WO2007055678A3 - Polishing pad with microporous regions - Google Patents

Polishing pad with microporous regions Download PDF

Info

Publication number
WO2007055678A3
WO2007055678A3 PCT/US2005/030951 US2005030951W WO2007055678A3 WO 2007055678 A3 WO2007055678 A3 WO 2007055678A3 US 2005030951 W US2005030951 W US 2005030951W WO 2007055678 A3 WO2007055678 A3 WO 2007055678A3
Authority
WO
WIPO (PCT)
Prior art keywords
region
adjacent
polishing
void volume
regions
Prior art date
Application number
PCT/US2005/030951
Other languages
French (fr)
Other versions
WO2007055678A2 (en
Inventor
Abaneshwar Prasad
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Priority to EP05858600A priority Critical patent/EP1814694B1/en
Priority to KR1020077007136A priority patent/KR101109324B1/en
Priority to JP2007544336A priority patent/JP5248861B2/en
Priority to CN2005800291519A priority patent/CN101068656B/en
Publication of WO2007055678A2 publication Critical patent/WO2007055678A2/en
Publication of WO2007055678A3 publication Critical patent/WO2007055678A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Abstract

A polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions which have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary is provided. In a first embodiment, a first region and a second adjacent region have a first and second non-zero void volume, respectively, wherein the first void volume is less than the second void volume. In a second embodiment, a first non-porous region is adjacent to a second adjacent porous region, wherein the second region has an average pore size of 50 µm or less. In a third embodiment, at least two of an optically transmissive region, a first porous region, and an optional second porous region, are adjacent. Further provided are methods of polishing a substrate comprising the use of the polishing pads and a method of producing the polishing pads.
PCT/US2005/030951 2004-09-01 2005-08-31 Polishing pad with microporous regions WO2007055678A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP05858600A EP1814694B1 (en) 2004-09-01 2005-08-31 Polishing pad with microporous regions
KR1020077007136A KR101109324B1 (en) 2004-09-01 2005-08-31 Polishing pad with microporous regions
JP2007544336A JP5248861B2 (en) 2004-09-01 2005-08-31 Polishing pad with microporous region
CN2005800291519A CN101068656B (en) 2004-09-01 2005-08-31 Polishing pad with microporous regions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/931,908 2004-09-01
US10/931,908 US8075372B2 (en) 2004-09-01 2004-09-01 Polishing pad with microporous regions

Publications (2)

Publication Number Publication Date
WO2007055678A2 WO2007055678A2 (en) 2007-05-18
WO2007055678A3 true WO2007055678A3 (en) 2007-08-02

Family

ID=35944003

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/030951 WO2007055678A2 (en) 2004-09-01 2005-08-31 Polishing pad with microporous regions

Country Status (8)

Country Link
US (1) US8075372B2 (en)
EP (1) EP1814694B1 (en)
JP (1) JP5248861B2 (en)
KR (1) KR101109324B1 (en)
CN (1) CN101068656B (en)
MY (1) MY148500A (en)
TW (1) TWI279289B (en)
WO (1) WO2007055678A2 (en)

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JP2008512006A (en) 2008-04-17
EP1814694B1 (en) 2012-11-28
EP1814694A2 (en) 2007-08-08
TW200621425A (en) 2006-07-01
US8075372B2 (en) 2011-12-13
WO2007055678A2 (en) 2007-05-18
US20060046622A1 (en) 2006-03-02
MY148500A (en) 2013-04-30
TWI279289B (en) 2007-04-21
KR20070102655A (en) 2007-10-19
CN101068656B (en) 2011-07-13
CN101068656A (en) 2007-11-07
JP5248861B2 (en) 2013-07-31
KR101109324B1 (en) 2012-01-31

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