WO2007015965A3 - Semiconductor die attachment for high vacuum tubes - Google Patents

Semiconductor die attachment for high vacuum tubes Download PDF

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Publication number
WO2007015965A3
WO2007015965A3 PCT/US2006/028418 US2006028418W WO2007015965A3 WO 2007015965 A3 WO2007015965 A3 WO 2007015965A3 US 2006028418 W US2006028418 W US 2006028418W WO 2007015965 A3 WO2007015965 A3 WO 2007015965A3
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WO
WIPO (PCT)
Prior art keywords
high vacuum
semiconductor die
vacuum tubes
die attachment
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Prior art date
Application number
PCT/US2006/028418
Other languages
French (fr)
Other versions
WO2007015965A2 (en
Inventor
Kenneth A Costello
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Priority to EP06788144.1A priority Critical patent/EP1907159B1/en
Priority to JP2008523996A priority patent/JP5063597B2/en
Publication of WO2007015965A2 publication Critical patent/WO2007015965A2/en
Publication of WO2007015965A3 publication Critical patent/WO2007015965A3/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/26—Image pick-up tubes having an input of visible light and electric output
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

There is described novel bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
PCT/US2006/028418 2005-07-28 2006-07-21 Semiconductor die attachment for high vacuum tubes WO2007015965A2 (en)

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EP06788144.1A EP1907159B1 (en) 2005-07-28 2006-07-21 Semiconductor die attachment for high vacuum tubes
JP2008523996A JP5063597B2 (en) 2005-07-28 2006-07-21 Semiconductor die attachment for high vacuum containers

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US11/193,065 2005-07-28
US11/193,065 US7607560B2 (en) 2004-05-14 2005-07-28 Semiconductor die attachment for high vacuum tubes

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WO2007015965A2 WO2007015965A2 (en) 2007-02-08
WO2007015965A3 true WO2007015965A3 (en) 2008-07-24

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EP (1) EP1907159B1 (en)
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Also Published As

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EP1907159A4 (en) 2012-07-18
WO2007015965A2 (en) 2007-02-08
JP2009503857A (en) 2009-01-29
US20050258212A1 (en) 2005-11-24
US7607560B2 (en) 2009-10-27
JP5063597B2 (en) 2012-10-31
EP1907159B1 (en) 2018-08-22
EP1907159A2 (en) 2008-04-09

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