WO2007017803A3 - Ldmos transistor - Google Patents
Ldmos transistor Download PDFInfo
- Publication number
- WO2007017803A3 WO2007017803A3 PCT/IB2006/052644 IB2006052644W WO2007017803A3 WO 2007017803 A3 WO2007017803 A3 WO 2007017803A3 IB 2006052644 W IB2006052644 W IB 2006052644W WO 2007017803 A3 WO2007017803 A3 WO 2007017803A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- drain
- ldmos transistor
- metal layer
- contact region
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 206010010144 Completed suicide Diseases 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/4175—Source or drain electrodes for field effect devices for lateral devices where the connection to the source or drain region is done through at least one part of the semiconductor substrate thickness, e.g. with connecting sink or with via-hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66681—Lateral DMOS transistors, i.e. LDMOS transistors
- H01L29/66704—Lateral DMOS transistors, i.e. LDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53219—Aluminium alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/997,209 US20080237705A1 (en) | 2005-08-10 | 2006-08-02 | Ldmos Transistor |
EP06780280A EP1915783A2 (en) | 2005-08-10 | 2006-08-02 | Ldmos transistor |
KR1020087005555A KR100932363B1 (en) | 2005-08-10 | 2006-08-02 | LMDMOS transistor |
JP2008525687A JP2009505391A (en) | 2005-08-10 | 2006-08-02 | LDMOS transistor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05107355.9 | 2005-08-10 | ||
EP05107355 | 2005-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007017803A2 WO2007017803A2 (en) | 2007-02-15 |
WO2007017803A3 true WO2007017803A3 (en) | 2007-10-18 |
Family
ID=37668131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2006/052644 WO2007017803A2 (en) | 2005-08-10 | 2006-08-02 | Ldmos transistor |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080237705A1 (en) |
EP (1) | EP1915783A2 (en) |
JP (1) | JP2009505391A (en) |
KR (1) | KR100932363B1 (en) |
CN (1) | CN101238585A (en) |
TW (1) | TW200717799A (en) |
WO (1) | WO2007017803A2 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7859336B2 (en) * | 2007-03-13 | 2010-12-28 | Astec International Limited | Power supply providing ultrafast modulation of output voltage |
US7994761B2 (en) * | 2007-10-08 | 2011-08-09 | Astec International Limited | Linear regulator with RF transistors and a bias adjustment circuit |
WO2009144616A1 (en) * | 2008-05-26 | 2009-12-03 | Nxp B.V. | Ldmos transistor |
US20110073946A1 (en) * | 2008-05-26 | 2011-03-31 | Nxp B.V. | Ldmos transistor |
WO2010010506A1 (en) | 2008-07-22 | 2010-01-28 | Nxp B.V. | Ldmos having a field plate |
WO2010016008A1 (en) * | 2008-08-05 | 2010-02-11 | Nxp B.V. | Ldmos with discontinuous metal stack fingers |
JP5487852B2 (en) * | 2008-09-30 | 2014-05-14 | サンケン電気株式会社 | Semiconductor device |
US8698240B2 (en) * | 2010-05-25 | 2014-04-15 | Macronix International Co., Ltd. | Double diffused drain metal-oxide-simiconductor devices with floating poly thereon and methods of manufacturing the same |
JP5712579B2 (en) * | 2010-11-30 | 2015-05-07 | 富士通セミコンダクター株式会社 | Semiconductor device |
CN102569381A (en) * | 2010-12-07 | 2012-07-11 | 上海华虹Nec电子有限公司 | LDMOS structure with shield grid and preparation method thereof |
CN102723329A (en) * | 2012-07-13 | 2012-10-10 | 上海先进半导体制造股份有限公司 | High-density submicro high-voltage binary-coded decimal (BCD) semiconductor device and manufacturing method thereof |
CN103855210A (en) * | 2012-12-03 | 2014-06-11 | 上海华虹宏力半导体制造有限公司 | Radio frequency transverse double-diffusion field effect transistor and manufacturing method thereof |
CN103871881B (en) * | 2012-12-14 | 2017-04-05 | 上海华虹宏力半导体制造有限公司 | The groove and preparation method of p-type LDMOS device |
US9041127B2 (en) | 2013-05-14 | 2015-05-26 | International Business Machines Corporation | FinFET device technology with LDMOS structures for high voltage operations |
CN104465772A (en) * | 2014-11-10 | 2015-03-25 | 上海华虹宏力半导体制造有限公司 | High-efficiency radio frequency LDMOS device and manufacturing method thereof |
US9281379B1 (en) | 2014-11-19 | 2016-03-08 | International Business Machines Corporation | Gate-all-around fin device |
US10205024B2 (en) * | 2016-02-05 | 2019-02-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure having field plate and associated fabricating method |
US9653410B1 (en) * | 2016-03-15 | 2017-05-16 | Nxp Usa, Inc. | Transistor with shield structure, packaged device, and method of manufacture |
TWI597847B (en) * | 2016-09-05 | 2017-09-01 | 新唐科技股份有限公司 | High voltage semiconductor device |
CN106960879B (en) * | 2017-05-23 | 2020-09-15 | 上海华虹宏力半导体制造有限公司 | MOSFET structure for improving radio frequency switch characteristic |
US20200144381A1 (en) * | 2018-11-07 | 2020-05-07 | Monolithic Power Systems, Inc. | Ldmos device with a drain contact structure with reduced size |
US11003498B1 (en) | 2020-08-10 | 2021-05-11 | Coupang Corp. | Computerized systems and methods for fail-safe loading of information on a user interface using a circuit breaker |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4757362A (en) * | 1980-05-30 | 1988-07-12 | Sharp Kabushiki Kaisha | High voltage MOS transistor |
US20010012671A1 (en) * | 1999-09-21 | 2001-08-09 | Yutaka Hoshino | Semiconductor device and a method of manufacturing the same |
WO2005022645A2 (en) * | 2003-08-27 | 2005-03-10 | Koninklijke Philips Electronics N.V. | Electronic device comprising an ldmos transistor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2616966B1 (en) * | 1987-06-22 | 1989-10-27 | Thomson Semiconducteurs | STRUCTURE OF POWER MOS TRANSISTORS |
JPH09120995A (en) * | 1995-08-22 | 1997-05-06 | Mitsubishi Electric Corp | Semiconductor device and its manufacture |
US5841166A (en) * | 1996-09-10 | 1998-11-24 | Spectrian, Inc. | Lateral DMOS transistor for RF/microwave applications |
JP2002270830A (en) * | 2001-03-12 | 2002-09-20 | Fuji Electric Co Ltd | Semiconductor device |
EP1435648A1 (en) * | 2002-12-30 | 2004-07-07 | STMicroelectronics S.r.l. | Process of making CMOS and drain extension MOS transistors with silicided gate |
US7109562B2 (en) * | 2005-02-07 | 2006-09-19 | Leadtrend Technology Corp. | High voltage laterally double-diffused metal oxide semiconductor |
-
2006
- 2006-08-02 WO PCT/IB2006/052644 patent/WO2007017803A2/en active Application Filing
- 2006-08-02 JP JP2008525687A patent/JP2009505391A/en active Pending
- 2006-08-02 EP EP06780280A patent/EP1915783A2/en not_active Withdrawn
- 2006-08-02 CN CN200680028703.9A patent/CN101238585A/en active Pending
- 2006-08-02 US US11/997,209 patent/US20080237705A1/en not_active Abandoned
- 2006-08-02 KR KR1020087005555A patent/KR100932363B1/en not_active IP Right Cessation
- 2006-08-07 TW TW095128874A patent/TW200717799A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4757362A (en) * | 1980-05-30 | 1988-07-12 | Sharp Kabushiki Kaisha | High voltage MOS transistor |
US20010012671A1 (en) * | 1999-09-21 | 2001-08-09 | Yutaka Hoshino | Semiconductor device and a method of manufacturing the same |
WO2005022645A2 (en) * | 2003-08-27 | 2005-03-10 | Koninklijke Philips Electronics N.V. | Electronic device comprising an ldmos transistor |
Non-Patent Citations (3)
Title |
---|
CONTIERO C ET AL: "Progress in power ICs and MEMS, analog technologies to interface the real world", PROCEEDINGS OF THE 16TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD '04), KITAKYUSHU, JP, MAY 24-27, 2004, 24 May 2004 (2004-05-24) - 27 May 2004 (2004-05-27), IEEE, PISCATAWAY, NJ, USA, pages 3 - 12, XP010723316, ISBN: 4-88686-060-5 * |
FUJISHIMA N ET AL: "A 700V lateral power MOSFET with narrow gap double metal field plates realizing low on-resistance and long-term stability of performance", PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS (ISPSD'01), OSAKA, JP, JUNE 4-7, 2001, 4 June 2001 (2001-06-04) - 7 June 2001 (2001-06-07), IEEE, PISCATAWAY, NJ, USA, pages 255 - 258, XP010551614, ISBN: 4-88686-056-7 * |
MOSCATELLI A ET AL: "LDMOS implementation in a 0.35 mum BCD technology (BCD6)", PROCEEDINGS OF THE 12TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2000). TOULOUSE, FR, MAY 22-25, 2000, 22 May 2000 (2000-05-22) - 25 May 2000 (2000-05-25), IEEE, PISCATAWAY, NJ, USA, pages 323 - 326, XP000987879, ISBN: 0-7803-6269-1 * |
Also Published As
Publication number | Publication date |
---|---|
TW200717799A (en) | 2007-05-01 |
JP2009505391A (en) | 2009-02-05 |
KR20080038207A (en) | 2008-05-02 |
US20080237705A1 (en) | 2008-10-02 |
EP1915783A2 (en) | 2008-04-30 |
WO2007017803A2 (en) | 2007-02-15 |
KR100932363B1 (en) | 2009-12-16 |
CN101238585A (en) | 2008-08-06 |
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