WO2006025309A1 - プローブ針、プローブ針の製造方法および三次元立体構造の製造方法 - Google Patents
プローブ針、プローブ針の製造方法および三次元立体構造の製造方法 Download PDFInfo
- Publication number
- WO2006025309A1 WO2006025309A1 PCT/JP2005/015637 JP2005015637W WO2006025309A1 WO 2006025309 A1 WO2006025309 A1 WO 2006025309A1 JP 2005015637 W JP2005015637 W JP 2005015637W WO 2006025309 A1 WO2006025309 A1 WO 2006025309A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe needle
- manufacturing
- zigzag
- groove
- metal layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Definitions
- the present invention relates to a probe needle, a method for manufacturing the probe needle, and a method for manufacturing a three-dimensional structure.
- the present invention relates to a probe needle having a complicated shape, a manufacturing method thereof, and a manufacturing method of a three-dimensional structure.
- US Pat. No. 6,255,126 discloses a probe needle that can be brought into contact with a panel and is formed by sequentially laminating a plurality of layers.
- US Patent Application No. 2003Z0113990 discloses a cantilever probe needle supported by a plurality of legs and a method for manufacturing the probe needle.
- the present invention has been made in view of the problems as described above.
- the probe needles can be densely arranged, and the probe needles having an arbitrary shape and the probe needle manufacturing method for manufacturing the probe needles by a simple method are provided. And it aims at providing the manufacturing method of a three-dimensional solid structure.
- a probe needle according to the present invention includes a plurality of zigzag folded beams having one end fixed, and a connecting portion provided at the other end of the plurality of zigzag folded beams for connecting the plurality of zigzag folded beams.
- the contactor is provided on the opposite side of the beam of the connecting portion.
- the plurality of zigzag beams include a pair of beams bent at a predetermined cycle, and the pair of zigzag beams have the same bending cycle.
- the pair of zigzag beams have mutually different bending phases.
- the pair of zigzag beams are 180 degrees apart from each other in bending phase.
- one end of the probe needle is preferably connected to an interposer.
- a method of manufacturing a probe needle having a long beam and a contactor provided at the tip of the beam includes the steps of preparing a substrate, Forming a film having a shaped groove; forming a metal layer in the groove; and removing the substrate and film to remove the metal layer.
- the beam-shaped groove has a zigzag pattern.
- the zigzag folding pattern includes a first zigzag folding pattern and a second zigzag folding pattern provided at a position away from the first zigzag folding pattern.
- the first and second zigzag folding patterns are bent at a predetermined cycle.
- a positioning groove corresponding to each of the first and second zigzag grooves may be formed. Good.
- the bonding material is preferably an insulating interlayer film.
- the insulating interlayer film is an organic resin material.
- the method further includes a step of fixing the base of the beam
- the step of fixing the base of the beam includes a step of preparing a beam holding member having a fixing portion for fixing the base of the beam
- the beam holding member Has a plurality of fixing portions, and each of the fixing portions of the plurality of beam holding members is The base of the beam formed of a metal layer by removing a part of the membrane from the base side of the membrane beam, which has a connecting hole with a large surface side and a narrow inner side and joined with a joining material
- the beam holding member is preferably an interposer.
- the method includes a step of connecting the metal layer beam formed in the first and second zigzag patterns and the contactor.
- a method of manufacturing a three-dimensional structure includes a first step of preparing a substrate, and a second step of forming a film having a groove having a desired complicated shape on the substrate. Including a step, a third step of forming a metal layer within the groove, and removing the substrate and film to remove the metal layer, thereby forming a desired layer formed of the metal layer. Forms a complex three-dimensional structure.
- a step of preparing a plurality of substrates each having a metal layer formed in the groove and a metal layer formed in the prepared groove are formed.
- the step of superimposing the plurality of substrates each having a metal layer formed inside the prepared groove includes a fourth step of forming a positioning hole for positioning, Steps 1 to 4 are repeated to prepare a plurality of positioning holes and a plurality of substrates having a metal layer formed in the groove, and a plurality of substrates having a metal layer formed in the prepared groove. And a step of overlapping each other with the positioning hole as a reference.
- connection portion for connecting a plurality of zigzag beams is provided at the other end of the plurality of zigzag beams having one end fixed, and a contactor is provided at the connection portion. Provided. Since the contactor is held by the two zigzag beams, the beam is bent with a predetermined bending strength only in the direction in which the zigzag bending portion exists.
- the probe needle according to the present invention can obtain a desired bending strength by adjusting the bending period of the bent beam.
- a method of manufacturing a probe needle having a long beam and a contactor provided at the tip of the beam includes the steps of preparing a substrate, Forming a film having a shaped groove; forming a metal layer in the groove; and removing the substrate and film to remove the metal layer.
- the beam portion of the probe needle can be formed by forming a groove on the plane of the substrate, it is possible to easily form an arbitrarily complex beam.
- FIG. 1 is a perspective view of a probe needle according to an embodiment of the present invention.
- FIG. 2A is a plan view of a substrate in an intermediate step of a method for manufacturing a probe needle beam.
- FIG. 2B is a cross-sectional view taken along line BB in FIG. 2A.
- FIG. 3A is a plan view of a wafer in an intermediate step of a method for manufacturing a probe needle beam.
- FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A.
- FIG. 4A is a plan view of a wafer in an intermediate step of a method for manufacturing a probe needle beam.
- FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A.
- FIG. 4C is a plan view showing a photoresist layer.
- FIG. 5 is a diagram showing a method of forming a plurality of probe beams.
- FIG. 6 is a diagram showing details of the connection state of FIG.
- FIG. 7 is a diagram showing a method of manufacturing a probe needle beam for each step.
- FIG. 8 is a diagram showing a state in which a plurality of probe needle beams are connected.
- FIG. 9 is a view showing another embodiment of a method for attaching a probe needle to an interposer.
- FIG. 10 is a view showing another example of the shape of the probe needle according to the present invention.
- FIG. 1 is a perspective view showing a probe needle according to an embodiment of the present invention.
- a probe needle 10 connects two zigzag beams 14a and 14b, one end (base) of which is fixed to a block 15, and the other end of two zigzag beams 14a and 14b. It includes a connecting part 12 and a contactor 11 provided on the connecting part 12 and in contact with the object to be inspected.
- two probe needles 10 are provided on the block 15.
- each of the two zigzag beams 14a and 14b is bent at a predetermined period (interval), and the bending force of the bending force of one beam 14a in the height direction is as follows. Form a pair of folds so that the phase is exactly 180 degrees out of alignment with the concave bend of the other beam 14b.
- the probe needle 10 is a pair of zigzag beams 14 that are 180 degrees out of phase with each other, and is supported by the block 15 in the form of a cantilever beam.
- the probe needle 10 can only bend in the direction (direction indicated by X in the figure). Since the direction in which the probe needle tilts can be controlled, a plurality of probe needles 10 can be arranged densely.
- the pair of zigzag beams 14a and 14b may be beams having the same phase.
- the probe needle 10 that can be bent more easily in a predetermined direction can be obtained.
- the bending strength of the beams can be adjusted by adjusting the phase shift of the spelled beams 14a and 14b forming this pair.
- the zigzag beam is not limited to a bent portion and a straight portion as shown in the figure, and may be bent continuously in a curved line or bent at an acute angle. May be
- Fig. 1 the case where two probe needles 10 are provided in one block 15 is described.
- the present invention is not limited to this, and one or three or more may be used as one. It may be provided in block 15.
- the block 15 may be any force as long as the probe needle 10 is fixed.
- the block 15 is an interposer as will be described later.
- 2 to 7 are diagrams showing the method for manufacturing the probe needle 10 according to the embodiment of the present invention step by step.
- FIG. 2 (A) is a plan view
- FIG. 2 (B) is a cross-sectional view of a portion indicated by BB in FIG. 2 (A) (the same applies to FIGS. 3 and 4 below).
- a seed layer for example, Au layer
- a groove having a desired shape is formed on the seed layer 21 using, for example, a photoresist 23 as a portion to be a probe needle beam.
- a photoresist 23 as a portion to be a probe needle beam.
- FIG. 3 on a single Si (SiO or SiN) wafer 20, it is folded so as to be symmetrical with respect to the center line.
- the alignment side 27 and the alignment hole 26 are used for positioning as will be described later.
- the portion to be the beam of the probe needle 10 is formed on the Si wafer 20 in a planar manner, a beam having an arbitrary shape can be formed.
- zigzag-shaped plating layers eg, Au layers
- the seed layer forms the four exposed sides 27 and the central side 28 provided around the exposed portion of the seed layer 21, that is, the pair of zigzag-shaped mesh layers 24a and 24b.
- the substrate thus removed for example, it is removed by melting, and as shown in FIG. 4 (C), a photoresist layer 31 having a folded-shaped plating layer 24 and a matching hole 26 is taken out.
- FIG. 4 (C) a photoresist layer 31 having a folded-shaped plating layer 24 and a matching hole 26 is taken out.
- FIG. 5 shows the formation of a plurality of pairs of probe needles using the photo-resist layer 31 that has been extracted in FIG. It is a figure which shows the method to do.
- FIG. 5 (A) shows the state in which the photoresist layers 31 each having a wavy folds 24a, 24b having different phase phases are sequentially stacked, and FIG. A contactor 12 is arranged, connected to the free end 18 of the zigzag fold layer 24a formed in layer 31.
- FIG. 5 (C) is a diagram showing a connection surface of the silicon interposer 40 having a plurality of fixing portions 41 for fixing the base portion 17 of the zigzag wrapping layer. .
- the force drawn so that the connecting portion 12 does not have a thickness.
- the connecting portion 12 has a predetermined thickness as shown in FIG.
- the photoresist layer 31 having the zigzag folding layers 24a and 24b and the force that the zigzag folding layers 24a and 24b also have a predetermined depth are understood in FIG. 5, FIG.
- the photoresist layer 31 is indicated by a solid line, and the plating layers 24a and 24b are indicated by bold lines.
- the separated photoresist layer 31 as shown in FIG. 4C is aligned with reference to the alignment hole 26 as shown in FIG. 5A.
- Figure 6 shows the alignment at this time.
- four photoresist layers 3 la to 3 Id are aligned.
- the plurality of photoresist layers 31 may be aligned by accurately manufacturing the above-described alignment side 27 that is not the alignment hole 26.
- each of the photoresist layers 31a to 31d is bonded with a bonding material 33 for temporary fixing.
- an insulating interlayer film is preferable.
- the insulating interlayer film may be an organic resin material such as electrodeposited polyimide. This is because the organic resin material such as electrodeposited polyimide has elasticity, and as described later, alignment becomes easy.
- connection 12 is placed for every two free ends.
- the connecting portion 12 is formed of, for example, Au, and is similarly connected to the Au forming the folded-shaped plating layer 24 by metal bonding.
- the plurality of connecting portions 13 are integrated in advance and placed on the free ends 18 of the plurality of photoresist layers 31.
- the connecting portion 13 and the free end 18 of the photoresist layer 31 can be connected more easily.
- the base portion 17 of the photoresist layer 31 is similarly connected to the fixing portion 41 of the silicon interposer 40.
- the fixing portion 41 is made of, for example, Au, and is metal-bonded to the respective base portions 17 of the photoresist layer 31.
- FIG. 7 shows a state in which the Si wafer 20 and the photoresist 31 are melted and removed after each connection portion 12 and the fixed portion 41 of the silicon interposer 40 are connected.
- photoresist 23 since photoresist 23 is used, it is removed by melting.
- a resin-based or metal-based resist can also be used, and it depends on the resist to be used. In addition to melting, it may be removed by ashing or the like with acid.
- FIG. 8 is a diagram showing another embodiment of the present invention.
- FIGS. 5 to 7 show the case where there is no particular problem with the alignment of the zigzag beam 35 and the fixing portion 41 provided in the silicon interposer 40.
- FIG. 5 to 7 show the case where there is no particular problem with the alignment of the zigzag beam 35 and the fixing portion 41 provided in the silicon interposer 40.
- FIG. 5 to 7 show the case where there is no particular problem with the alignment of the zigzag beam 35 and the fixing portion 41 provided in the silicon interposer 40.
- FIG. 8A is a view corresponding to FIG. 4C in the previous embodiment
- FIG. 8B is a view in which a plurality of photoresists shown in FIG. 8A are joined. It is a figure which shows the state which looked at the lower surface force of things.
- the force shown in the figure in the state in which two spelled layers are formed on the photoresist layer 51 is used as it is.
- a plurality may be joined.
- the photoresist layer 51 varies depending on the thickness at which the photoresist 23 is formed.
- the pitch between the layers of the dies is dl.
- the pitch dl at which the base portion 17 of the zigzag beam 35 is formed can generally vary by about plus or minus 5 depending on the dimensions when the photoresist 23 is formed.
- the interval at which the fixing portion 41 connected to the base portion 17 is formed on the surface of the silicon interposer 40 has a certain dimension (for example, d2).
- Photoresist layer 3 The dimension d3 between the base portions 17a and 17b of the pair of zigzag beams 35 formed in 1 is formed with a photolithography, and is therefore positioned with a very high accuracy.
- the dimension d 1 of the base portion in the thickness direction of the photoresist layer 31 and the corresponding interval between the fixing portions 41 of the silicon interposer 40 are always required. But they do not match.
- FIG. 9 is a diagram showing the contents of processing for the photoresist layer 31 and the silicon interposer 40 when dealing with such a state.
- FIG. 9A is a view showing the base side of the beam in the photoresist layer 51 in FIG.
- Fig. 9 (B) is a diagram showing a state in which an anchor pile 37 is formed from the state shown in Fig. 9 (A) by etching a certain amount of the base side force of the beam.
- FIG. 9C shows a state in which a pyramid window is provided as a connection portion 41 on the surface of the silicon interposer substrate 40.
- FIG. 9 (D) is an arrow view seen from the direction indicated by IX in FIG. 8, and in the lower part, the photoresist 23 is removed as shown in FIG. 9 (B). The anchor pile 37 is exposed.
- FIG. 9E is a cross-sectional view of a portion indicated by E—E in FIG. 9C.
- a wiring layer 46 is formed on the surface of the silicon interposer 40, and the wiring layer 46 has through holes 47. Connected to the wiring layer 48 on the back side through the!
- connection portions 42 formed on the surface of the silicon interposer substrate 40 is displayed. Does not match.
- a pyramid window 42 is formed of an insulating film on the fixed portion 41 so that the opening is large and narrows inside.
- the pitch of anchor piles 37a and 37b is dl, and between pyramid windows 42a and 42b Even if the pitch of the wires is different as shown in d2, the connecting member 33 such as electrodeposited polyimide has elasticity and can be expanded and contracted in the direction indicated by the arrow in FIG.
- the piles 37a and 37b are inserted into the pyramid windows 42a and 42b as shown by the thick arrows in the figure, and the zigzag beam 35 and the fixed part 41 of the silicon interposer 40 are connected with a tensile force. .
- the pyramid windows 42a and 42b have a rectangular opening on the surface, and the force is a shape having an inclination inside the four sides of the rectangle.
- the shape may have a taper in only one direction.
- the anchor pile 37 may be formed into a cylindrical shape so as to form a conical window.
- FIG. 10 shows another embodiment of the present invention.
- a probe needle beam 50 having a complicated shape is formed in a fixing portion 41 of a silicon interposer 40.
- the beam of the probe needle is formed by photolithography with the resist, as shown here, the beam 50 for the probe needle having an arbitrarily complicated shape can be formed. .
- the formation of a probe needle beam having an arbitrarily complicated shape has been described.
- the present invention is not limited to this, and the method shown in FIG. As described above, the present invention may be applied to a method of manufacturing a three-dimensional structure having an arbitrary complicated shape.
- the complicated shape means a shape including at least a shape that cannot be formed with a single stroke.
- a beam having an arbitrary shape is formed using a photoresist and photolithography
- the present invention is not limited to this, and the beam is a probe needle. Any film can be used to form the beam shape as long as it can form a partial groove.
- the present invention is not limited to this and can be applied to an interposer formed of an arbitrary material.
- the present invention is not limited to this, and the metal layer may be formed by an arbitrary method.
- Au is used as the plating layer.
- the present invention is not limited to this, and any metal may be used.
- the probe needle according to the present invention can be advantageously used as a probe needle because the beam portion is formed in a flat shape, so that a probe needle having an arbitrarily complex shape can be formed.
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020077006685A KR100861733B1 (ko) | 2004-08-30 | 2005-08-29 | 프로브 침, 및 프로브 침의 제조 방법 |
KR1020087016587A KR100888841B1 (ko) | 2004-08-30 | 2005-08-29 | 삼차원 입체 구조의 제조 방법 |
US11/661,349 US7619424B2 (en) | 2004-08-30 | 2005-08-29 | Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure |
US12/576,111 US8159256B2 (en) | 2004-08-30 | 2009-10-08 | Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004251081A JP2006064676A (ja) | 2004-08-30 | 2004-08-30 | プローブ針、プローブ針の製造方法および三次元立体構造の製造方法 |
JP2004-251081 | 2004-08-30 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/661,349 A-371-Of-International US7619424B2 (en) | 2004-08-30 | 2005-08-29 | Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure |
US12/576,111 Division US8159256B2 (en) | 2004-08-30 | 2009-10-08 | Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006025309A1 true WO2006025309A1 (ja) | 2006-03-09 |
Family
ID=35999963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/015637 WO2006025309A1 (ja) | 2004-08-30 | 2005-08-29 | プローブ針、プローブ針の製造方法および三次元立体構造の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7619424B2 (ja) |
JP (1) | JP2006064676A (ja) |
KR (2) | KR100861733B1 (ja) |
TW (1) | TW200624816A (ja) |
WO (1) | WO2006025309A1 (ja) |
Cited By (1)
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JP2016076580A (ja) * | 2014-10-06 | 2016-05-12 | 富士通株式会社 | インターポーザ、プリント基板ユニット、及び情報処理装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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US7688095B2 (en) * | 2004-07-30 | 2010-03-30 | International Business Machines Corporation | Interposer structures and methods of manufacturing the same |
JP2007078359A (ja) * | 2005-09-09 | 2007-03-29 | Japan Electronic Materials Corp | プローブの基板への取り付け方法およびそれに用いるプローブユニット |
JP4859572B2 (ja) * | 2006-07-18 | 2012-01-25 | 日本電子材料株式会社 | プローブカードの製造方法 |
KR100821674B1 (ko) * | 2007-08-27 | 2008-04-14 | 이재하 | 프로브 어셈블리 |
JP5303772B2 (ja) * | 2007-12-27 | 2013-10-02 | 日本電子材料株式会社 | 接触子構造体および接触子の実装方法 |
KR100984876B1 (ko) * | 2008-05-08 | 2010-10-04 | 한국기계연구원 | 가변강성 기능을 가진 수직형 미세 접촉 프로브 |
US8970238B2 (en) * | 2011-06-17 | 2015-03-03 | Electro Scientific Industries, Inc. | Probe module with interleaved serpentine test contacts for electronic device testing |
WO2013101240A1 (en) | 2011-12-31 | 2013-07-04 | Intel Corporation | Manufacturing advanced test probes |
US9279830B2 (en) | 2011-12-31 | 2016-03-08 | Intel Corporation | Test probe structures and methods including positioning test probe structures in a test head |
JP6341634B2 (ja) * | 2013-05-28 | 2018-06-13 | 新光電気工業株式会社 | プローブガイド板及びその製造方法、半導体検査装置 |
JP6706076B2 (ja) * | 2016-01-14 | 2020-06-03 | 新光電気工業株式会社 | プローブガイド板及びその製造方法とプローブ装置 |
JP7292921B2 (ja) * | 2019-03-29 | 2023-06-19 | 株式会社日本マイクロニクス | 多ピン構造プローブ体及びプローブカード |
CN111579837B (zh) * | 2020-05-18 | 2022-09-20 | 武汉精毅通电子技术有限公司 | 一种适用于大电流高速信号测试的探针及连接器 |
KR102431964B1 (ko) * | 2020-09-11 | 2022-08-12 | 주식회사 오킨스전자 | 멀티-레이어 콘택 핀 |
TWI751940B (zh) * | 2021-04-14 | 2022-01-01 | 中華精測科技股份有限公司 | 探針卡裝置及類彈簧探針 |
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2004
- 2004-08-30 JP JP2004251081A patent/JP2006064676A/ja active Pending
-
2005
- 2005-08-29 WO PCT/JP2005/015637 patent/WO2006025309A1/ja active Application Filing
- 2005-08-29 KR KR1020077006685A patent/KR100861733B1/ko not_active IP Right Cessation
- 2005-08-29 US US11/661,349 patent/US7619424B2/en not_active Expired - Fee Related
- 2005-08-29 KR KR1020087016587A patent/KR100888841B1/ko not_active IP Right Cessation
- 2005-08-30 TW TW094129709A patent/TW200624816A/zh not_active IP Right Cessation
-
2009
- 2009-10-08 US US12/576,111 patent/US8159256B2/en not_active Expired - Fee Related
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JP2001343397A (ja) * | 2000-06-01 | 2001-12-14 | Sumitomo Electric Ind Ltd | コンタクトプローブおよびその製造方法 |
JP2003121468A (ja) * | 2001-10-17 | 2003-04-23 | Anritsu Corp | 電極プローバー |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2016076580A (ja) * | 2014-10-06 | 2016-05-12 | 富士通株式会社 | インターポーザ、プリント基板ユニット、及び情報処理装置 |
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KR20070045348A (ko) | 2007-05-02 |
US8159256B2 (en) | 2012-04-17 |
KR20080073791A (ko) | 2008-08-11 |
JP2006064676A (ja) | 2006-03-09 |
US20070259506A1 (en) | 2007-11-08 |
US7619424B2 (en) | 2009-11-17 |
KR100861733B1 (ko) | 2008-10-06 |
TWI306511B (ja) | 2009-02-21 |
KR100888841B1 (ko) | 2009-03-17 |
US20100077597A1 (en) | 2010-04-01 |
TW200624816A (en) | 2006-07-16 |
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