WO2006129291A2 - Led assembly and module - Google Patents
Led assembly and module Download PDFInfo
- Publication number
- WO2006129291A2 WO2006129291A2 PCT/IB2006/051765 IB2006051765W WO2006129291A2 WO 2006129291 A2 WO2006129291 A2 WO 2006129291A2 IB 2006051765 W IB2006051765 W IB 2006051765W WO 2006129291 A2 WO2006129291 A2 WO 2006129291A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- electrically
- parallel
- assembly
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
- H05B45/28—Controlling the colour of the light using temperature feedback
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/42—Antiparallel configurations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008514290A JP2008543075A (en) | 2005-06-02 | 2006-06-01 | LED assembly and module |
KR1020087000031A KR101256392B1 (en) | 2005-06-02 | 2006-06-01 | Led assembly and module |
CN2006800192927A CN101189736B (en) | 2005-06-02 | 2006-06-01 | Led assembly and module |
BRPI0611190-4A BRPI0611190A2 (en) | 2005-06-02 | 2006-06-01 | LED assembly, module and system |
US11/916,128 US7830095B2 (en) | 2005-06-02 | 2006-06-01 | LED assembly and module |
EP06756046.6A EP1891685B1 (en) | 2005-06-02 | 2006-06-01 | Led assembly and module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68681205P | 2005-06-02 | 2005-06-02 | |
US60/686,812 | 2005-06-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006129291A2 true WO2006129291A2 (en) | 2006-12-07 |
WO2006129291A3 WO2006129291A3 (en) | 2007-04-26 |
Family
ID=37037057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2006/051765 WO2006129291A2 (en) | 2005-06-02 | 2006-06-01 | Led assembly and module |
Country Status (9)
Country | Link |
---|---|
US (1) | US7830095B2 (en) |
EP (1) | EP1891685B1 (en) |
JP (2) | JP2008543075A (en) |
KR (1) | KR101256392B1 (en) |
CN (1) | CN101189736B (en) |
BR (1) | BRPI0611190A2 (en) |
MY (1) | MY147397A (en) |
TW (1) | TW200702824A (en) |
WO (1) | WO2006129291A2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009153715A3 (en) * | 2008-06-17 | 2010-03-11 | Koninklijke Philips Electronics N.V. | Light emitting device adapted for ac drive |
WO2012009086A1 (en) * | 2010-07-14 | 2012-01-19 | General Electric Company | System and method for driving light emitting diodes |
JP2012504862A (en) * | 2008-10-02 | 2012-02-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED circuit layout with improved flicker performance |
WO2012045684A1 (en) * | 2010-10-04 | 2012-04-12 | Osram Opto Semiconductors Gmbh | Luminous device comprising multiple spaced-apart emission regions |
WO2014060921A1 (en) * | 2012-10-15 | 2014-04-24 | Koninklijke Philips N.V. | Led package with capacitive couplings |
EP2410817A3 (en) * | 2010-07-23 | 2014-05-21 | Advanced Connectek Inc. | Light emitting device driving circuit |
WO2015036443A1 (en) * | 2013-09-12 | 2015-03-19 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and optoelectronic component |
WO2015050639A1 (en) * | 2013-10-03 | 2015-04-09 | Robertson Transformer Co. | Capacitive ladder feed for ac led |
ITBA20130071A1 (en) * | 2013-10-25 | 2015-04-26 | Matteo Console | POWER SUPPLY AND DRIVER FOR TURBO LED T8 DIMENSIONS (60CM, 90CM, 120CM, 150CM) WITH VARIABLE CAPACITIVE REACTANCE. |
EP3099141A1 (en) * | 2015-05-26 | 2016-11-30 | OSRAM GmbH | A lighting device and corresponding method |
RU2604890C2 (en) * | 2011-03-07 | 2016-12-20 | Конинклейке Филипс Н.В. | Electroluminescent device |
RU2719344C2 (en) * | 2015-12-23 | 2020-04-17 | Конинклейке Филипс Н.В. | Load device and power supply device for powering load |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8164273B1 (en) * | 2007-04-27 | 2012-04-24 | Harrington Richard H | Light emitting diode circuits for general lighting |
US8896228B2 (en) | 2007-04-27 | 2014-11-25 | Rtc Inc. | Light emitting diode circuits for general lighting |
US7714334B2 (en) * | 2007-08-16 | 2010-05-11 | Lin Peter P W | Polarless surface mounting light emitting diode |
US9443834B2 (en) | 2010-09-02 | 2016-09-13 | Micron Technology, Inc. | Back-to-back solid state lighting devices and associated methods |
US8384294B2 (en) | 2010-10-05 | 2013-02-26 | Electronic Theatre Controls, Inc. | System and method for color creation and matching |
CN101969726B (en) * | 2010-10-15 | 2013-10-30 | 赵熙 | LED driving loop |
US8593074B2 (en) | 2011-01-12 | 2013-11-26 | Electronic Theater Controls, Inc. | Systems and methods for controlling an output of a light fixture |
US8723450B2 (en) | 2011-01-12 | 2014-05-13 | Electronics Theatre Controls, Inc. | System and method for controlling the spectral content of an output of a light fixture |
JP2013225629A (en) * | 2012-04-23 | 2013-10-31 | Panasonic Corp | Lighting circuit and switch |
CN104919469B (en) * | 2012-09-03 | 2018-02-13 | 侯经权 | Voltage controls impedance synthesizer |
TWI512229B (en) | 2012-12-07 | 2015-12-11 | Ind Tech Res Inst | Illuminating device |
ITMI20130061A1 (en) * | 2013-01-17 | 2014-07-18 | St Microelectronics Srl | CURRENT DRIVER FOR AN ARRAY OF LED DIODES. |
RU2663814C2 (en) * | 2013-02-28 | 2018-08-10 | Филипс Лайтинг Холдинг Б.В. | Simple led package suitable for capacitive driving |
US20140368125A1 (en) * | 2013-06-09 | 2014-12-18 | Q Technology, Inc. | Lighting panel with distributed capacitance |
US20150048747A1 (en) * | 2013-08-15 | 2015-02-19 | Mei-Ling Peng | Structure of color mixing circuit of led light string |
US8957590B1 (en) * | 2013-08-15 | 2015-02-17 | Mei-Ling Peng | Structure of color mixture synchronization circuit of LED light string |
JP2017506415A (en) * | 2014-02-12 | 2017-03-02 | フィリップス ライティング ホールディング ビー ヴィ | Illumination system comprising an array of LEDs |
KR102292640B1 (en) | 2015-03-06 | 2021-08-23 | 삼성전자주식회사 | Light Emitting Device Package and electronic device including light emitting device |
DE102017104908A1 (en) | 2017-03-08 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Arrangement for operating radiation-emitting components, method for producing the arrangement and compensation structure |
EP3376828A1 (en) * | 2017-03-17 | 2018-09-19 | Valeo Iluminacion | Lighting module with configurable electrical network for driving light source thereof |
KR102331650B1 (en) * | 2019-09-25 | 2021-11-30 | 세메스 주식회사 | Apparatus for treating substrate, method for treating substrate and nozzle unit |
TWM597022U (en) * | 2020-03-23 | 2020-06-11 | 柏友照明科技股份有限公司 | Led illumination device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6853150B2 (en) | 2001-12-28 | 2005-02-08 | Koninklijke Philips Electronics N.V. | Light emitting diode driver |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2197583B1 (en) * | 1972-09-07 | 1975-10-17 | Rhone Poulenc Ind | |
JPS4985064U (en) * | 1972-11-10 | 1974-07-23 | ||
JPS5961917A (en) * | 1982-10-01 | 1984-04-09 | 松下電器産業株式会社 | Composite electronic part |
FR2568042B1 (en) | 1984-07-17 | 1986-09-05 | Radiotechnique Compelec | TWO-COLOR LIGHT INDICATOR INDICATING THE OPERATING STATE OF A CIRCUIT OF USE |
JPH0241649Y2 (en) * | 1985-08-30 | 1990-11-06 | ||
JP2622291B2 (en) * | 1989-10-06 | 1997-06-18 | アルプス電気株式会社 | Dielectric paste |
DE4129059A1 (en) | 1991-09-02 | 1993-03-04 | Vdo Schindling | Light emitting diode circuit including energy storage capacitor - charges capacitor during half-cycles from AC supply, and discharges through diodes of opposite polarity |
JP2976625B2 (en) * | 1991-10-04 | 1999-11-10 | 松下電器産業株式会社 | Multilayer ceramic capacitors |
KR930015139A (en) | 1991-12-18 | 1993-07-23 | 이헌조 | Manufacturing method of light emitting diode capable of changing light intensity |
JPH05318825A (en) * | 1992-05-25 | 1993-12-03 | Toray Ind Inc | Light-emitting diode array device |
JP3249582B2 (en) * | 1992-07-24 | 2002-01-21 | シャープ株式会社 | Light emitting device |
JP3063412B2 (en) * | 1992-08-21 | 2000-07-12 | 富士電機株式会社 | Variable capacitor |
US5289112A (en) * | 1992-09-21 | 1994-02-22 | Hewlett-Packard Company | Light-emitting diode array current power supply including switched cascode transistors |
JP3499255B2 (en) * | 1993-05-21 | 2004-02-23 | 株式会社半導体エネルギー研究所 | Method of manufacturing composite integrated circuit component |
US5463280A (en) * | 1994-03-03 | 1995-10-31 | National Service Industries, Inc. | Light emitting diode retrofit lamp |
JPH07273371A (en) | 1994-03-31 | 1995-10-20 | Okaya Electric Ind Co Ltd | Light-emitting diode driving circuit |
JPH08137429A (en) * | 1994-11-14 | 1996-05-31 | Seibu Electric & Mach Co Ltd | Display device |
JPH08162360A (en) * | 1994-12-02 | 1996-06-21 | Taiyo Yuden Co Ltd | Laminated capacitor |
JPH08250771A (en) | 1995-03-08 | 1996-09-27 | Hiyoshi Denshi Kk | Variable color led device and led color control device |
DE59913341D1 (en) | 1998-03-11 | 2006-05-24 | Siemens Ag | led |
AUPP536198A0 (en) | 1998-08-20 | 1998-09-10 | Hybrid Electronics Australia Pty Ltd | Colour-correction of light-emitting diode pixel modules |
US20040201988A1 (en) * | 1999-02-12 | 2004-10-14 | Fiber Optic Designs, Inc. | LED light string and arrays with improved harmonics and optimized power utilization |
US6078148A (en) * | 1998-10-09 | 2000-06-20 | Relume Corporation | Transformer tap switching power supply for LED traffic signal |
DE10013207B4 (en) * | 2000-03-17 | 2014-03-13 | Tridonic Gmbh & Co Kg | Control of light emitting diodes (LEDs) |
US6636027B1 (en) * | 2000-10-24 | 2003-10-21 | General Electric Company | LED power source |
JP2003139712A (en) | 2001-10-31 | 2003-05-14 | Ccs Inc | Led lighting system |
US7095053B2 (en) | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
US6897622B2 (en) | 2003-06-30 | 2005-05-24 | Mattel, Inc. | Incremental color blending illumination system using LEDs |
JP2005045112A (en) * | 2003-07-24 | 2005-02-17 | Matsushita Electric Ind Co Ltd | Flexible circuit board incorporating component and its producing process |
JP2005067457A (en) * | 2003-08-26 | 2005-03-17 | Denso Corp | Vehicular illumination control device |
US7296913B2 (en) * | 2004-07-16 | 2007-11-20 | Technology Assessment Group | Light emitting diode replacement lamp |
-
2006
- 2006-05-30 TW TW095119284A patent/TW200702824A/en unknown
- 2006-05-31 MY MYPI20062520A patent/MY147397A/en unknown
- 2006-06-01 EP EP06756046.6A patent/EP1891685B1/en not_active Not-in-force
- 2006-06-01 WO PCT/IB2006/051765 patent/WO2006129291A2/en active Application Filing
- 2006-06-01 KR KR1020087000031A patent/KR101256392B1/en not_active IP Right Cessation
- 2006-06-01 US US11/916,128 patent/US7830095B2/en not_active Expired - Fee Related
- 2006-06-01 CN CN2006800192927A patent/CN101189736B/en not_active Expired - Fee Related
- 2006-06-01 JP JP2008514290A patent/JP2008543075A/en active Pending
- 2006-06-01 BR BRPI0611190-4A patent/BRPI0611190A2/en not_active Application Discontinuation
-
2012
- 2012-05-23 JP JP2012117079A patent/JP5438799B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6853150B2 (en) | 2001-12-28 | 2005-02-08 | Koninklijke Philips Electronics N.V. | Light emitting diode driver |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8530906B2 (en) | 2008-06-17 | 2013-09-10 | Koninklijke Philips N.V. | Light emitting device adapted for AC drive |
WO2009153715A3 (en) * | 2008-06-17 | 2010-03-11 | Koninklijke Philips Electronics N.V. | Light emitting device adapted for ac drive |
TWI513358B (en) * | 2008-06-17 | 2015-12-11 | Koninkl Philips Electronics Nv | Light emitting device adapted for ac drive |
JP2012504862A (en) * | 2008-10-02 | 2012-02-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED circuit layout with improved flicker performance |
WO2012009086A1 (en) * | 2010-07-14 | 2012-01-19 | General Electric Company | System and method for driving light emitting diodes |
US9516723B2 (en) | 2010-07-14 | 2016-12-06 | General Electric Company | System and method for driving light emitting diodes |
EP2410817A3 (en) * | 2010-07-23 | 2014-05-21 | Advanced Connectek Inc. | Light emitting device driving circuit |
US9192021B2 (en) | 2010-10-04 | 2015-11-17 | Osram Opto Semiconductors Gmbh | Luminous device comprising multiple spaced-apart emission regions |
WO2012045684A1 (en) * | 2010-10-04 | 2012-04-12 | Osram Opto Semiconductors Gmbh | Luminous device comprising multiple spaced-apart emission regions |
RU2604890C2 (en) * | 2011-03-07 | 2016-12-20 | Конинклейке Филипс Н.В. | Electroluminescent device |
US9386640B2 (en) | 2012-10-15 | 2016-07-05 | Koninklijke Philips N.V. | LED package with capacitive couplings |
WO2014060921A1 (en) * | 2012-10-15 | 2014-04-24 | Koninklijke Philips N.V. | Led package with capacitive couplings |
RU2637402C2 (en) * | 2012-10-15 | 2017-12-04 | Филипс Лайтинг Холдинг Б.В. | Led-module with capacitive connections |
WO2015036443A1 (en) * | 2013-09-12 | 2015-03-19 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and optoelectronic component |
US9853018B2 (en) | 2013-09-12 | 2017-12-26 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and optoelectronic component |
DE102013110041B4 (en) | 2013-09-12 | 2023-09-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic semiconductor chip and optoelectronic component |
WO2015050639A1 (en) * | 2013-10-03 | 2015-04-09 | Robertson Transformer Co. | Capacitive ladder feed for ac led |
ITBA20130071A1 (en) * | 2013-10-25 | 2015-04-26 | Matteo Console | POWER SUPPLY AND DRIVER FOR TURBO LED T8 DIMENSIONS (60CM, 90CM, 120CM, 150CM) WITH VARIABLE CAPACITIVE REACTANCE. |
EP3099141A1 (en) * | 2015-05-26 | 2016-11-30 | OSRAM GmbH | A lighting device and corresponding method |
RU2719344C2 (en) * | 2015-12-23 | 2020-04-17 | Конинклейке Филипс Н.В. | Load device and power supply device for powering load |
Also Published As
Publication number | Publication date |
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EP1891685A2 (en) | 2008-02-27 |
US7830095B2 (en) | 2010-11-09 |
JP2012182486A (en) | 2012-09-20 |
JP5438799B2 (en) | 2014-03-12 |
KR20080027322A (en) | 2008-03-26 |
BRPI0611190A2 (en) | 2011-02-22 |
CN101189736A (en) | 2008-05-28 |
EP1891685B1 (en) | 2016-11-30 |
KR101256392B1 (en) | 2013-04-25 |
CN101189736B (en) | 2010-05-19 |
TW200702824A (en) | 2007-01-16 |
US20080218095A1 (en) | 2008-09-11 |
WO2006129291A3 (en) | 2007-04-26 |
JP2008543075A (en) | 2008-11-27 |
MY147397A (en) | 2012-11-30 |
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