WO2006052433A3 - Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios - Google Patents
Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios Download PDFInfo
- Publication number
- WO2006052433A3 WO2006052433A3 PCT/US2005/038279 US2005038279W WO2006052433A3 WO 2006052433 A3 WO2006052433 A3 WO 2006052433A3 US 2005038279 W US2005038279 W US 2005038279W WO 2006052433 A3 WO2006052433 A3 WO 2006052433A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing composition
- silicon oxide
- silicon nitride
- removal rate
- oxide removal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020077012608A KR101117401B1 (en) | 2004-11-05 | 2005-10-21 | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
JP2007540341A JP5102040B2 (en) | 2004-11-05 | 2005-10-21 | Polishing composition and method having higher removal rate of silicon nitride than silicon oxide |
CN2005800408876A CN101065458B (en) | 2004-11-05 | 2005-10-21 | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
EP05815470.9A EP1831321B1 (en) | 2004-11-05 | 2005-10-21 | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
IL182797A IL182797A (en) | 2004-11-05 | 2007-04-26 | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/982,486 | 2004-11-05 | ||
US10/982,486 US7504044B2 (en) | 2004-11-05 | 2004-11-05 | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006052433A2 WO2006052433A2 (en) | 2006-05-18 |
WO2006052433A3 true WO2006052433A3 (en) | 2006-08-31 |
Family
ID=35840203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/038279 WO2006052433A2 (en) | 2004-11-05 | 2005-10-21 | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
Country Status (10)
Country | Link |
---|---|
US (2) | US7504044B2 (en) |
EP (1) | EP1831321B1 (en) |
JP (1) | JP5102040B2 (en) |
KR (1) | KR101117401B1 (en) |
CN (1) | CN101065458B (en) |
IL (1) | IL182797A (en) |
MY (2) | MY160422A (en) |
SG (1) | SG157354A1 (en) |
TW (1) | TWI323274B (en) |
WO (1) | WO2006052433A2 (en) |
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2004
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Also Published As
Publication number | Publication date |
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TW200630472A (en) | 2006-09-01 |
SG157354A1 (en) | 2009-12-29 |
CN101065458A (en) | 2007-10-31 |
MY149519A (en) | 2013-09-13 |
US7846842B2 (en) | 2010-12-07 |
JP5102040B2 (en) | 2012-12-19 |
KR101117401B1 (en) | 2012-02-29 |
EP1831321A2 (en) | 2007-09-12 |
JP2008519466A (en) | 2008-06-05 |
KR20070085738A (en) | 2007-08-27 |
IL182797A (en) | 2011-08-31 |
MY160422A (en) | 2017-03-15 |
EP1831321B1 (en) | 2015-06-24 |
US20060099814A1 (en) | 2006-05-11 |
WO2006052433A2 (en) | 2006-05-18 |
IL182797A0 (en) | 2007-08-19 |
TWI323274B (en) | 2010-04-11 |
CN101065458B (en) | 2012-09-05 |
US20090137124A1 (en) | 2009-05-28 |
US7504044B2 (en) | 2009-03-17 |
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