WO2006078462A3 - Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same - Google Patents
Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same Download PDFInfo
- Publication number
- WO2006078462A3 WO2006078462A3 PCT/US2006/000335 US2006000335W WO2006078462A3 WO 2006078462 A3 WO2006078462 A3 WO 2006078462A3 US 2006000335 W US2006000335 W US 2006000335W WO 2006078462 A3 WO2006078462 A3 WO 2006078462A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- emitting device
- semiconductor light
- conductive lead
- cavity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/035,716 | 2005-01-14 | ||
US11/035,716 US7777247B2 (en) | 2005-01-14 | 2005-01-14 | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006078462A2 WO2006078462A2 (en) | 2006-07-27 |
WO2006078462A3 true WO2006078462A3 (en) | 2006-09-14 |
Family
ID=36609427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/000335 WO2006078462A2 (en) | 2005-01-14 | 2006-01-06 | Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same |
Country Status (3)
Country | Link |
---|---|
US (1) | US7777247B2 (en) |
TW (1) | TW200711166A (en) |
WO (1) | WO2006078462A2 (en) |
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KR100735432B1 (en) * | 2006-05-18 | 2007-07-04 | 삼성전기주식회사 | Light emitting device package and light emitting device package array |
US20080074505A1 (en) * | 2006-07-26 | 2008-03-27 | Intematix Corporation | Phosphors for enhancing sensor responsivity in short wavelength regions of the visible spectrum |
TWM317075U (en) * | 2006-08-25 | 2007-08-11 | Yun Dai | Heat dissipation structure of light emitting diode |
TW200814362A (en) * | 2006-09-13 | 2008-03-16 | Bright Led Electronics Corp | Light-emitting diode device with high heat dissipation property |
KR101053049B1 (en) * | 2008-12-17 | 2011-08-01 | 삼성엘이디 주식회사 | LED package |
US8598602B2 (en) * | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
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US9269875B2 (en) * | 2009-05-20 | 2016-02-23 | Intellectual Discovery Co., Ltd. | Light emitter |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
US9385285B2 (en) * | 2009-09-17 | 2016-07-05 | Koninklijke Philips N.V. | LED module with high index lens |
US8664753B2 (en) * | 2009-11-25 | 2014-03-04 | Infineon Technologies Ag | Semiconductor device with protruding component portion and method of packaging |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD643819S1 (en) | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
MY170920A (en) | 2010-11-02 | 2019-09-17 | Carsem M Sdn Bhd | Leadframe package with recessed cavity for led |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
TWM405642U (en) * | 2010-12-30 | 2011-06-11 | Forward Electronics Co Ltd | Trichromatic light emitting diode module |
TW201251140A (en) * | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
WO2012109225A1 (en) | 2011-02-07 | 2012-08-16 | Cree, Inc. | Components and methods for light emitting diode (led) lighting |
US8681829B2 (en) * | 2011-08-29 | 2014-03-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
MY156107A (en) | 2011-11-01 | 2016-01-15 | Carsem M Sdn Bhd | Large panel leadframe |
DE102012215449A1 (en) * | 2012-08-31 | 2014-03-27 | Osram Opto Semiconductors Gmbh | HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC MODULE, METHOD FOR MANUFACTURING A HOUSING FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC MODULE |
EP2973759B1 (en) * | 2013-03-13 | 2017-06-07 | Koninklijke Philips N.V. | Encapsulating led lens with bottom reflectors |
DE102013222703A1 (en) | 2013-11-08 | 2015-05-13 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
US10018324B2 (en) * | 2015-03-31 | 2018-07-10 | Koito Manufacturing Co., Ltd. | Light source unit with light emitting module, sealing part and lens part |
KR20200037634A (en) * | 2018-10-01 | 2020-04-09 | 현대자동차주식회사 | Package for glass and glass assembly using the same |
US10965096B2 (en) * | 2019-03-20 | 2021-03-30 | Chroma Ate Inc. | Fixture assembly for testing surface emitting laser diodes and testing apparatus having the same |
US10903618B2 (en) * | 2019-03-20 | 2021-01-26 | Chroma Ate Inc. | Fixture assembly for testing edge-emitting laser diodes and testing apparatus having the same |
KR20210116828A (en) | 2020-03-17 | 2021-09-28 | 삼성전자주식회사 | Light source module and display panel using the same |
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US20020158320A1 (en) * | 2001-02-13 | 2002-10-31 | Agilent Technologies, Inc. | Light-emitting diode and a method for its manufacture |
DE10122002A1 (en) * | 2001-05-07 | 2002-11-21 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component and optoelectronic component |
EP1385217A2 (en) * | 2002-07-25 | 2004-01-28 | Matsushita Electric Works, Ltd. | Photoelectric device-part |
US20040079957A1 (en) * | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
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-
2005
- 2005-01-14 US US11/035,716 patent/US7777247B2/en active Active
- 2005-12-29 TW TW094147311A patent/TW200711166A/en unknown
-
2006
- 2006-01-06 WO PCT/US2006/000335 patent/WO2006078462A2/en active Application Filing
Patent Citations (4)
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US20020158320A1 (en) * | 2001-02-13 | 2002-10-31 | Agilent Technologies, Inc. | Light-emitting diode and a method for its manufacture |
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US20040079957A1 (en) * | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
Also Published As
Publication number | Publication date |
---|---|
WO2006078462A2 (en) | 2006-07-27 |
TW200711166A (en) | 2007-03-16 |
US20060157726A1 (en) | 2006-07-20 |
US7777247B2 (en) | 2010-08-17 |
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