haemonetics Corporation | Rfid tag and method of securing same to object |
US10399256B1 (en) * | 2018-04-17 | 2019-09-03 | Goodrich Corporation | Sealed circuit card assembly |
JP7094000B2 (en) * | 2018-06-28 | 2022-07-01 | 帝国通信工業株式会社 | Electronic components with lead wires |
JP7094001B2 (en) * | 2018-06-28 | 2022-07-01 | 帝国通信工業株式会社 | Electronic components with lead wires |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2951063A1 (en) * | 1979-12-19 | 1981-06-25 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Applying solid setting resin coating to circuit board etc. - using liquid setting resin painted etc. over board and powder resin applied before first sets |
JPS6167246A (en) * | 1984-09-10 | 1986-04-07 | Nec Corp | Hybrid integrated circuit device |
EP0308676A2 (en) * | 1987-09-25 | 1989-03-29 | Siemens Aktiengesellschaft | Non-tensile coating for electrical and electronic components, especially for hybrid circuits |
US20040043515A1 (en) * | 2002-08-29 | 2004-03-04 | Bernd Goller | Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2423531C3 (en) | 1974-05-15 | 1979-03-08 | Wacker-Chemie Gmbh, 8000 Muenchen | Process for the production of organopolysiloxane compositions curable to give elastomers |
US4163072A (en) | 1977-06-07 | 1979-07-31 | Bell Telephone Laboratories, Incorporated | Encapsulation of circuits |
US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
US5500065A (en) * | 1994-06-03 | 1996-03-19 | Bridgestone/Firestone, Inc. | Method for embedding a monitoring device within a tire during manufacture |
US5952065A (en) * | 1994-08-31 | 1999-09-14 | Nike, Inc. | Cushioning device with improved flexible barrier membrane |
JPH08316411A (en) * | 1995-05-18 | 1996-11-29 | Hitachi Ltd | Semiconductor device |
US6025054A (en) * | 1997-09-08 | 2000-02-15 | Cardxx, Inc. | Smart cards having glue-positioned electronic components |
US6241153B1 (en) * | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
US6031459A (en) * | 1998-07-22 | 2000-02-29 | Micron Technology, Inc. | Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices |
SG80077A1 (en) * | 1998-10-19 | 2001-04-17 | Sony Corp | Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
US6688353B1 (en) * | 2000-03-31 | 2004-02-10 | Bridgestone/Firestone North American Tire, Llc | Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire |
US6914094B2 (en) | 2000-09-29 | 2005-07-05 | Solvay Engineered Polymers, Inc. | Engineered polyolefin materials with enhanced surface durability |
-
2005
- 2005-01-12 US US11/034,081 patent/US7210635B2/en active Active
- 2005-05-12 JP JP2007519203A patent/JP2008508574A/en not_active Withdrawn
- 2005-05-12 WO PCT/US2005/016541 patent/WO2006014196A1/en active Application Filing
- 2005-05-12 EP EP05747658A patent/EP1766680A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2951063A1 (en) * | 1979-12-19 | 1981-06-25 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Applying solid setting resin coating to circuit board etc. - using liquid setting resin painted etc. over board and powder resin applied before first sets |
JPS6167246A (en) * | 1984-09-10 | 1986-04-07 | Nec Corp | Hybrid integrated circuit device |
EP0308676A2 (en) * | 1987-09-25 | 1989-03-29 | Siemens Aktiengesellschaft | Non-tensile coating for electrical and electronic components, especially for hybrid circuits |
US20040043515A1 (en) * | 2002-08-29 | 2004-03-04 | Bernd Goller | Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 236 (E - 428) 15 August 1986 (1986-08-15) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009000889A1 (en) * | 2007-06-26 | 2008-12-31 | Nokia Corporation | Protecting a functional component and a protected functional component |
Also Published As
Publication number | Publication date |
---|---|
EP1766680A1 (en) | 2007-03-28 |
US20060000916A1 (en) | 2006-01-05 |
US7210635B2 (en) | 2007-05-01 |
JP2008508574A (en) | 2008-03-21 |
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