WO2007001976A3 - Semiconductor structure with rf element - Google Patents

Semiconductor structure with rf element Download PDF

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Publication number
WO2007001976A3
WO2007001976A3 PCT/US2006/023802 US2006023802W WO2007001976A3 WO 2007001976 A3 WO2007001976 A3 WO 2007001976A3 US 2006023802 W US2006023802 W US 2006023802W WO 2007001976 A3 WO2007001976 A3 WO 2007001976A3
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WO
WIPO (PCT)
Prior art keywords
primary
core
pads
region
chip
Prior art date
Application number
PCT/US2006/023802
Other languages
French (fr)
Other versions
WO2007001976A2 (en
Inventor
Hsin Wang Chih
Original Assignee
R828 Llc
Hsin Wang Chih
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R828 Llc, Hsin Wang Chih filed Critical R828 Llc
Publication of WO2007001976A2 publication Critical patent/WO2007001976A2/en
Publication of WO2007001976A3 publication Critical patent/WO2007001976A3/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • GPHYSICS
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    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
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Abstract

A RF structure including a semiconductor chip with an RF element having an RF core with two electrically connected chip pads, including a chip carrier having two carrier pads connected to the two chip pads and including an antenna connected to the carrier pads and electrically connected to the chip pads and to the RF core. The antenna is formed of wires, printed onductors, seal rings or other structures on, below or above the top plane of the semiconductor chip. A primary element is provided where the RF element is a secondary element. The primary element occupies a primary region and the RF core of the secondary element occupies a secondary region where the secondary region is much smaller than the primary region. The RF core secondary region is formed with the same native processing as used for the primary element.
PCT/US2006/023802 2005-06-20 2006-06-19 Semiconductor structure with rf element WO2007001976A2 (en)

Applications Claiming Priority (2)

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US11/157,300 2005-06-20
US11/157,300 US7607586B2 (en) 2005-03-28 2005-06-20 Semiconductor structure with RF element

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WO2007001976A2 WO2007001976A2 (en) 2007-01-04
WO2007001976A3 true WO2007001976A3 (en) 2007-03-08

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CN (1) CN1885544A (en)
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Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4689244B2 (en) * 2004-11-16 2011-05-25 ルネサスエレクトロニクス株式会社 Semiconductor device
JPWO2007000807A1 (en) * 2005-06-28 2009-01-22 富士通株式会社 Radio frequency identification tag
US20070262866A1 (en) * 2005-11-14 2007-11-15 Ronald Eveland Multi-Dimensional Broadband Track and Trace Sensor Radio Frequency Identification Device
US20070115130A1 (en) * 2005-11-14 2007-05-24 Ronald Eveland Multi-dimensional, broadband track and trace sensor radio frequency identification device
US20070229264A1 (en) * 2005-11-14 2007-10-04 Ronald Eveland Software method and system for encapsulation of RFID data into a standardized globally routable format
US7518221B2 (en) * 2006-01-26 2009-04-14 International Business Machines Corporation Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
US7589419B2 (en) * 2006-08-07 2009-09-15 Rcd Technology, Inc. Side connectors for RFID chip
US7893459B2 (en) * 2007-04-10 2011-02-22 Taiwan Semiconductor Manufacturing Company, Ltd. Seal ring structures with reduced moisture-induced reliability degradation
US7538346B2 (en) * 2007-05-29 2009-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device
FR2923324B1 (en) * 2007-11-05 2010-09-10 Commissariat Energie Atomique WIDEBAND INDUCTIVE ANTENNA FOR CONTACTLESS COMMUNICATION SYSTEMS
JP4484934B2 (en) * 2008-02-26 2010-06-16 富士通メディアデバイス株式会社 Electronic component and manufacturing method thereof
KR100978271B1 (en) * 2008-04-01 2010-08-26 엘에스산전 주식회사 Rfid tag using internal antenna and rfid system using the same
US20100127937A1 (en) * 2008-11-25 2010-05-27 Qualcomm Incorporated Antenna Integrated in a Semiconductor Chip
WO2010106484A1 (en) 2009-03-18 2010-09-23 Nxp B.V. Bond frame integrated in electronic circuit
US8179333B2 (en) * 2009-05-08 2012-05-15 Anokiwave, Inc. Antennas using chip-package interconnections for millimeter-wave wireless communication
JP5526726B2 (en) * 2009-11-20 2014-06-18 富士通株式会社 Wireless tag
IT1397222B1 (en) * 2009-12-30 2013-01-04 St Microelectronics Srl METHOD TO CHECK THE CORRECT POSITION OF TEST PROBES ON TERMINATIONS OF ELECTRONIC DEVICES INTEGRATED ON SEMICONDUCTOR AND ITS ELECTRONIC DEVICE.
US20110233271A1 (en) * 2010-03-23 2011-09-29 Rfmarq, Inc. System and Method To Track And Authenticate Semiconductor Chips, Multi-Chip Package Modules, And Their Derivative System Products
US9190738B2 (en) * 2010-04-11 2015-11-17 Broadcom Corporation Projected artificial magnetic mirror
US9460840B2 (en) 2011-03-03 2016-10-04 Skyworks Solutions, Inc. Seal ring inductor and method of forming the same
US10026035B2 (en) * 2011-03-24 2018-07-17 Avery Dennison Retail Information Services, Llc RFID tag including a coating
US8710630B2 (en) * 2011-07-11 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for marking the orientation of a sawed die
US9070066B1 (en) * 2013-01-21 2015-06-30 Impinj, Inc. RFID tags with inductively coupled antennas
US8754499B1 (en) * 2013-03-14 2014-06-17 International Business Machines Corporation Semiconductor chip with power gating through silicon vias
US9040406B2 (en) 2013-03-14 2015-05-26 International Business Machines Corporation Semiconductor chip with power gating through silicon vias
NL1040186C2 (en) * 2013-04-26 2014-10-29 Omniradar B V On-silicon integrated antenna with horn-like extension.
CN104253310B (en) * 2013-06-28 2018-06-26 华为技术有限公司 Multiaerial system and mobile terminal
US9406626B2 (en) 2014-05-16 2016-08-02 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device and method fabricating the same
TWI554932B (en) * 2015-05-15 2016-10-21 晨星半導體股份有限公司 Touch sensing and display circuit and touch sensing and display control module of touch screen, and method of controlling touch screen
US9824985B2 (en) * 2015-07-16 2017-11-21 Taiwan Semiconductor Manufacturing Co., Ltd Semiconductor device and semiconductor system
TWI589059B (en) * 2016-03-28 2017-06-21 矽品精密工業股份有限公司 Electronic package
US10867938B2 (en) * 2017-09-25 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure
US11108156B2 (en) * 2017-09-27 2021-08-31 Intel Corporation Differential on-chip loop antenna
DE102019109200B4 (en) * 2019-04-08 2024-03-07 Infineon Technologies Ag SEMICONDUCTOR DEVICES WITH NON-GALVANIC CONNECTION
CN111554463B (en) * 2020-05-11 2021-09-24 电子科技大学 Artificial conductor with broadband and low eddy current loss
CN112038750A (en) * 2020-09-04 2020-12-04 合肥工业大学 Anti-metal tag antenna applied to UHF frequency band
KR20220084804A (en) * 2020-12-14 2022-06-21 삼성전기주식회사 Antenna substrate
CN114916126B (en) * 2022-07-15 2022-11-04 龙旗电子(惠州)有限公司 Printed circuit board and mobile device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616520A (en) * 1992-03-30 1997-04-01 Hitachi, Ltd. Semiconductor integrated circuit device and fabrication method thereof
EP0780007B1 (en) * 1994-09-09 1999-04-21 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6037879A (en) * 1997-10-02 2000-03-14 Micron Technology, Inc. Wireless identification device, RFID device, and method of manufacturing wireless identification device
US20020037756A1 (en) * 2000-03-24 2002-03-28 Integrated Power Solutions Inc. Battery-operated wireless-communication apparatus and method
US20020053735A1 (en) * 2000-09-19 2002-05-09 Neuhaus Herbert J. Method for assembling components and antennae in radio frequency identification devices
US20030116790A1 (en) * 2000-06-21 2003-06-26 Yuji Kikuchi Semiconductor chip and semiconductor device using the semiconductor chip
US20030143971A1 (en) * 2000-08-22 2003-07-31 Toyohiko Hongo Radio transmitting/receiving device
US6744114B2 (en) * 2001-08-29 2004-06-01 Honeywell International Inc. Package with integrated inductor and/or capacitor
US6888235B2 (en) * 2001-09-26 2005-05-03 Molex Incorporated Power delivery system for integrated circuits utilizing discrete capacitors

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
KR100286331B1 (en) 1998-02-07 2001-05-02 김영환 Wireless local loop system using a patch-type antenna
US6373447B1 (en) 1998-12-28 2002-04-16 Kawasaki Steel Corporation On-chip antenna, and systems utilizing same
EP1413004A4 (en) * 2001-05-17 2004-07-21 Cypress Semiconductor Corp Ball grid array antenna
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7383058B2 (en) * 2002-07-16 2008-06-03 Intel Corporation RF/microwave system with a system on a chip package or the like
US6974782B2 (en) 2002-08-09 2005-12-13 R. Foulke Development Company, Llc Reticle tracking and cleaning
US7053477B2 (en) * 2002-10-08 2006-05-30 Chippac, Inc. Semiconductor multi-package module having inverted bump chip carrier second package
US6734825B1 (en) 2002-10-28 2004-05-11 The National University Of Singapore Miniature built-in multiple frequency band antenna
US6856009B2 (en) * 2003-03-11 2005-02-15 Micron Technology, Inc. Techniques for packaging multiple device components
JP3794411B2 (en) 2003-03-14 2006-07-05 セイコーエプソン株式会社 Display device and electronic device
US7098794B2 (en) 2004-04-30 2006-08-29 Kimberly-Clark Worldwide, Inc. Deactivating a data tag for user privacy or tamper-evident packaging
US7245213B1 (en) 2004-05-24 2007-07-17 Impinj, Inc. RFID readers and RFID tags exchanging encrypted password
US20060109120A1 (en) * 2004-11-19 2006-05-25 Jeremy Burr RFID tag in a substrate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616520A (en) * 1992-03-30 1997-04-01 Hitachi, Ltd. Semiconductor integrated circuit device and fabrication method thereof
EP0780007B1 (en) * 1994-09-09 1999-04-21 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6037879A (en) * 1997-10-02 2000-03-14 Micron Technology, Inc. Wireless identification device, RFID device, and method of manufacturing wireless identification device
US20020037756A1 (en) * 2000-03-24 2002-03-28 Integrated Power Solutions Inc. Battery-operated wireless-communication apparatus and method
US20030116790A1 (en) * 2000-06-21 2003-06-26 Yuji Kikuchi Semiconductor chip and semiconductor device using the semiconductor chip
US20030143971A1 (en) * 2000-08-22 2003-07-31 Toyohiko Hongo Radio transmitting/receiving device
US20020053735A1 (en) * 2000-09-19 2002-05-09 Neuhaus Herbert J. Method for assembling components and antennae in radio frequency identification devices
US6744114B2 (en) * 2001-08-29 2004-06-01 Honeywell International Inc. Package with integrated inductor and/or capacitor
US6888235B2 (en) * 2001-09-26 2005-05-03 Molex Incorporated Power delivery system for integrated circuits utilizing discrete capacitors

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US8113436B2 (en) 2012-02-14
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