WO2006029265A3 - Liquid cooled heat sink with cold plate retention mechanism - Google Patents
Liquid cooled heat sink with cold plate retention mechanism Download PDFInfo
- Publication number
- WO2006029265A3 WO2006029265A3 PCT/US2005/031996 US2005031996W WO2006029265A3 WO 2006029265 A3 WO2006029265 A3 WO 2006029265A3 US 2005031996 W US2005031996 W US 2005031996W WO 2006029265 A3 WO2006029265 A3 WO 2006029265A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooled heat
- liquid cooled
- cold plate
- heat sink
- retention mechanism
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60793304P | 2004-09-08 | 2004-09-08 | |
US60/607,933 | 2004-09-08 | ||
US11/220,456 US7149087B2 (en) | 2004-09-08 | 2005-09-07 | Liquid cooled heat sink with cold plate retention mechanism |
US11/220,456 | 2005-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006029265A2 WO2006029265A2 (en) | 2006-03-16 |
WO2006029265A3 true WO2006029265A3 (en) | 2007-01-11 |
Family
ID=35995984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/031996 WO2006029265A2 (en) | 2004-09-08 | 2005-09-08 | Liquid cooled heat sink with cold plate retention mechanism |
Country Status (2)
Country | Link |
---|---|
US (2) | US7149087B2 (en) |
WO (1) | WO2006029265A2 (en) |
Families Citing this family (78)
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US8289711B2 (en) * | 2010-08-20 | 2012-10-16 | Hamilton Sundstrand Corporation | Integrated thermal packaging of high power motor controller |
US8659896B2 (en) | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
US8199505B2 (en) | 2010-09-13 | 2012-06-12 | Toyota Motor Engineering & Manufacturing Norh America, Inc. | Jet impingement heat exchanger apparatuses and power electronics modules |
US8550148B2 (en) * | 2010-10-13 | 2013-10-08 | Kunshan Jue-Choung Electronics Co., Ltd. | Heat plate with clip |
KR101796448B1 (en) * | 2010-12-03 | 2017-11-10 | 삼성전자주식회사 | Board water jacket jig system and method of separating board water jacket |
US8427832B2 (en) | 2011-01-05 | 2013-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
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JP5920356B2 (en) * | 2011-10-25 | 2016-05-18 | 富士通株式会社 | Water cooling device, electronic device having water cooling device, and water cooling method |
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CN103188916A (en) * | 2011-12-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | Radiator and electronic device with same |
US8937810B2 (en) | 2012-09-14 | 2015-01-20 | International Business Machines Corporation | Electronic assembly with detachable coolant manifold and coolant-cooled electronic module |
JP6262422B2 (en) * | 2012-10-02 | 2018-01-17 | 昭和電工株式会社 | Cooling device and semiconductor device |
US8643173B1 (en) | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
US9066460B2 (en) | 2013-01-17 | 2015-06-23 | International Business Machines Corporation | Disassemblable electronic assembly with leak-inhibiting coolant capillaries |
FR3002411B1 (en) * | 2013-02-20 | 2015-03-06 | Bull Sas | THERMAL DISSIPATOR FOR PROCESSOR |
US9497888B2 (en) * | 2013-02-27 | 2016-11-15 | International Business Machines Corporation | Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) |
TWI487923B (en) * | 2013-06-18 | 2015-06-11 | Chroma Ate Inc | Test the temperature control module |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
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US9435590B2 (en) | 2014-04-07 | 2016-09-06 | Microsoft Technology Licensing, Llc | Thin heat transfer device for thermal management |
US10182513B2 (en) * | 2015-01-16 | 2019-01-15 | Hamilton Sundstrand Space Systems International, Inc. | Phase change material heat sinks |
JP2016213314A (en) * | 2015-05-08 | 2016-12-15 | 富士通株式会社 | Cooling module and electronic device |
US9655281B2 (en) | 2015-06-26 | 2017-05-16 | Seagate Technology Llc | Modular cooling system |
US20170229377A1 (en) * | 2016-02-04 | 2017-08-10 | International Business Machines Corporation | Liquid manifold structure for direct cooling of lidded electronics modules |
TWM537248U (en) * | 2016-10-07 | 2017-02-21 | Evga Corp | Heat dissipating apparatus for display card |
US10168749B2 (en) | 2016-12-01 | 2019-01-01 | Intel Corporation | Cooling using adjustable thermal coupling |
US10390455B2 (en) * | 2017-03-27 | 2019-08-20 | Raytheon Company | Thermal isolation of cryo-cooled components from circuit boards or other structures |
US10481651B2 (en) * | 2017-12-07 | 2019-11-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Integrated PCU and GPU cooling system |
FR3075560B1 (en) * | 2017-12-15 | 2020-10-16 | Bull Sas | LIQUID COOLING SYSTEM FOR ELECTRONIC BOARD CONSISTING OF A COLD PLATE AND THERMAL SINKERS CONNECTED IN FLEXIBLE LINKS WITH THE SAID COLD PLATE |
JP7024870B2 (en) * | 2018-06-27 | 2022-02-24 | 富士電機株式会社 | Coolers, semiconductor modules and vehicles |
CN108882634B (en) * | 2018-06-29 | 2023-08-22 | 苏州宏科金属制品有限公司 | Metal stamping sheet for heat dissipation of electronic product |
US10840167B2 (en) | 2018-11-19 | 2020-11-17 | Advanced Micro Devices, Inc. | Integrated heat spreader with configurable heat fins |
CN210008008U (en) * | 2018-11-30 | 2020-01-31 | 富顶精密组件(深圳)有限公司 | locking structure for fixing chip module and backboard structure thereof |
TWI684743B (en) * | 2019-01-04 | 2020-02-11 | 雙鴻科技股份有限公司 | Rotatable water cooling tube and electronic device having the same |
EP3977832A4 (en) | 2019-04-14 | 2023-07-26 | Jetcool Technologies, Inc. | Direct contact fluid based cooling module |
GB2584991B (en) * | 2019-05-21 | 2022-01-26 | Iceotope Group Ltd | Cold plate |
US11277937B2 (en) * | 2019-07-31 | 2022-03-15 | Jetcool Technologies Inc. | Re-entrant flow cold plate |
EP3893274A1 (en) * | 2020-04-07 | 2021-10-13 | ABB Schweiz AG | Cooling element and method of manufacturing a cooling element |
US11785740B2 (en) * | 2020-06-26 | 2023-10-10 | Lear Corporation | High-voltage junction box coolant baffle |
KR20220001196A (en) * | 2020-06-29 | 2022-01-05 | 에스케이하이닉스 주식회사 | Liquid cooling structure and liquid cooling system having the same |
US11963341B2 (en) | 2020-09-15 | 2024-04-16 | Jetcool Technologies Inc. | High temperature electronic device thermal management system |
US11800666B2 (en) | 2021-06-28 | 2023-10-24 | International Business Machines Corporation | Temporary removable module lid |
US11910578B2 (en) * | 2021-09-23 | 2024-02-20 | Contitech Techno-Chemie Gmbh | Vehicle electronics cooling systems and methods |
US11968803B2 (en) * | 2021-12-22 | 2024-04-23 | Baidu Usa Llc | Two phase immersion system with local fluid accelerations |
DE102022103542A1 (en) | 2022-02-15 | 2023-08-17 | Thermal Grizzly Holding Gmbh | Mounting frame, heat distribution system, method for pressing a heat spreader onto a microprocessor device and use of a mounting frame for pressing a heat spreader onto a microprocessor device |
TWI799176B (en) * | 2022-03-09 | 2023-04-11 | 英業達股份有限公司 | Water cooling plate assembly |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5089936A (en) * | 1988-09-09 | 1992-02-18 | Hitachi, Ltd. | Semiconductor module |
US5150274A (en) * | 1990-07-11 | 1992-09-22 | Hitachi, Ltd. | Multi-chip-module |
US5208728A (en) * | 1991-04-12 | 1993-05-04 | Telefunken Electronic Gmbh | Housing for fitting in motor vehicles to hold electronic components |
US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
US6631077B2 (en) * | 2002-02-11 | 2003-10-07 | Thermal Corp. | Heat spreader with oscillating flow |
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-
2005
- 2005-09-07 US US11/220,456 patent/US7149087B2/en active Active
- 2005-09-08 WO PCT/US2005/031996 patent/WO2006029265A2/en active Application Filing
-
2006
- 2006-12-12 US US11/637,633 patent/US7414844B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5089936A (en) * | 1988-09-09 | 1992-02-18 | Hitachi, Ltd. | Semiconductor module |
US5150274A (en) * | 1990-07-11 | 1992-09-22 | Hitachi, Ltd. | Multi-chip-module |
US5208728A (en) * | 1991-04-12 | 1993-05-04 | Telefunken Electronic Gmbh | Housing for fitting in motor vehicles to hold electronic components |
US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
US6631077B2 (en) * | 2002-02-11 | 2003-10-07 | Thermal Corp. | Heat spreader with oscillating flow |
Also Published As
Publication number | Publication date |
---|---|
US7149087B2 (en) | 2006-12-12 |
US7414844B2 (en) | 2008-08-19 |
US20060050483A1 (en) | 2006-03-09 |
WO2006029265A2 (en) | 2006-03-16 |
US20070188991A1 (en) | 2007-08-16 |
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