WO2006017224A3 - Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package - Google Patents
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Download PDFInfo
- Publication number
- WO2006017224A3 WO2006017224A3 PCT/US2005/024538 US2005024538W WO2006017224A3 WO 2006017224 A3 WO2006017224 A3 WO 2006017224A3 US 2005024538 W US2005024538 W US 2005024538W WO 2006017224 A3 WO2006017224 A3 WO 2006017224A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- die
- spacer
- package
- grid array
- attach region
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007521536A JP5005534B2 (en) | 2004-07-13 | 2005-07-11 | Semiconductor multi-package module comprising a die and an inverted land grid array package stacked over a ball grid array package |
KR1020077000112A KR100996318B1 (en) | 2004-07-13 | 2005-07-11 | Semiconductor Multipackage Module Including Die and Inverted Land Grid Array Package Stacked Over Ball Grid Array Package |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58742804P | 2004-07-13 | 2004-07-13 | |
US60/587,428 | 2004-07-13 | ||
US11/022,375 US7253511B2 (en) | 2004-07-13 | 2004-12-23 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
US11/022,375 | 2004-12-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006017224A2 WO2006017224A2 (en) | 2006-02-16 |
WO2006017224A3 true WO2006017224A3 (en) | 2006-08-10 |
Family
ID=35598593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/024538 WO2006017224A2 (en) | 2004-07-13 | 2005-07-11 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
Country Status (5)
Country | Link |
---|---|
US (3) | US7253511B2 (en) |
JP (1) | JP5005534B2 (en) |
KR (1) | KR100996318B1 (en) |
TW (1) | TWI380431B (en) |
WO (1) | WO2006017224A2 (en) |
Families Citing this family (73)
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US7253511B2 (en) * | 2004-07-13 | 2007-08-07 | Chippac, Inc. | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
US7745918B1 (en) | 2004-11-24 | 2010-06-29 | Amkor Technology, Inc. | Package in package (PiP) |
US7361986B2 (en) * | 2004-12-01 | 2008-04-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Heat stud for stacked chip package |
KR100593703B1 (en) * | 2004-12-10 | 2006-06-30 | 삼성전자주식회사 | Semiconductor chip stack package with dummy chips for reinforcing protrusion wire bonding structure |
JP2006276463A (en) * | 2005-03-29 | 2006-10-12 | Sharp Corp | Module for optical device and method of manufacturing module for optical device |
JP4748648B2 (en) * | 2005-03-31 | 2011-08-17 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
TWI292224B (en) * | 2005-09-02 | 2008-01-01 | Advanced Semiconductor Eng | Multi-chip package structure |
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JP4930970B2 (en) * | 2005-11-28 | 2012-05-16 | ルネサスエレクトロニクス株式会社 | Multi-chip module |
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JP5605222B2 (en) * | 2008-05-09 | 2014-10-15 | 国立大学法人九州工業大学 | Three-dimensional mounting semiconductor device and manufacturing method thereof |
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US8987056B2 (en) * | 2008-11-19 | 2015-03-24 | Stats Chippac Ltd. | Integrated circuit package system with support carrier and method of manufacture thereof |
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JP2008507134A (en) | 2008-03-06 |
US7253511B2 (en) | 2007-08-07 |
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US7829382B2 (en) | 2010-11-09 |
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WO2006017224A2 (en) | 2006-02-16 |
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