WO2007010725A1 - ウェハ位置教示方法および教示治具装置 - Google Patents
ウェハ位置教示方法および教示治具装置 Download PDFInfo
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- WO2007010725A1 WO2007010725A1 PCT/JP2006/313027 JP2006313027W WO2007010725A1 WO 2007010725 A1 WO2007010725 A1 WO 2007010725A1 JP 2006313027 W JP2006313027 W JP 2006313027W WO 2007010725 A1 WO2007010725 A1 WO 2007010725A1
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- WIPO (PCT)
- Prior art keywords
- teaching
- wafer
- robot
- jig
- external
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37608—Center and diameter of hole, wafer, object
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40562—Position and orientation of end effector, teach probe, track them
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/50—Machine tool, machine tool null till machine tool work handling
- G05B2219/50125—Configurable fixture, jig
Definitions
- Wafer position teaching method and teaching jig apparatus Wafer position teaching method and teaching jig apparatus
- the present invention relates to a method for teaching a position of a semiconductor wafer to a semiconductor wafer transfer robot, and particularly to an external teaching jig.
- the inventors of the present application have previously proposed a method of sensing a teaching jig using a hand provided with two transmitted light sensors (see, for example, Patent Document 1).
- the operation of automatically moving the wafer gripping part to the vicinity of the teaching jig in order to sense the teaching jig with the sensor of the robot wafer gripping part is the teaching position ( Hereinafter, this is performed based on a prior teaching position).
- the inventors of the present application have also proposed a method of manually moving the wafer gripping part to the vicinity of the teaching jig (see, for example, Patent Document 2), but increasing the automation rate and shortening the teaching operation time. For this purpose, it is desirable that the movement of the wafer gripping portion is automatic.
- Patent Document 1 International Publication WO03Z22534
- Patent Document 2 JP 2005-123261 A
- the wafer gripping part is used as a teaching jig hair.
- a frontage an apparatus having a narrow opening at the apparatus entrance
- the present invention has been made in view of such problems, and by sensing an external teaching jig installed on the outer wall of the front of the apparatus and correcting the teaching position in advance, the wafer gripping unit and the apparatus It is an object of the present invention to provide a method capable of automatically and accurately teaching the position of a semiconductor wafer even in a device having a narrow frontage without causing interference with the device. It is another object of the present invention to provide an external teaching jig and its installation method that do not narrow the movable range of the robot during normal wafer transfer by installing the external teaching jig.
- the present invention is as follows.
- a robot that transfers a semiconductor wafer between a storage container and a processing apparatus or between processing apparatuses is taught at a position where a semiconductor wafer of the storage container or the processing apparatus is installed.
- An external teaching jig installed on the front outer wall of the processing apparatus before detecting the teaching jig with a sensor provided on the wafer gripping portion of the robot and sensing the teaching jig with the sensor. Sensing with the sensor, the position of the teaching jig is roughly estimated, and based on the estimated position, the sensor approaches the teaching jig with the sensor and senses the semiconductor wafer.
- the number of the external teaching jigs is at least two. Also of a is installed on is offset in the horizontal position the installation position in front outer wall of the processing apparatus.
- an external device for preliminarily sensing that is provided for teaching a position of the semiconductor wafer to a robot that transfers the semiconductor wafer between the storage container and the processing apparatus or between the processing apparatuses.
- the number of the external teaching jigs is at least two, and the installation position is set on the front outer wall of the processing apparatus. It is installed at a position offset in the horizontal direction.
- the position of the teaching jig is estimated by sensing an external teaching jig provided on the outer front wall of the device, and the pre-taught position calculated from the device drawing held by the controller is replaced with the estimated position.
- the robot can guide the wafer gripper to the teaching jig without interfering with the apparatus by approaching the teaching jig based on the corrected prior teaching position.
- the wafer gripper can approach the teaching jig, there is an effect that the position of the semiconductor wafer can be automatically taught even if the frontage is narrow and the apparatus is connected.
- FIG. 1 is a plan view showing a running motion of a robot using the present invention.
- FIG. 2 is a plan view showing the turning motion of the robot using the present invention.
- FIG. 3 is a plan view showing the expansion and contraction motion of the robot using the present invention.
- FIG. 4 is a side view showing the lifting and lowering operation of the robot using the present invention.
- FIG. 5 is a perspective view showing the transmission sensor in FIG.
- FIG. 6 is a plan view showing the wafer conveyance device of the present invention.
- FIG. 7 is an explanatory view showing a mounting state of the external teaching jig of the present invention.
- FIG. 8 is a flowchart showing the operation of the present invention.
- FIG. 10 is an explanatory diagram showing the teaching position estimation method of the present invention.
- FIG. 1 is a plan view of a robot showing an embodiment of the present invention
- FIG. 4 is a side view thereof.
- 1 is a horizontal articulated robot for transporting semiconductor wafers
- W is a semiconductor wafer to be transported by robot 1.
- the robot 1 includes a first arm 3 that swivels in a horizontal plane around a robot swivel center axis 7 of a column-shaped support column 2 that can be moved up and down, and a second arm that is pivotally attached to the tip of the first arm 3 in a horizontal plane.
- An arm 4 and a wafer gripping part 5 attached to the tip of the second arm 4 so as to be rotatable in a horizontal plane are provided.
- the wafer gripping part 5 is a Y-shaped hand for placing the semiconductor wafer W, and has a pair of transmission sensors 6 at the Y-shaped tip.
- 21 is a traveling axis unit
- 22 is a traveling axis robot mount.
- Robot 1 is fixed to the traveling axis robot mount 22.
- Robot 1 has 4 degrees of freedom as follows. That is, as shown in the plan view of FIG. 2, while maintaining the relative angles of the first arm 3, the second arm 4 and the wafer gripping part 5, the first arm 3 is moved around the central axis 7 of the column part 2. As shown in the plan view of FIG. 3, the first arm 3, the second arm 4 and the wafer gripper 5 are swung while maintaining a constant speed ratio, as shown in the plan view of FIG.
- R-axis operation extension / contraction
- Z-axis operation elevation
- travel axis unit 21 as shown in FIG.
- T-axis motion travel in which the robot 1 travels by linear motion.
- the ⁇ axis is positive in the counterclockwise direction (see Fig. 2)
- the R axis is in the positive direction in which the wafer gripping part 5 is moved away from the support part 2, that is, the direction in which the arm is extended (see Figure 3)
- the direction to raise the column 2 is positive (see Fig. 4)
- the direction to move the robot upward in the drawing is positive (see Fig. 1).
- FIG. 5 is a perspective view showing details of the wafer gripping portion 5.
- 8 is a light emitting part attached to one end of a Y-shaped wafer gripping part 5
- 9 is a light receiving part attached to the other end so as to face the light emitting part 8.
- the light-emitting unit 8 and the light-receiving unit 9 constitute a transmissive sensor 6.
- Reference numeral 10 denotes a directional optical axis from the light emitting unit 8 to the light receiving unit 9, and the transmission sensor 6 can detect an object that blocks the optical axis 10.
- FIG. 6 is a plan view showing the overall arrangement of the wafer conveyance device of the present invention.
- 14 and 15 are processing devices
- 11, 12 and 13 are storage containers
- 16 is a teaching jig
- 17 is an external teaching jig
- 18 is a movable range of the robot 1 with a minimum turning posture.
- Two external teaching tools 17 are arranged in each of the processing devices 14 and 15.
- the external teaching jig 17 is installed with the movable range 18 by the minimum turning posture of the mouth bot 1 removed. In this way, even with the external teaching jig 17 installed, the robot 1 can move on the traveling axis as usual without interfering with the external teaching jig 17 in the minimum turning posture.
- the external teaching jig 17 is structured to be removable, the movable range of the robot 1 can be secured as usual.
- the external teaching jig 17 is not installed on the front outer wall of the storage container. This is because the opening of the storage container is sufficiently wide.
- FIG. 7 is a side view and an elevational view of an apparatus in which two external teaching jigs 17 are attached to the processing apparatus 14.
- Two external teaching jigs 17 are arranged on the front outer wall 19 of the processing unit, and the center of the circumference is located at a position where the front force of the center of the teaching jig 16 inside the processing unit 14 is offset by the distance LpinZ2 in the horizontal direction. Install. That is, the distance between the two external teaching jigs 17 is Lpin. Lpin is a value that is set to the controller in advance because it is known at the time of designing the mounting position of the external teaching jig 17 like Zofst and Rofst. Since the relative positions of the two external teaching jigs 17 with respect to the teaching jig 16 are thus determined, the positions of the teaching jigs 16 can be estimated if the positions of the two external teaching jigs 17 are obtained.
- FIGS. 8 and 9 are flow charts showing a method for detecting the positions of the two external teaching jigs 17 according to the present invention. Hereinafter, this position detection method will be described step by step.
- Step 1 Install two external teaching jigs 17 on the front outer wall 19 of the processing equipment.
- Step 3 Move the R-axis of the robot back to a position where the transmission sensor 6 does not detect the i-th external teaching jig 17.
- Step 4 Move the ⁇ axis to change the orientation of the wafer gripping part 5, then move the R axis to move the wafer gripping part 5 forward and slowly approach the i-th external teaching jig 17.
- the transmission sensor 6 records the coordinates of the ⁇ axis and the R axis when the i-th external teaching jig 17 is first detected (that is, the optical axis 10 is in contact with the circumference of the external teaching jig 17).
- Step 5 If Step 3 and Step 4 are repeated N times, go to Step 6. Otherwise return to step 3.
- N is an arbitrary value of 3 or more.
- Step 6 Repeat Step 3 and Step 4 N times to bring the wafer gripping part 5 closer to the i-th external teaching jig 17 from different directions, and the optical axis 10 is the circle of the external teaching jig 17 of the mesh.
- Zhou Find multiple coordinates of ⁇ axis and R axis when touching. These value forces are also obtained by finding the center position (0, R) of the i-th external teaching jig 17 by solving the least square method. This solution
- Step 7 The ⁇ axis is moved and the wafer gripping part 5 is moved so as to be perpendicular to the processing apparatus 14. Furthermore, even if the R-axis is advanced about 10 mm and the Z-axis is operated, the transmission sensor 6 can reliably detect the i-th external teaching jig 17.
- Step 8 The transmissive sensor 6 does not detect the upper surface of the i-th external teaching jig 17 while moving the Z-axis and slowly raising the wafer gripping part 5 (that is, the optical axis 10 is not connected to the external teaching jig 17). Record the value of the Z-axis when Z is exceeded) as Z.
- Step 9 Using the values recorded in Step 6 and Step 8 and Rofst, Zofst, and Lpin set in the controller in advance, the wafer teaching position inside the processing unit 14 is obtained. The method for obtaining this value will be described in detail in the next section.
- the estimated wafer teaching position is stored separately from the previous teaching position held by the controller in advance.
- the teaching position set to the controller in advance is Posl ( ⁇ , R, Z, Ding), and the estimated teaching position 24 obtained by this sensing is Pos2 (
- Step 10 Compare Posl and Pos2 for each axis, and if there is something that exceeds the threshold Thold ( ⁇ , 1 ⁇ , 2, Ding) set for each axis even for one axis, Stop automatic teaching and go to step 11. This indicates that the installation position of the processing device 14 on the drawing and the actual installation position are significantly different, and it is necessary to check the installation status of the device before performing automatic teaching. is there.
- Step 11 Overwrite Posl obtained in Step 9 as the previous teaching position of the controller and perform the conventional automatic teaching operation.
- the teaching position of the processing device 14 is obtained correctly.
- Step 12 Fold the robot 1 arm to the minimum turning posture and end automatic teaching.
- FIG. 10 is a diagram for explaining the wafer position estimation method of the present invention. According to this figure, the estimated position force of the two external teaching jigs 17 described in step 9 is also the same as that of the teaching jig 16 inside the processing unit. A method for estimating the position will be described. In the figure, R was obtained in step 6 (0
- Si force can also be calculated, and the track axis is the distance to the center of the external teaching jig 17 of the mesh.
- the average value of R and R is R (Equation 1). T was determined in step 6 (0
- Si can be calculated, and is the value of the track axis corresponding to the front of the i-th external teaching jig 17.
- the average value of T and T is T (Equation 3).
- ⁇ 0 is the processing unit for the track axis 14
- the wafer position Pos2 ( ⁇ , R, Z, T) can be obtained by equations (5) to (8).
- T avg (T xl + T xl ) / 2 ⁇ (3)
- T 2 T avg -R avg H a nA0 ... (8)
- the path when the wafer gripper 5 approaches the teaching jig 16 installed in the processing apparatus 14 thus, it is possible to avoid the wafer gripping part 5 from interfering with the apparatus when the wafer gripping part 5 passes through the opening 20 of the processing apparatus.
- the present invention is useful as a method for teaching a position of a semiconductor wafer to a semiconductor wafer transfer robot.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06767644A EP1911552A1 (en) | 2005-07-15 | 2006-06-29 | Wafer position teaching method and teaching tool |
US11/995,786 US8112177B2 (en) | 2005-07-15 | 2006-06-29 | Wafer position teaching method and teaching tool |
JP2007525926A JP4930853B2 (ja) | 2005-07-15 | 2006-06-29 | ウェハ搬送装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-206304 | 2005-07-15 | ||
JP2005206304 | 2005-07-15 |
Publications (1)
Publication Number | Publication Date |
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WO2007010725A1 true WO2007010725A1 (ja) | 2007-01-25 |
Family
ID=37668611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2006/313027 WO2007010725A1 (ja) | 2005-07-15 | 2006-06-29 | ウェハ位置教示方法および教示治具装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8112177B2 (ja) |
EP (1) | EP1911552A1 (ja) |
JP (1) | JP4930853B2 (ja) |
KR (1) | KR20080009745A (ja) |
CN (1) | CN101223010A (ja) |
TW (1) | TW200717693A (ja) |
WO (1) | WO2007010725A1 (ja) |
Cited By (3)
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WO2009145082A1 (ja) * | 2008-05-27 | 2009-12-03 | ローツェ株式会社 | 搬送装置、位置教示方法及びセンサ治具 |
JP2022520052A (ja) * | 2019-02-08 | 2022-03-28 | ヤスカワ アメリカ インコーポレイティッド | スルービーム自動ティーチング |
JP2022551767A (ja) * | 2019-12-09 | 2022-12-13 | アプライド マテリアルズ インコーポレイテッド | 自動教示エンクロージャシステム |
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US8185242B2 (en) * | 2008-05-07 | 2012-05-22 | Lam Research Corporation | Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
US8731718B2 (en) * | 2010-10-22 | 2014-05-20 | Lam Research Corporation | Dual sensing end effector with single sensor |
JP5621796B2 (ja) * | 2012-01-31 | 2014-11-12 | 株式会社安川電機 | 搬送システム |
KR20150146095A (ko) * | 2014-06-20 | 2015-12-31 | 삼성전자주식회사 | 기판 반송 장치 및 그 동작 방법 |
CN104772754B (zh) * | 2015-03-26 | 2016-05-11 | 北京欣奕华科技有限公司 | 一种机器人示教器及示教方法 |
KR102181121B1 (ko) * | 2016-09-20 | 2020-11-20 | 주식회사 원익아이피에스 | 기판 이송 장치 및 기판 이송 장치의 제어 방법 |
CN106956290B (zh) * | 2017-04-17 | 2019-09-10 | 京东方科技集团股份有限公司 | 机械臂及其操作方法、机械臂装置及显示面板生产设备 |
JP7023094B2 (ja) * | 2017-12-05 | 2022-02-21 | 日本電産サンキョー株式会社 | ロボット |
KR101957096B1 (ko) * | 2018-03-05 | 2019-03-11 | 캐논 톡키 가부시키가이샤 | 로봇 시스템, 디바이스 제조 장치, 디바이스 제조 방법 및 티칭 위치 조정방법 |
JP6985531B1 (ja) * | 2020-02-05 | 2021-12-22 | 株式会社安川電機 | 搬送システム、搬送方法および搬送装置 |
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2006
- 2006-06-29 EP EP06767644A patent/EP1911552A1/en not_active Withdrawn
- 2006-06-29 CN CNA2006800256577A patent/CN101223010A/zh active Pending
- 2006-06-29 WO PCT/JP2006/313027 patent/WO2007010725A1/ja active Application Filing
- 2006-06-29 JP JP2007525926A patent/JP4930853B2/ja not_active Expired - Fee Related
- 2006-06-29 US US11/995,786 patent/US8112177B2/en not_active Expired - Fee Related
- 2006-06-29 KR KR1020077028764A patent/KR20080009745A/ko not_active Application Discontinuation
- 2006-07-14 TW TW095125907A patent/TW200717693A/zh unknown
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JPH08335622A (ja) * | 1995-06-07 | 1996-12-17 | Tokyo Electron Ltd | 基板搬送装置 |
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JP2005310858A (ja) * | 2004-04-19 | 2005-11-04 | Yaskawa Electric Corp | ウェハ位置教示方法および教示治具装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009145082A1 (ja) * | 2008-05-27 | 2009-12-03 | ローツェ株式会社 | 搬送装置、位置教示方法及びセンサ治具 |
JP5450401B2 (ja) * | 2008-05-27 | 2014-03-26 | ローツェ株式会社 | 搬送装置、位置教示方法及びセンサ治具 |
US8688261B2 (en) | 2008-05-27 | 2014-04-01 | Rorze Corporation | Transport apparatus, position teaching method, and sensor jig |
JP2022520052A (ja) * | 2019-02-08 | 2022-03-28 | ヤスカワ アメリカ インコーポレイティッド | スルービーム自動ティーチング |
JP2022551767A (ja) * | 2019-12-09 | 2022-12-13 | アプライド マテリアルズ インコーポレイテッド | 自動教示エンクロージャシステム |
JP7326619B2 (ja) | 2019-12-09 | 2023-08-15 | アプライド マテリアルズ インコーポレイテッド | 自動教示エンクロージャシステム |
Also Published As
Publication number | Publication date |
---|---|
CN101223010A (zh) | 2008-07-16 |
EP1911552A1 (en) | 2008-04-16 |
JPWO2007010725A1 (ja) | 2009-01-29 |
KR20080009745A (ko) | 2008-01-29 |
TW200717693A (en) | 2007-05-01 |
US20090198377A1 (en) | 2009-08-06 |
JP4930853B2 (ja) | 2012-05-16 |
US8112177B2 (en) | 2012-02-07 |
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