WO2007002871A3 - A method for processing a mems/cmos cantilever based memory storage device - Google Patents

A method for processing a mems/cmos cantilever based memory storage device Download PDF

Info

Publication number
WO2007002871A3
WO2007002871A3 PCT/US2006/025472 US2006025472W WO2007002871A3 WO 2007002871 A3 WO2007002871 A3 WO 2007002871A3 US 2006025472 W US2006025472 W US 2006025472W WO 2007002871 A3 WO2007002871 A3 WO 2007002871A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems
cmos
processing
storage device
memory storage
Prior art date
Application number
PCT/US2006/025472
Other languages
French (fr)
Other versions
WO2007002871A2 (en
Inventor
Eyal Bar-Sadeh
Tsung-Kuan Cho
Valluri Rao
Krishnamurthy Murali
Original Assignee
Intel Corp
Eyal Bar-Sadeh
Tsung-Kuan Cho
Valluri Rao
Krishnamurthy Murali
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Eyal Bar-Sadeh, Tsung-Kuan Cho, Valluri Rao, Krishnamurthy Murali filed Critical Intel Corp
Publication of WO2007002871A2 publication Critical patent/WO2007002871A2/en
Publication of WO2007002871A3 publication Critical patent/WO2007002871A3/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
    • G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
    • G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
    • G11B9/1409—Heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
    • G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
    • G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
    • G11B9/1418—Disposition or mounting of heads or record carriers
    • G11B9/1427—Disposition or mounting of heads or record carriers with provision for moving the heads or record carriers relatively to each other or for access to indexed parts without effectively imparting a relative movement
    • G11B9/1436—Disposition or mounting of heads or record carriers with provision for moving the heads or record carriers relatively to each other or for access to indexed parts without effectively imparting a relative movement with provision for moving the heads or record carriers relatively to each other
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C23/00—Digital stores characterised by movement of mechanical parts to effect storage, e.g. using balls; Storage elements therefor

Abstract

A method is disclosed. The method includes fabricating microelectromechanical (MEMS) structures of a Seek and Scan Probe (SSP) memory device on a first wafer, and fabricating CMOS and memory medium components of the SSP memory device on a second wafer.
PCT/US2006/025472 2005-06-28 2006-06-28 A method for processing a mems/cmos cantilever based memory storage device WO2007002871A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/168,195 2005-06-28
US11/168,195 US7354788B2 (en) 2005-06-28 2005-06-28 Method for processing a MEMS/CMOS cantilever based memory storage device

Publications (2)

Publication Number Publication Date
WO2007002871A2 WO2007002871A2 (en) 2007-01-04
WO2007002871A3 true WO2007002871A3 (en) 2007-04-26

Family

ID=37566340

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/025472 WO2007002871A2 (en) 2005-06-28 2006-06-28 A method for processing a mems/cmos cantilever based memory storage device

Country Status (3)

Country Link
US (2) US7354788B2 (en)
CN (1) CN100557711C (en)
WO (1) WO2007002871A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321275B2 (en) * 2005-06-23 2008-01-22 Intel Corporation Ultra-low voltage capable zipper switch
US7354788B2 (en) * 2005-06-28 2008-04-08 Intel Corporation Method for processing a MEMS/CMOS cantilever based memory storage device
US7554421B2 (en) * 2006-05-16 2009-06-30 Intel Corporation Micro-electromechanical system (MEMS) trampoline switch/varactor
US20070121477A1 (en) * 2006-06-15 2007-05-31 Nanochip, Inc. Cantilever with control of vertical and lateral position of contact probe tip
US20070290282A1 (en) * 2006-06-15 2007-12-20 Nanochip, Inc. Bonded chip assembly with a micro-mover for microelectromechanical systems
US20070291623A1 (en) * 2006-06-15 2007-12-20 Nanochip, Inc. Cantilever with control of vertical and lateral position of contact probe tip
US7605675B2 (en) * 2006-06-20 2009-10-20 Intel Corporation Electromechanical switch with partially rigidified electrode
US20080074792A1 (en) * 2006-09-21 2008-03-27 Nanochip, Inc. Control scheme for a memory device
US20080074984A1 (en) * 2006-09-21 2008-03-27 Nanochip, Inc. Architecture for a Memory Device
US7514942B2 (en) * 2006-09-27 2009-04-07 Intel Corporation Probe based patterning of microelectronic and micromechanical devices
US7851876B2 (en) * 2006-10-20 2010-12-14 Hewlett-Packard Development Company, L.P. Micro electro mechanical system
US7622780B2 (en) * 2006-12-21 2009-11-24 Intel Corporation Seek-scan probe (SSP) including see-saw scan probe with redundant tip
US20080233672A1 (en) * 2007-03-20 2008-09-25 Nanochip, Inc. Method of integrating mems structures and cmos structures using oxide fusion bonding
US7687297B2 (en) * 2007-06-29 2010-03-30 Intel Corporation Forming a cantilever assembly for vertical and lateral movement
US20090009906A1 (en) * 2007-07-02 2009-01-08 Seagate Technology Llc Transducer Assembly and Data Storage Device Including the Transducer Assembly
JP2010538403A (en) 2007-08-29 2010-12-09 アイメック Tip forming method
US7397754B1 (en) * 2008-01-22 2008-07-08 International Business Machines Corporation Micro-electromechanical system based data storage system
US8644125B2 (en) * 2008-09-30 2014-02-04 Intel Corporation Seek scan probe (SSP) cantilever to mover wafer bond stop
US8304274B2 (en) * 2009-02-13 2012-11-06 Texas Instruments Incorporated Micro-electro-mechanical system having movable element integrated into substrate-based package
US8945403B2 (en) 2012-04-27 2015-02-03 Micron Technology, Inc. Material test structure
US9102119B2 (en) 2012-06-26 2015-08-11 General Electric Company Encapsulated beam and method of forming
US9038269B2 (en) * 2013-04-02 2015-05-26 Xerox Corporation Printhead with nanotips for nanoscale printing and manufacturing
US10291283B2 (en) 2016-04-01 2019-05-14 Intel Corporation Tunable radio frequency systems using piezoelectric package-integrated switching devices
US10134645B2 (en) * 2017-03-29 2018-11-20 Taiwan Semiconductor Manufacturing Company Ltd. Stress monitoring device and method of manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546375A (en) * 1992-07-15 1996-08-13 Canon Kabushiki Kaisha Method of manufacturing a tip for scanning tunneling microscope using peeling layer
US5970315A (en) * 1995-07-21 1999-10-19 Carnegie Mellon University Microelectromechanical structure and process of making same
US20040150472A1 (en) * 2002-10-15 2004-08-05 Rust Thomas F. Fault tolerant micro-electro mechanical actuators

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835589B2 (en) * 2002-11-14 2004-12-28 International Business Machines Corporation Three-dimensional integrated CMOS-MEMS device and process for making the same
US7354788B2 (en) * 2005-06-28 2008-04-08 Intel Corporation Method for processing a MEMS/CMOS cantilever based memory storage device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546375A (en) * 1992-07-15 1996-08-13 Canon Kabushiki Kaisha Method of manufacturing a tip for scanning tunneling microscope using peeling layer
US5970315A (en) * 1995-07-21 1999-10-19 Carnegie Mellon University Microelectromechanical structure and process of making same
US20040150472A1 (en) * 2002-10-15 2004-08-05 Rust Thomas F. Fault tolerant micro-electro mechanical actuators

Also Published As

Publication number Publication date
US7354788B2 (en) 2008-04-08
US7787352B2 (en) 2010-08-31
US20060289954A1 (en) 2006-12-28
CN100557711C (en) 2009-11-04
CN1983447A (en) 2007-06-20
US20080105937A1 (en) 2008-05-08
WO2007002871A2 (en) 2007-01-04

Similar Documents

Publication Publication Date Title
WO2007002871A3 (en) A method for processing a mems/cmos cantilever based memory storage device
US7795695B2 (en) Integrated microphone
EP1695937A3 (en) Integrated micro electro-mechanical system and manufacturing method thereof
WO2007030226A3 (en) Backside thinned image sensor with integrated lens stack
WO2006063070A3 (en) All surface data for use in substrate inspection
WO2007141685A3 (en) Acoustic device and method of manufacturing same
WO2006123299A3 (en) Methods for fabricating micro-electro-mechanical devices
WO2005044721A8 (en) Mems devices with unreleased thin film components
WO2008040991A3 (en) Microphone array
WO2003014009A3 (en) A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in mems
EP1652219A4 (en) Anchors for microelectromechanical systems having an soi substrate, and method of fabricating same
JP4091041B2 (en) Tactile sensor and manufacturing method thereof
WO2005084358A3 (en) Damage detection device
AU2001250619A1 (en) Systems and methods for testing and calibrating a focused ultrasound transducer array
WO2006009925A3 (en) Method and device for cavity obliteration
WO2003052420A3 (en) Device and bioanalytical method utilizing asymmetric biofunction alized membrane
WO2008051238A3 (en) Nanochannel apparatus and method of fabricating
TWI365534B (en) Semiconductor imaging instrument and manufacturing method thereof, and camera and manufacturing method thereof
AU2003250949A1 (en) Method for determining the position of a positioning element of an electrically-operated actuator, corresponding circuit arrangement and device
WO2007129256A3 (en) Integrated temperature sensor
Chan et al. Design and implementation of a capacitive-type microphone with rigid diaphragm and flexible spring using the two poly silicon micromachining processes
WO2005047825A3 (en) Microelectromechanical floating element flow sensor
Currano et al. Latching ultra-low power MEMS shock sensors for acceleration monitoring
WO2008005894A3 (en) Wafer-level alignment of optical elements
WO2008136242A1 (en) Optical pickup device and objective optical element

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06785903

Country of ref document: EP

Kind code of ref document: A2