WO2007001414A3 - Low thermal resistance power module assembly - Google Patents
Low thermal resistance power module assembly Download PDFInfo
- Publication number
- WO2007001414A3 WO2007001414A3 PCT/US2005/037137 US2005037137W WO2007001414A3 WO 2007001414 A3 WO2007001414 A3 WO 2007001414A3 US 2005037137 W US2005037137 W US 2005037137W WO 2007001414 A3 WO2007001414 A3 WO 2007001414A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate
- thermal resistance
- low thermal
- power module
- module assembly
- Prior art date
Links
- 239000002826 coolant Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Abstract
A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05858240A EP1842408A4 (en) | 2005-01-11 | 2005-10-18 | Low thermal resistance power module assembly |
US11/569,248 US7859846B2 (en) | 2005-01-11 | 2005-10-18 | Low thermal resistance power module assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/032,771 | 2005-01-11 | ||
US11/032,771 US7190581B1 (en) | 2005-01-11 | 2005-01-11 | Low thermal resistance power module assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007001414A2 WO2007001414A2 (en) | 2007-01-04 |
WO2007001414A3 true WO2007001414A3 (en) | 2007-05-18 |
Family
ID=37595596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/037137 WO2007001414A2 (en) | 2005-01-11 | 2005-10-18 | Low thermal resistance power module assembly |
Country Status (3)
Country | Link |
---|---|
US (2) | US7190581B1 (en) |
EP (1) | EP1842408A4 (en) |
WO (1) | WO2007001414A2 (en) |
Families Citing this family (47)
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US6992887B2 (en) * | 2003-10-15 | 2006-01-31 | Visteon Global Technologies, Inc. | Liquid cooled semiconductor device |
DE102004026061B4 (en) * | 2004-05-25 | 2009-09-10 | Danfoss Silicon Power Gmbh | Power semiconductor module and method for cooling a power semiconductor module |
US20070236883A1 (en) * | 2006-04-05 | 2007-10-11 | Javier Ruiz | Electronics assembly having heat sink substrate disposed in cooling vessel |
JP4857017B2 (en) * | 2006-04-27 | 2012-01-18 | 日立オートモティブシステムズ株式会社 | Power converter |
JP4293246B2 (en) * | 2007-02-19 | 2009-07-08 | 株式会社日立製作所 | Power converter |
JP5070014B2 (en) * | 2007-11-21 | 2012-11-07 | 株式会社豊田自動織機 | Heat dissipation device |
JP2009130060A (en) * | 2007-11-21 | 2009-06-11 | Toyota Industries Corp | Heat dissipater |
US7911792B2 (en) * | 2008-03-11 | 2011-03-22 | Ford Global Technologies Llc | Direct dipping cooled power module and packaging |
JP2009283741A (en) * | 2008-05-23 | 2009-12-03 | Fuji Electric Device Technology Co Ltd | Semiconductor device |
DE102008040727A1 (en) * | 2008-07-25 | 2010-01-28 | Robert Bosch Gmbh | Method and device for determining the rotor temperature of a permanent-magnet synchronous machine |
ATE531247T1 (en) * | 2008-10-24 | 2011-11-15 | Fiat Ricerche | MOTOR VEHICLE INVERTER UNIT |
DE102009010256A1 (en) * | 2009-02-24 | 2010-08-26 | Jungheinrich Aktiengesellschaft | Printed circuit board with heat sink |
EP2330873A1 (en) * | 2009-12-03 | 2011-06-08 | Continental Automotive GmbH | Electronic module |
JP5546889B2 (en) * | 2010-02-09 | 2014-07-09 | 日本電産エレシス株式会社 | Electronic component unit and manufacturing method thereof |
US9681580B2 (en) | 2010-07-28 | 2017-06-13 | Wolverine Tube, Inc. | Method of producing an enhanced base plate |
US10531594B2 (en) | 2010-07-28 | 2020-01-07 | Wieland Microcool, Llc | Method of producing a liquid cooled coldplate |
US20120026692A1 (en) | 2010-07-28 | 2012-02-02 | Wolverine Tube, Inc. | Electronics substrate with enhanced direct bonded metal |
US9795057B2 (en) | 2010-07-28 | 2017-10-17 | Wolverine Tube, Inc. | Method of producing a liquid cooled coldplate |
US9252069B2 (en) | 2010-08-31 | 2016-02-02 | Teledyne Scientific & Imaging, Llc | High power module cooling system |
US8659896B2 (en) * | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
TWI490117B (en) * | 2010-11-24 | 2015-07-01 | Nat Univ Tsing Hua | Heat spreading element with aln film and method for manufacturing the same |
WO2012165324A1 (en) * | 2011-06-02 | 2012-12-06 | シャープ株式会社 | Lighting device, display device, and television receiver |
TWI541488B (en) * | 2011-08-29 | 2016-07-11 | 奇鋐科技股份有限公司 | Heat dissipation device and method of manufacturing same |
US8938880B2 (en) | 2012-02-20 | 2015-01-27 | Wolverine Tube, Inc. | Method of manufacturing an integrated cold plate for electronics |
CN104380470B (en) * | 2012-05-18 | 2018-01-02 | 富士电机株式会社 | Semiconductor device |
US8941208B2 (en) * | 2012-07-30 | 2015-01-27 | General Electric Company | Reliable surface mount integrated power module |
US8847384B2 (en) | 2012-10-15 | 2014-09-30 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power modules and power module arrays having a modular design |
CN102881668A (en) * | 2012-10-16 | 2013-01-16 | 西安永电电气有限责任公司 | IGBT (Insulated Gate Bipolar Translator) module radiating structure |
US8643173B1 (en) | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
US10269688B2 (en) | 2013-03-14 | 2019-04-23 | General Electric Company | Power overlay structure and method of making same |
JP5720712B2 (en) * | 2013-03-22 | 2015-05-20 | トヨタ自動車株式会社 | Cooler |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
JP6227970B2 (en) * | 2013-10-16 | 2017-11-08 | 本田技研工業株式会社 | Semiconductor device |
US9431317B2 (en) * | 2013-11-07 | 2016-08-30 | Cisco Technology, Inc. | Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package |
EP3195711A4 (en) * | 2014-09-15 | 2018-08-29 | D'Onofrio, Nicholas, Michael | Liquid cooled metal core printed circuit board |
KR102411999B1 (en) * | 2015-04-08 | 2022-06-22 | 삼성전기주식회사 | Circuit board |
US11022383B2 (en) | 2016-06-16 | 2021-06-01 | Teledyne Scientific & Imaging, Llc | Interface-free thermal management system for high power devices co-fabricated with electronic circuit |
EP3340293A1 (en) | 2016-12-20 | 2018-06-27 | Siemens Aktiengesellschaft | Semiconductor module with support structure on the bottom |
US10159165B2 (en) * | 2017-02-02 | 2018-12-18 | Qualcomm Incorporated | Evaporative cooling solution for handheld electronic devices |
US10292316B2 (en) | 2017-09-08 | 2019-05-14 | Hamilton Sundstrand Corporation | Power module with integrated liquid cooling |
CN108200745A (en) * | 2018-01-22 | 2018-06-22 | 清华大学 | Hot collecting terminal and radiator |
US10798854B2 (en) | 2018-04-25 | 2020-10-06 | Ford Global Technologies, Llc | Modular power module with integrated coolant passageway and assemblies thereof |
CN112437593B (en) * | 2020-11-24 | 2022-03-25 | 浙江大学 | High-power-density integrated PCU module and liquid cooling design method thereof |
CN115250582A (en) * | 2021-04-26 | 2022-10-28 | 庆鼎精密电子(淮安)有限公司 | Circuit board and method for manufacturing the same |
CN115250590A (en) * | 2021-04-28 | 2022-10-28 | 比亚迪股份有限公司 | Motor controller and vehicle with same |
US11582866B1 (en) | 2021-07-22 | 2023-02-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same |
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US6400012B1 (en) * | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
US6473303B2 (en) * | 2000-02-11 | 2002-10-29 | Abb Schweiz Ag | Cooling device for a high-power semiconductor module |
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US6960278B2 (en) * | 2001-09-21 | 2005-11-01 | Alstom | Method of improving the properties of adhesion of a non-oxide ceramic substrate before gluing it |
US6992887B2 (en) * | 2003-10-15 | 2006-01-31 | Visteon Global Technologies, Inc. | Liquid cooled semiconductor device |
US20060108098A1 (en) * | 2004-11-24 | 2006-05-25 | General Electric Company | Heat sink with microchannel cooling for power devices |
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-
2005
- 2005-01-11 US US11/032,771 patent/US7190581B1/en not_active Expired - Fee Related
- 2005-10-18 EP EP05858240A patent/EP1842408A4/en not_active Withdrawn
- 2005-10-18 US US11/569,248 patent/US7859846B2/en not_active Expired - Fee Related
- 2005-10-18 WO PCT/US2005/037137 patent/WO2007001414A2/en active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US2942165A (en) * | 1957-01-03 | 1960-06-21 | Gen Electric | Liquid cooled current rectifiers |
US5262921A (en) * | 1990-03-03 | 1993-11-16 | Rheinmetall Gmbh | Directly cooled circuit board for an electronic power circuit |
JPH09121557A (en) * | 1995-10-23 | 1997-05-06 | Hitachi Ltd | Electronic parts cooling structure for rotary equipment and its manufacture |
US6400012B1 (en) * | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
JPH11163572A (en) * | 1997-11-25 | 1999-06-18 | Denso Corp | Liquid cooled circuit device |
JP2001168256A (en) * | 1999-12-13 | 2001-06-22 | Sumitomo Electric Ind Ltd | Heat dissipation structure for semiconductor component and semiconductor device provided with that |
US6473303B2 (en) * | 2000-02-11 | 2002-10-29 | Abb Schweiz Ag | Cooling device for a high-power semiconductor module |
US6738253B2 (en) * | 2001-06-20 | 2004-05-18 | Alstom | Electronic power module and a power component designed to equip such a module |
US6960278B2 (en) * | 2001-09-21 | 2005-11-01 | Alstom | Method of improving the properties of adhesion of a non-oxide ceramic substrate before gluing it |
US6992887B2 (en) * | 2003-10-15 | 2006-01-31 | Visteon Global Technologies, Inc. | Liquid cooled semiconductor device |
US20060108098A1 (en) * | 2004-11-24 | 2006-05-25 | General Electric Company | Heat sink with microchannel cooling for power devices |
Also Published As
Publication number | Publication date |
---|---|
EP1842408A2 (en) | 2007-10-10 |
EP1842408A4 (en) | 2008-06-04 |
WO2007001414A2 (en) | 2007-01-04 |
US20090213546A1 (en) | 2009-08-27 |
US7859846B2 (en) | 2010-12-28 |
US7190581B1 (en) | 2007-03-13 |
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