WO2006019460A3 - Method of assembling a semiconductor component and apparatus therefor - Google Patents

Method of assembling a semiconductor component and apparatus therefor Download PDF

Info

Publication number
WO2006019460A3
WO2006019460A3 PCT/US2005/018863 US2005018863W WO2006019460A3 WO 2006019460 A3 WO2006019460 A3 WO 2006019460A3 US 2005018863 W US2005018863 W US 2005018863W WO 2006019460 A3 WO2006019460 A3 WO 2006019460A3
Authority
WO
WIPO (PCT)
Prior art keywords
piece
assembling
semiconductor component
apparatus therefor
pedestal
Prior art date
Application number
PCT/US2005/018863
Other languages
French (fr)
Other versions
WO2006019460A2 (en
Inventor
Audel A Sanchez
Taek K Kim
Original Assignee
Freescale Semiconductor Inc
Audel A Sanchez
Taek K Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc, Audel A Sanchez, Taek K Kim filed Critical Freescale Semiconductor Inc
Priority to JP2007521469A priority Critical patent/JP4833972B2/en
Priority to CN200580020481.1A priority patent/CN1973174B/en
Publication of WO2006019460A2 publication Critical patent/WO2006019460A2/en
Publication of WO2006019460A3 publication Critical patent/WO2006019460A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of assembling a semiconductor component includes providing a pedestal (61), placing a first piece (52) on the pedestal, wherein the first piece comprises a semiconductor die (54), placing a second piece (56, 58) over the first piece, and providing an adhesive (60) between the first piece and the second piece. The method further includes applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece, and applying heat with a second plate to reflow the adhesive, wherein applying heat is performed simultaneously with applying pressure.
PCT/US2005/018863 2004-07-15 2005-05-27 Method of assembling a semiconductor component and apparatus therefor WO2006019460A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007521469A JP4833972B2 (en) 2004-07-15 2005-05-27 Method for assembling semiconductor components
CN200580020481.1A CN1973174B (en) 2004-07-15 2005-05-27 Method of assembling a semiconductor component and apparatus therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/891,648 2004-07-15
US10/891,648 US7101736B2 (en) 2004-07-15 2004-07-15 Method of assembling a semiconductor component and apparatus therefor

Publications (2)

Publication Number Publication Date
WO2006019460A2 WO2006019460A2 (en) 2006-02-23
WO2006019460A3 true WO2006019460A3 (en) 2006-09-14

Family

ID=35599987

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/018863 WO2006019460A2 (en) 2004-07-15 2005-05-27 Method of assembling a semiconductor component and apparatus therefor

Country Status (4)

Country Link
US (1) US7101736B2 (en)
JP (1) JP4833972B2 (en)
CN (1) CN1973174B (en)
WO (1) WO2006019460A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090309199A1 (en) * 2008-06-12 2009-12-17 Keith Richard Barkley Chip package for semiconductor devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509464A (en) * 1993-07-30 1996-04-23 Applied Materials, Inc. Method and apparatus for cooling rectangular substrates
US6204090B1 (en) * 1997-12-05 2001-03-20 The Charles Stark Draper Laboratory, Inc. Method for attaching a die to a carrier utilizing an electrically nonconductive layer
US6534839B1 (en) * 1999-12-23 2003-03-18 Texas Instruments Incorporated Nanomechanical switches and circuits

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854085A (en) * 1992-06-04 1998-12-29 Lsi Logic Corporation Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
JPH07249705A (en) * 1994-03-09 1995-09-26 Fujitsu Ltd Cap sealing unit for electronic device
US5535515A (en) * 1995-03-13 1996-07-16 Jacoby; John Method of manufacturing a stress-free heatsink assembly
US5877555A (en) * 1996-12-20 1999-03-02 Ericsson, Inc. Direct contact die attach
US6028365A (en) * 1998-03-30 2000-02-22 Micron Technology, Inc. Integrated circuit package and method of fabrication
JP2950821B1 (en) * 1998-04-02 1999-09-20 三星電子株式会社 Die bonding equipment
US6261868B1 (en) * 1999-04-02 2001-07-17 Motorola, Inc. Semiconductor component and method for manufacturing the semiconductor component
US6462413B1 (en) * 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
US6351032B1 (en) * 2000-01-20 2002-02-26 National Semiconductor Corporation Method and structure for heatspreader attachment in high thermal performance IC packages
JP2001351999A (en) * 2000-06-09 2001-12-21 Seiko Epson Corp Method and device for forming package
US6576494B1 (en) * 2000-06-28 2003-06-10 Micron Technology, Inc. Recessed encapsulated microelectronic devices and methods for formation
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
US6534859B1 (en) * 2002-04-05 2003-03-18 St. Assembly Test Services Ltd. Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
JP3984107B2 (en) * 2002-06-07 2007-10-03 株式会社住友金属エレクトロデバイス Manufacturing method of high-frequency semiconductor element storage package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509464A (en) * 1993-07-30 1996-04-23 Applied Materials, Inc. Method and apparatus for cooling rectangular substrates
US6204090B1 (en) * 1997-12-05 2001-03-20 The Charles Stark Draper Laboratory, Inc. Method for attaching a die to a carrier utilizing an electrically nonconductive layer
US6534839B1 (en) * 1999-12-23 2003-03-18 Texas Instruments Incorporated Nanomechanical switches and circuits

Also Published As

Publication number Publication date
US7101736B2 (en) 2006-09-05
CN1973174B (en) 2011-04-20
WO2006019460A2 (en) 2006-02-23
JP4833972B2 (en) 2011-12-07
CN1973174A (en) 2007-05-30
US20060014325A1 (en) 2006-01-19
JP2008507132A (en) 2008-03-06

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