WO2007002644A3 - Light emitting diode package and method for making same - Google Patents

Light emitting diode package and method for making same Download PDF

Info

Publication number
WO2007002644A3
WO2007002644A3 PCT/US2006/024928 US2006024928W WO2007002644A3 WO 2007002644 A3 WO2007002644 A3 WO 2007002644A3 US 2006024928 W US2006024928 W US 2006024928W WO 2007002644 A3 WO2007002644 A3 WO 2007002644A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
heat sink
package
printed wire
wire board
Prior art date
Application number
PCT/US2006/024928
Other languages
French (fr)
Other versions
WO2007002644A2 (en
Inventor
Joseph Mazzochette
Original Assignee
Lamina Lighting Inc
Joseph Mazzochette
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lamina Lighting Inc, Joseph Mazzochette filed Critical Lamina Lighting Inc
Priority to EP06785622A priority Critical patent/EP1897146A2/en
Priority to JP2008519472A priority patent/JP2009502024A/en
Publication of WO2007002644A2 publication Critical patent/WO2007002644A2/en
Publication of WO2007002644A3 publication Critical patent/WO2007002644A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/13—Severing followed by associating with part from same source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.
PCT/US2006/024928 2005-06-27 2006-06-27 Light emitting diode package and method for making same WO2007002644A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP06785622A EP1897146A2 (en) 2005-06-27 2006-06-27 Light emitting diode package and method for making same
JP2008519472A JP2009502024A (en) 2005-06-27 2006-06-27 Light emitting diode package and manufacturing method thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US69478805P 2005-06-27 2005-06-27
US60/694,788 2005-06-27
US73847805P 2005-11-21 2005-11-21
US60/738,478 2005-11-21
US76382806P 2006-01-31 2006-01-31
US60/763,828 2006-01-31

Publications (2)

Publication Number Publication Date
WO2007002644A2 WO2007002644A2 (en) 2007-01-04
WO2007002644A3 true WO2007002644A3 (en) 2009-04-16

Family

ID=37595967

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/024928 WO2007002644A2 (en) 2005-06-27 2006-06-27 Light emitting diode package and method for making same

Country Status (6)

Country Link
US (3) US20070007558A1 (en)
EP (1) EP1897146A2 (en)
JP (2) JP2009502024A (en)
KR (1) KR20080042798A (en)
TW (1) TW200709475A (en)
WO (1) WO2007002644A2 (en)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030015708A1 (en) 2001-07-23 2003-01-23 Primit Parikh Gallium nitride based diodes with low forward voltage and low reverse current operation
US8188503B2 (en) 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
JP4744178B2 (en) * 2005-04-08 2011-08-10 シャープ株式会社 Light emitting diode
US7719021B2 (en) * 2005-06-28 2010-05-18 Lighting Science Group Corporation Light efficient LED assembly including a shaped reflective cavity and method for making same
WO2007002476A2 (en) * 2005-06-28 2007-01-04 Lamina Ceramics, Inc. Backlight module display with optical coupler and lightguide
KR100782798B1 (en) * 2006-02-22 2007-12-05 삼성전기주식회사 COB Package and Its Manufacturing method
US7649327B2 (en) * 2006-05-22 2010-01-19 Permlight Products, Inc. System and method for selectively dimming an LED
KR20080057881A (en) * 2006-12-21 2008-06-25 엘지전자 주식회사 Printed circuit board, light emitting apparatus having the same and method for manufacturing thereof
KR100802393B1 (en) * 2007-02-15 2008-02-13 삼성전기주식회사 Package board and method for manufacturing thereof
US8421088B2 (en) * 2007-02-22 2013-04-16 Sharp Kabushiki Kaisha Surface mounting type light emitting diode
US8604506B2 (en) * 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
DE102007011637A1 (en) * 2007-03-09 2008-09-18 Ivoclar Vivadent Ag Light emitting device
US9273830B2 (en) 2007-06-14 2016-03-01 Cree, Inc. Light source with near field mixing
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
JP5167977B2 (en) * 2007-09-06 2013-03-21 日亜化学工業株式会社 Semiconductor device
US8519437B2 (en) 2007-09-14 2013-08-27 Cree, Inc. Polarization doping in nitride based diodes
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
CN100546058C (en) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 Power luminous diode packaging structure
JP4623322B2 (en) * 2007-12-26 2011-02-02 信越化学工業株式会社 White thermosetting silicone resin composition for forming optical semiconductor case, optical semiconductor case and molding method thereof
JP4678415B2 (en) * 2008-03-18 2011-04-27 信越化学工業株式会社 White thermosetting silicone resin composition for forming optical semiconductor case and optical semiconductor case
US8531024B2 (en) * 2008-03-25 2013-09-10 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
KR101209759B1 (en) 2008-03-26 2012-12-06 가부시키가이샤 시마네 덴시 이마후쿠 세이사쿠쇼 Semiconductor light emitting module and method for manufacturing the same
DE102008016458A1 (en) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive
CN102007830B (en) * 2008-04-17 2014-07-09 皇家飞利浦电子股份有限公司 Thermally conductive mounting element for attachment of printed circuit board to heat sink
US7888688B2 (en) * 2008-04-29 2011-02-15 Bridgelux, Inc. Thermal management for LED
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
DE102008026627B3 (en) * 2008-06-03 2009-10-29 Siemens Aktiengesellschaft Cooling system for LED chip arrangement
JP2010021533A (en) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd White heat-curable silicone resin composition for forming optical semiconductor case, and optical semiconductor case
JP2010018786A (en) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd White heat-curable silicone resin composition for forming optical semiconductor case, and optical semiconductor case
US20100006886A1 (en) * 2008-07-10 2010-01-14 Brilliant Technology Co., Ltd. High power light emitting diode chip package carrier structure
US8080827B2 (en) * 2008-07-31 2011-12-20 Bridgelux, Inc. Top contact LED thermal management
US7859190B2 (en) * 2008-09-10 2010-12-28 Bridgelux, Inc. Phosphor layer arrangement for use with light emitting diodes
US8049236B2 (en) * 2008-09-26 2011-11-01 Bridgelux, Inc. Non-global solder mask LED assembly
US9252336B2 (en) * 2008-09-26 2016-02-02 Bridgelux, Inc. Multi-cup LED assembly
US7887384B2 (en) * 2008-09-26 2011-02-15 Bridgelux, Inc. Transparent ring LED assembly
US20100078661A1 (en) * 2008-09-26 2010-04-01 Wei Shi Machined surface led assembly
US8058664B2 (en) 2008-09-26 2011-11-15 Bridgelux, Inc. Transparent solder mask LED assembly
JP5227135B2 (en) * 2008-10-10 2013-07-03 スタンレー電気株式会社 Semiconductor light emitting device and manufacturing method thereof
TWI506829B (en) * 2008-12-19 2015-11-01 Taiwan Electronic Packaging Co Ltd Chip module structure assembly
US8120250B2 (en) * 2009-01-27 2012-02-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitter
JP2010238821A (en) * 2009-03-30 2010-10-21 Sony Corp Multilayer wiring substrate, stack structure sensor package, and method of manufacturing the same
DE102009015224A1 (en) 2009-03-31 2010-12-02 Siemens Aktiengesellschaft LED light source with a variety of LED chips and LED chip for use in same
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
TWI416771B (en) * 2009-10-01 2013-11-21 Everlight Electronics Co Ltd Light emitting diode
WO2011044393A1 (en) * 2009-10-07 2011-04-14 Tessera North America, Inc. Wafer-scale emitter package including thermal vias
KR101135580B1 (en) * 2009-11-03 2012-04-17 한국광기술원 Light Emitting Diode lamp module
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
US8604461B2 (en) * 2009-12-16 2013-12-10 Cree, Inc. Semiconductor device structures with modulated doping and related methods
CN102034912B (en) 2009-12-29 2015-03-25 比亚迪股份有限公司 Light-emitting diode epitaxial wafer, manufacturing method and manufacturing method of chip
CN102117876B (en) * 2009-12-30 2013-02-27 展晶科技(深圳)有限公司 Semiconductor packaging structure
US8339471B2 (en) 2009-12-31 2012-12-25 DigitalOptics Corporation Europe Limited Auto white balance algorithm using RGB product measure
TW201135991A (en) * 2010-04-12 2011-10-16 Foxsemicon Integrated Tech Inc Solid-state lighting device and light source module incorporating the same
CN102214769B (en) * 2010-04-12 2013-09-11 富士迈半导体精密工业（上海）有限公司 Solid light-emitting element and light source module with same
US8354745B2 (en) 2010-04-20 2013-01-15 Intellectual Discovery Co., Ltd. Electronic assembly
US8896015B2 (en) * 2010-06-25 2014-11-25 Axlen, Inc. LED package and method of making the same
DE102010026344A1 (en) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh led
DE102010033092A1 (en) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelectronic light module and car headlights
DE102010044987A1 (en) * 2010-09-10 2012-03-15 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for its production
TWI425612B (en) * 2010-09-29 2014-02-01 Advanced Optoelectronic Tech Light emitting diode unit
EP2447595B1 (en) * 2010-10-27 2017-08-02 LG Innotek Co., Ltd. Light emitting module
WO2012061183A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device for thermal management and method of making
WO2012061010A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Polymer etchant and method of using same
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
US20120154945A1 (en) * 2010-12-16 2012-06-21 William Mark Hiatt Optical apertures and applications thereof
AU2011353319B2 (en) * 2010-12-28 2014-01-23 Nichia Corporation Light emitting device and method for manufacturing same
US8354684B2 (en) 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US8373183B2 (en) 2011-02-22 2013-02-12 Hong Kong Applied Science and Technology Research Institute Company Limited LED package for uniform color emission
TWI451605B (en) * 2011-03-08 2014-09-01 Lextar Electronics Corp A light-emitting diode structure with metal substructure and heat sink
FR2973942B1 (en) * 2011-04-08 2013-09-06 Continental Automotive France ELECTRONIC COMPONENT WITH THERMAL DISSIPATION PASTILLE AND CARD USING THE SAME
CN102820384B (en) * 2011-06-08 2015-10-07 展晶科技(深圳)有限公司 The manufacture method of package structure for LED
US8430521B2 (en) * 2011-07-02 2013-04-30 Jet Motor Limited Pool lighting assembly
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
EP2562834B1 (en) * 2011-08-22 2019-12-25 LG Innotek Co., Ltd. Light emitting diode package
US8704433B2 (en) * 2011-08-22 2014-04-22 Lg Innotek Co., Ltd. Light emitting device package and light unit
US8851736B2 (en) 2011-08-30 2014-10-07 Lg Innotek Co., Ltd. Light emitting module with heatsink plate having coupling protrusions
CN102983244A (en) * 2011-09-05 2013-03-20 欧司朗股份有限公司 An LED lighting assembly and an illuminating apparatus having the LED lighting assembly
TWI478395B (en) * 2011-11-04 2015-03-21 恆日光電股份有限公司 Led package module
CN102403418A (en) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 Manufacturing method of high-power LED radiating structure
JP6107060B2 (en) 2011-12-26 2017-04-05 日亜化学工業株式会社 Method for manufacturing light emitting device
JP5851875B2 (en) * 2012-02-14 2016-02-03 信越化学工業株式会社 Method for manufacturing package for optical semiconductor device and method for manufacturing optical semiconductor device
CN103258921A (en) * 2012-02-21 2013-08-21 展晶科技(深圳)有限公司 Method for encapsulating light emitting diodes
CN103296146A (en) * 2012-02-22 2013-09-11 太极光光电股份有限公司 Method for encapsulating unframed LED chip and light-emitting device made with same
KR101299587B1 (en) 2012-05-24 2013-08-26 금호전기주식회사 Lighting apparatus having led
US9209106B2 (en) * 2012-06-21 2015-12-08 Ati Technologies Ulc Thermal management circuit board for stacked semiconductor chip device
WO2014001957A1 (en) * 2012-06-28 2014-01-03 Koninklijke Philips N.V. Assembly for transferring and dissipating heat
US9673162B2 (en) * 2012-09-13 2017-06-06 Nxp Usa, Inc. High power semiconductor package subsystems
WO2014207635A1 (en) * 2013-06-28 2014-12-31 Koninklijke Philips N.V. Light emitting diode device
JP6194853B2 (en) * 2014-06-06 2017-09-13 信越化学工業株式会社 White thermosetting silicone resin composition for optical semiconductor device and case for mounting optical semiconductor element
KR102268172B1 (en) * 2014-07-07 2021-06-23 엘지전자 주식회사 Apparatus and method for assembling light source module assembly
KR102252156B1 (en) * 2014-07-08 2021-05-17 엘지이노텍 주식회사 Light emitting device package
GB2530307A (en) * 2014-09-19 2016-03-23 Johnson Electric Sa LED lighting assembly
US10775028B2 (en) 2014-12-11 2020-09-15 Datalogic Ip Tech S.R.L. Printed circuit board aperture based illumination system for pattern projection
US10433428B2 (en) * 2015-06-29 2019-10-01 Molex, Llc Application specific electronics packaging systems, methods and devices
WO2017036946A1 (en) * 2015-09-03 2017-03-09 Lumileds Holding B.V. Method of making an led device
JP2017103381A (en) * 2015-12-03 2017-06-08 シチズン電子株式会社 Light-emitting device
US20200066943A1 (en) * 2016-12-05 2020-02-27 Citizen Electronics Co., Ltd. Light-emitting apparatus
JP2019021670A (en) * 2017-07-12 2019-02-07 日本電気硝子株式会社 Multilayer ceramic substrate and multilayer ceramic package
US10892256B2 (en) * 2018-01-31 2021-01-12 Nanolumens Acquisition, Inc. Light emitting display system having improved fire performance
DE102018111791A1 (en) * 2018-05-16 2019-11-21 Osram Opto Semiconductors Gmbh Optoelectronic component
US20210249574A1 (en) 2020-02-06 2021-08-12 Lumileds Llc Light-emitting device with metal inlay and bottom contacts
WO2021215108A1 (en) * 2020-04-24 2021-10-28 株式会社村田製作所 High frequency module and communication device
US11575074B2 (en) 2020-07-21 2023-02-07 Lumileds Llc Light-emitting device with metal inlay and top contacts

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030019568A1 (en) * 2001-01-08 2003-01-30 Kuo-Chuan Liu Method for joining conductive structures and an electrical conductive article
US6803653B1 (en) * 2001-12-07 2004-10-12 Advanced Micro Devices, Inc. Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability
US20040229391A1 (en) * 2003-04-25 2004-11-18 Kazuyuki Ohya LED lamp manufacturing process
US20050017366A1 (en) * 2001-12-10 2005-01-27 Galli Robert D. LED lighting assembly with improved heat management

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3744557A (en) * 1971-07-19 1973-07-10 Argus Eng Co Apparatus for fusing and sealing platings and the like
US4803546A (en) 1986-09-17 1989-02-07 Fujitsu Limited Heatsink package for flip-chip IC
US4918571A (en) * 1987-03-31 1990-04-17 Amp Incorporated Chip carrier with energy storage means
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
US5195154A (en) 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
US5216283A (en) 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US5202288A (en) 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
US5172301A (en) 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5307519A (en) 1992-03-02 1994-04-26 Motorola, Inc. Circuit with built-in heat sink
EP0566872A3 (en) 1992-04-21 1994-05-11 Motorola Inc A thermally enhanced semiconductor device and method for making the same
DE69331896T2 (en) 1992-07-13 2002-09-26 Seiko Epson Corp WIDE LIGHTING DEVICE AND LIQUID CRYSTAL DISPLAY
KR100307465B1 (en) * 1992-10-20 2001-12-15 야기 추구오 Power module
US5471327A (en) 1993-05-14 1995-11-28 Kaiser Optical Systems, Inc. Holographic diffuser for back-lit display
US5654587A (en) 1993-07-15 1997-08-05 Lsi Logic Corporation Stackable heatsink structure for semiconductor devices
JPH0766331A (en) 1993-08-02 1995-03-10 Motorola Inc Manufacture of semiconductor device package
US5457605A (en) * 1993-11-23 1995-10-10 Motorola, Inc. Electronic device having coplanar heatsink and electrical contacts
JPH07221218A (en) * 1994-02-03 1995-08-18 Toshiba Corp Semiconductor device
JP2833642B2 (en) * 1994-02-15 1998-12-09 日立電線株式会社 Multilayer wiring board and method of manufacturing the same
JP3137823B2 (en) * 1994-02-25 2001-02-26 シャープ株式会社 Chip component type LED and method of manufacturing the same
JPH088463A (en) * 1994-06-21 1996-01-12 Sharp Corp Thin type led dot matrix unit
US5695847A (en) * 1996-07-10 1997-12-09 Browne; James M. Thermally conductive joining film
SE509570C2 (en) 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperature compensating means and procedure for mounting electronics on a circuit board
JP3948789B2 (en) * 1997-07-02 2007-07-25 シチズン電子株式会社 Infrared data communication module
US6295405B1 (en) 1997-07-25 2001-09-25 Physical Optics Corporation Light pipe for a backlighting system
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
GB2344690A (en) 1998-12-09 2000-06-14 Ibm Cavity down ball grid array module
FI105588B (en) 1998-12-10 2000-09-15 Nokia Mobile Phones Ltd Improved light source arrangement for flat applications
US6521916B2 (en) 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6570764B2 (en) 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
US6407411B1 (en) 2000-04-13 2002-06-18 General Electric Company Led lead frame assembly
KR20020010314A (en) 2000-07-29 2002-02-04 황한규 Regenerator of adsorption type refrigerator
CN1247162C (en) 2000-08-24 2006-03-29 库尔斯恩蒂斯股份公司 Device for connecting a bone fixation element to a longitudinal rod
KR20010000572A (en) 2000-10-04 2001-01-05 최성욱 The A.D box by bus Stop Bell
WO2002041276A2 (en) 2000-11-15 2002-05-23 Snowy Village, Inc. Led warning light and communication system
JP3945157B2 (en) 2000-12-21 2007-07-18 株式会社ダイフク Power supply equipment
EP1219643A1 (en) 2000-12-27 2002-07-03 Sumitomo Chemical Company, Limited Olefin polymer composition
JP3783572B2 (en) * 2001-03-05 2006-06-07 日亜化学工業株式会社 Light emitting device
WO2002084733A1 (en) 2001-04-09 2002-10-24 Sumitomo Metal (Smi) Electronics Devices Inc. Radiation type bga package and production method therefor
KR100419611B1 (en) * 2001-05-24 2004-02-25 삼성전기주식회사 A Light Emitting Diode, a Lighting Emitting Device Using the Same and a Fabrication Process therefor
EP1393374B1 (en) 2001-05-26 2016-08-24 GE Lighting Solutions, LLC High power led lamp for spot illumination
US6565694B2 (en) * 2001-07-24 2003-05-20 Eastman Kodak Company Method of preparing metal plates to allow lamination of a pre-press color proof
EP3078899B1 (en) * 2001-08-09 2020-02-12 Everlight Electronics Co., Ltd Led illuminator and card type led illuminating light source
JP2003060088A (en) 2001-08-14 2003-02-28 Mitsubishi Electric Corp Semiconductor memory
JP2003068076A (en) 2001-08-27 2003-03-07 Elpida Memory Inc Power control method for semiconductor memory, and semiconductor memory
JP4045781B2 (en) * 2001-08-28 2008-02-13 松下電工株式会社 Light emitting device
JP4122742B2 (en) * 2001-08-28 2008-07-23 松下電工株式会社 Light emitting device
JP4080827B2 (en) * 2001-09-24 2008-04-23 富士通株式会社 Bonding method and conductive circuit structure
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
KR20030040648A (en) 2001-11-15 2003-05-23 삼성전자주식회사 Internal supply voltage generator for semiconductor memory device
KR100439559B1 (en) 2001-12-12 2004-07-12 센트럴 임펄소라, 에스.에이. 드 씨.브이 Equipment to produce small tortilla of raw dough of nixtamalized corn(corn especially processed for making tortilla) in the shape of a taco(rolled up tortilla)
US6936855B1 (en) * 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
TW518775B (en) 2002-01-29 2003-01-21 Chi-Hsing Hsu Immersion cooling type light emitting diode and its packaging method
US6861750B2 (en) 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6876553B2 (en) 2002-03-21 2005-04-05 Broadcom Corporation Enhanced die-up ball grid array package with two substrates
KR20030082108A (en) 2002-04-16 2003-10-22 현대자동차주식회사 A paint and varnish composition for an automobile
US6900535B2 (en) 2002-05-01 2005-05-31 Stmicroelectronics, Inc. BGA/LGA with built in heat slug/spreader
JP3883908B2 (en) 2002-06-04 2007-02-21 株式会社シマノ Lure
US7185420B2 (en) 2002-06-07 2007-03-06 Intel Corporation Apparatus for thermally coupling a heat dissipation device to a microelectronic device
US7068910B2 (en) 2002-09-18 2006-06-27 Koninklijke Philips Electronics N.V. Light generating device having polarized light emitting waveguide plate
US6682331B1 (en) 2002-09-20 2004-01-27 Agilent Technologies, Inc. Molding apparatus for molding light emitting diode lamps
TWI252348B (en) 2002-10-21 2006-04-01 Toppoly Optoelectronics Corp Back light module
TWI231579B (en) * 2002-12-31 2005-04-21 Advanced Semiconductor Eng Flip chip package
JP2004269513A (en) * 2003-02-19 2004-09-30 Rohto Pharmaceut Co Ltd Solid preparation
US20040201080A1 (en) 2003-04-08 2004-10-14 Suresh Basoor Leadless leadframe electronic package and IR transceiver incorporating same
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US6864513B2 (en) 2003-05-07 2005-03-08 Kaylu Industrial Corporation Light emitting diode bulb having high heat dissipating efficiency
US7128442B2 (en) 2003-05-09 2006-10-31 Kian Shin Lee Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant
JP3938100B2 (en) 2003-05-15 2007-06-27 邦裕 服部 LED lamp and LED lighting fixture
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
US6999318B2 (en) 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
JP2005064047A (en) 2003-08-13 2005-03-10 Citizen Electronics Co Ltd Light emitting diode
US7145182B2 (en) 2003-09-12 2006-12-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Integrated emitter devices having beam divergence reducing encapsulation layer
JP2005129710A (en) * 2003-10-23 2005-05-19 Shikusuon:Kk Heatsink, manufacturing method thereof and semiconductor device
US7086754B2 (en) 2003-10-31 2006-08-08 Brocade Communications Systems, Inc. Light reflector and barrier for light emitting diodes
US7038311B2 (en) * 2003-12-18 2006-05-02 Texas Instruments Incorporated Thermally enhanced semiconductor package
KR100586698B1 (en) 2003-12-23 2006-06-08 삼성전자주식회사 Semiconductor Module having semiconductor chip package which is vertically mounted on module board
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
JP2006066868A (en) * 2004-03-23 2006-03-09 Toyoda Gosei Co Ltd Solid-state component and solid-state component device
JP4294536B2 (en) * 2004-04-21 2009-07-15 日本メクトロン株式会社 Multilayer flexible circuit board and manufacturing method thereof
US7626211B2 (en) * 2004-09-16 2009-12-01 Hitachi Aic Inc. LED reflecting plate and LED device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030019568A1 (en) * 2001-01-08 2003-01-30 Kuo-Chuan Liu Method for joining conductive structures and an electrical conductive article
US6803653B1 (en) * 2001-12-07 2004-10-12 Advanced Micro Devices, Inc. Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability
US20050017366A1 (en) * 2001-12-10 2005-01-27 Galli Robert D. LED lighting assembly with improved heat management
US20040229391A1 (en) * 2003-04-25 2004-11-18 Kazuyuki Ohya LED lamp manufacturing process

Also Published As

Publication number Publication date
US20120110842A1 (en) 2012-05-10
JP2009502024A (en) 2009-01-22
TW200709475A (en) 2007-03-01
US8129734B2 (en) 2012-03-06
JP2012114470A (en) 2012-06-14
WO2007002644A2 (en) 2007-01-04
EP1897146A2 (en) 2008-03-12
JP5600699B2 (en) 2014-10-01
US20080296599A1 (en) 2008-12-04
KR20080042798A (en) 2008-05-15
US20070007558A1 (en) 2007-01-11

Similar Documents

Publication Publication Date Title
WO2007002644A3 (en) Light emitting diode package and method for making same
EP1781076A3 (en) Electronic assembly having multiple side cooling and method
EP1770773A3 (en) Heat spreader module and method of manufacturing same
EP2455991A4 (en) Led chip assembly, led package, and manufacturing method of led package
WO2006023300A3 (en) Methods of assembly for a semiconductor light emitting device package
WO2009074964A3 (en) Light emitting diode for mounting to a heat sink
KR100955451B1 (en) Heat radiant fpcb and method for manufacturing the same
WO2006089033A3 (en) Led light module assembly
TW200637031A (en) Compact light emitting device package with enhanced heat dissipation and method for making the package
WO2011046695A3 (en) Lamp assemblies and methods of making the same
EP1891671A4 (en) Light-emitting module
TW200709766A (en) Flexible circuit board with heat sink
WO2009029804A3 (en) Method for low temperature bonding of electronic components
WO2007124277A3 (en) Light emitting diode lighting package with improved heat sink
ATE532400T1 (en) HEAT-CONDUCTIVE MOUNTING ELEMENT FOR ATTACHING AN EMBLED CIRCUIT BOARD TO A HEATSINK
JP2007165870A (en) Slim type backlight unit
TW200719028A (en) Backlight module
TW200710507A (en) Light emitting diode module, backlight assembly and display device provided with the same
SG142326A1 (en) Integrated circuit package system with heat slug
WO2009028612A1 (en) Light emitting device
WO2008126564A1 (en) Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
TW200610160A (en) Light emitting diode package and its packaging method
WO2002097881A3 (en) Folded-fin heat sink assembly and method of manufacturing same
KR100749323B1 (en) Flexible printed circuit board for LED and Fabricating method thereof
TW200642108A (en) Method of utilizing the surface mount technology to assemble LED light source, and combination of its LED light source and lens lid

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
ENP Entry into the national phase

Ref document number: 2008519472

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2006785622

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020087002151

Country of ref document: KR