WO2006093830A3 - Internally overlapped conditioners - Google Patents

Internally overlapped conditioners Download PDF

Info

Publication number
WO2006093830A3
WO2006093830A3 PCT/US2006/006607 US2006006607W WO2006093830A3 WO 2006093830 A3 WO2006093830 A3 WO 2006093830A3 US 2006006607 W US2006006607 W US 2006006607W WO 2006093830 A3 WO2006093830 A3 WO 2006093830A3
Authority
WO
WIPO (PCT)
Prior art keywords
conditioners
energy conditioners
overlapped
internally
internally overlapped
Prior art date
Application number
PCT/US2006/006607
Other languages
French (fr)
Other versions
WO2006093830A2 (en
Inventor
William Anthony
David Anthony
Anthony Anthony
Original Assignee
X2Y Attenuators Llc
William Anthony
David Anthony
Anthony Anthony
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X2Y Attenuators Llc, William Anthony, David Anthony, Anthony Anthony filed Critical X2Y Attenuators Llc
Priority to US11/817,634 priority Critical patent/US7782587B2/en
Priority to GB0718917A priority patent/GB2439861A/en
Priority to JP2007558083A priority patent/JP2008537843A/en
Publication of WO2006093830A2 publication Critical patent/WO2006093830A2/en
Publication of WO2006093830A3 publication Critical patent/WO2006093830A3/en
Priority to US12/861,811 priority patent/US7974062B2/en
Priority to US13/175,918 priority patent/US8547677B2/en
Priority to US14/042,637 priority patent/US9001486B2/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/35Feed-through capacitors or anti-noise capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/06Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using spark-gap arresters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113Via provided in pad; Pad over filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114Pad being close to via, but not surrounding the via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979Redundant conductors or connections, i.e. more than one current path between two points
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Abstract

The application discloses novel internal structures of energy conditioners, assemblies of external structures of energy conditioners and mounting structure, and novel circuits including energy conditioners (700) having A, B, and G master electrodes.
PCT/US2006/006607 2005-03-01 2006-02-27 Internally overlapped conditioners WO2006093830A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/817,634 US7782587B2 (en) 2005-03-01 2006-02-27 Internally overlapped conditioners
GB0718917A GB2439861A (en) 2005-03-01 2006-02-27 Internally overlapped conditioners
JP2007558083A JP2008537843A (en) 2005-03-01 2006-02-27 Overlapping adjuster inside
US12/861,811 US7974062B2 (en) 2005-03-01 2010-08-23 Internally overlapped conditioners
US13/175,918 US8547677B2 (en) 2005-03-01 2011-07-04 Method for making internally overlapped conditioners
US14/042,637 US9001486B2 (en) 2005-03-01 2013-09-30 Internally overlapped conditioners

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US65691005P 2005-03-01 2005-03-01
US60/656,910 2005-03-01
US66100205P 2005-03-14 2005-03-14
US60/661,002 2005-03-14
US66899205P 2005-04-07 2005-04-07
US60/668,992 2005-04-07
US67110705P 2005-04-14 2005-04-14
US60/671,107 2005-04-14
US67153205P 2005-04-15 2005-04-15
US60/671,532 2005-04-15
US67428405P 2005-04-25 2005-04-25
US60/674,284 2005-04-25
US75127305P 2005-12-19 2005-12-19
US60/751,273 2005-12-19

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US11/817,634 A-371-Of-International US7782587B2 (en) 2005-03-01 2006-02-27 Internally overlapped conditioners
US12/861,811 Continuation US7974062B2 (en) 2005-03-01 2010-08-23 Internally overlapped conditioners

Publications (2)

Publication Number Publication Date
WO2006093830A2 WO2006093830A2 (en) 2006-09-08
WO2006093830A3 true WO2006093830A3 (en) 2009-04-23

Family

ID=36941668

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2006/006607 WO2006093830A2 (en) 2005-03-01 2006-02-27 Internally overlapped conditioners
PCT/US2006/006609 WO2006104613A2 (en) 2005-03-01 2006-02-27 Conditioner with coplanar conductors

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2006/006609 WO2006104613A2 (en) 2005-03-01 2006-02-27 Conditioner with coplanar conductors

Country Status (5)

Country Link
US (5) US7630188B2 (en)
JP (2) JP2008537843A (en)
KR (2) KR20070107747A (en)
GB (2) GB2439861A (en)
WO (2) WO2006093830A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9019679B2 (en) 1997-04-08 2015-04-28 X2Y Attenuators, Llc Arrangement for energy conditioning

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
KR20070107747A (en) 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 Conditioner with coplanar conductors
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
EP1991996A1 (en) * 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energy conditioner structures
JP5605342B2 (en) * 2010-11-09 2014-10-15 株式会社村田製作所 Electronic components and board modules
TW201316895A (en) * 2011-10-14 2013-04-16 Hon Hai Prec Ind Co Ltd Printed circuit board capable of preventing electromagnetic interface
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JP2015049986A (en) * 2013-08-30 2015-03-16 富士通株式会社 Connector and manufacturing method therefor
JP5958479B2 (en) * 2014-01-31 2016-08-02 株式会社村田製作所 Electronic component mounting structure
US20150223323A1 (en) * 2014-02-05 2015-08-06 Colin Patrick O'Flynn Footprint for Prototyping High Frequency Printed Circuit Boards
JP2016127262A (en) * 2014-12-26 2016-07-11 太陽誘電株式会社 Feedthrough multilayer ceramic capacitor
JP2016149479A (en) * 2015-02-13 2016-08-18 株式会社村田製作所 Multilayer capacitor
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US10607777B2 (en) 2017-02-06 2020-03-31 Avx Corporation Integrated capacitor filter and integrated capacitor filter with varistor function
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DE112018005239T5 (en) 2017-10-02 2020-06-18 Avx Corporation Tunable multi-layer capacitor with high capacitance and array
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JP2022530506A (en) 2019-05-01 2022-06-29 バード・アクセス・システムズ,インコーポレーテッド Puncture devices, puncture systems including puncture devices, and their methods

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US7974062B2 (en) 2011-07-05
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