WO2007076189A3 - Rotary chip attach - Google Patents

Rotary chip attach Download PDF

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Publication number
WO2007076189A3
WO2007076189A3 PCT/US2006/061035 US2006061035W WO2007076189A3 WO 2007076189 A3 WO2007076189 A3 WO 2007076189A3 US 2006061035 W US2006061035 W US 2006061035W WO 2007076189 A3 WO2007076189 A3 WO 2007076189A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
ics
place
rotary
web
Prior art date
Application number
PCT/US2006/061035
Other languages
French (fr)
Other versions
WO2007076189A2 (en
Inventor
Andre Cote
Detlef Duschek
Original Assignee
Checkpoint Systems Inc
Andre Cote
Detlef Duschek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc, Andre Cote, Detlef Duschek filed Critical Checkpoint Systems Inc
Priority to JP2008541488A priority Critical patent/JP2009516921A/en
Priority to CN2006800513044A priority patent/CN101361165B/en
Priority to ES06848844T priority patent/ES2384056T3/en
Priority to AU2006330796A priority patent/AU2006330796B2/en
Priority to EP06848844A priority patent/EP1964162B1/en
Priority to AT06848844T priority patent/ATE555495T1/en
Priority to CA2629773A priority patent/CA2629773C/en
Publication of WO2007076189A2 publication Critical patent/WO2007076189A2/en
Publication of WO2007076189A3 publication Critical patent/WO2007076189A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
PCT/US2006/061035 2005-11-18 2006-11-17 Rotary chip attach WO2007076189A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2008541488A JP2009516921A (en) 2005-11-18 2006-11-17 Rotary tip mounting
CN2006800513044A CN101361165B (en) 2005-11-18 2006-11-17 Rotary chip attach method and device
ES06848844T ES2384056T3 (en) 2005-11-18 2006-11-17 Rotating microcircuit coupling
AU2006330796A AU2006330796B2 (en) 2005-11-18 2006-11-17 Rotary chip attach
EP06848844A EP1964162B1 (en) 2005-11-18 2006-11-17 Rotary chip attach
AT06848844T ATE555495T1 (en) 2005-11-18 2006-11-17 ROTARY CHIP ATTACHMENT
CA2629773A CA2629773C (en) 2005-11-18 2006-11-17 Rotary chip attach

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73812005P 2005-11-18 2005-11-18
US60/738,120 2005-11-18
US11/560,692 2006-11-16
US11/560,692 US7569932B2 (en) 2005-11-18 2006-11-16 Rotary chip attach

Publications (2)

Publication Number Publication Date
WO2007076189A2 WO2007076189A2 (en) 2007-07-05
WO2007076189A3 true WO2007076189A3 (en) 2007-12-21

Family

ID=38048020

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/061035 WO2007076189A2 (en) 2005-11-18 2006-11-17 Rotary chip attach

Country Status (9)

Country Link
US (2) US7569932B2 (en)
EP (1) EP1964162B1 (en)
JP (1) JP2009516921A (en)
CN (1) CN101361165B (en)
AT (1) ATE555495T1 (en)
AU (1) AU2006330796B2 (en)
CA (1) CA2629773C (en)
ES (1) ES2384056T3 (en)
WO (1) WO2007076189A2 (en)

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SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
DE102007048397B3 (en) * 2007-10-09 2008-11-20 Siemens Ag Semiconductor chip delivering device for automatic assembly of component carrier, has provision plane receiving wafer and arranged above another provision plane, and transfer devices assigned to one of provision planes
CN107658248B (en) * 2011-06-03 2021-06-22 豪锐恩科技私人有限公司 System for placing semiconductor chips on a substrate
JP5758786B2 (en) * 2011-12-14 2015-08-05 株式会社日立製作所 Method and apparatus for manufacturing solar cell module
WO2013171863A1 (en) * 2012-05-16 2013-11-21 上野精機株式会社 Die bonder device
TWI525741B (en) * 2012-05-23 2016-03-11 The angle positioning method of the wafer-mounted ring assembly and the mechanism for carrying out the
US8779578B2 (en) * 2012-06-29 2014-07-15 Hewlett-Packard Development Company, L.P. Multi-chip socket
JP2014075531A (en) * 2012-10-05 2014-04-24 Samsung Techwin Co Ltd Component mounting apparatus
DE102015013495B4 (en) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Receiving device for components and methods for removing defective components from this
DE102015013494B3 (en) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Component handling device and method for removing components from a structured component supply and for depositing at a receiving device
CN105742931B (en) * 2016-03-01 2018-01-16 宣城市亿鸣科技有限公司 A kind of pulley-type periodicity electric wire terminal machine
JP6312270B2 (en) * 2016-03-25 2018-04-18 株式会社写真化学 Electronic device manufacturing method and device using device chip
KR102417917B1 (en) 2016-04-26 2022-07-07 삼성전자주식회사 Process system and operation method thereof
US10297110B2 (en) 2016-06-29 2019-05-21 Igt Gaming system and method for providing a central determination of game outcomes and progressive awards
CN107665828A (en) * 2016-07-29 2018-02-06 上海微电子装备（集团）股份有限公司 A kind of automated bonding device and method
AR118939A1 (en) * 2020-05-15 2021-11-10 Marisa Rosana Lattanzi COMBINED MACHINE TO PRODUCE LAMINAR SEPARATORS FOR PRODUCTS CONTAINED IN BOXES AND DRAWERS
US20220059406A1 (en) * 2020-08-21 2022-02-24 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package
CN112967991B (en) * 2020-11-25 2022-10-21 重庆康佳光电技术研究院有限公司 Transfer device, system and method
CN116072589A (en) * 2023-03-07 2023-05-05 苏州易缆微光电技术有限公司 Integrated optical module packaging equipment

Citations (5)

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Publication number Priority date Publication date Assignee Title
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
DE10214347A1 (en) * 2002-03-11 2003-09-25 Georg Rudolf Sillner Device for processing and handling semiconductor chips, has work stations to remove and transfer chips and transfer modules with pick-up elements.
WO2004064124A1 (en) * 2003-01-16 2004-07-29 Koninklijke Philips Electronics N.V. Chip transfer method and apparatus
US20040154161A1 (en) * 2003-02-07 2004-08-12 Hallys Corporation Random-period chip transfer apparatus
EP1159861B1 (en) * 1999-03-05 2004-11-17 Siemens Aktiengesellschaft Device for fitting a substrate with a flip chip

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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
EP1159861B1 (en) * 1999-03-05 2004-11-17 Siemens Aktiengesellschaft Device for fitting a substrate with a flip chip
DE10214347A1 (en) * 2002-03-11 2003-09-25 Georg Rudolf Sillner Device for processing and handling semiconductor chips, has work stations to remove and transfer chips and transfer modules with pick-up elements.
WO2004064124A1 (en) * 2003-01-16 2004-07-29 Koninklijke Philips Electronics N.V. Chip transfer method and apparatus
US20040154161A1 (en) * 2003-02-07 2004-08-12 Hallys Corporation Random-period chip transfer apparatus

Also Published As

Publication number Publication date
US7820481B2 (en) 2010-10-26
US20070114659A1 (en) 2007-05-24
ATE555495T1 (en) 2012-05-15
EP1964162B1 (en) 2012-04-25
AU2006330796B2 (en) 2012-03-15
AU2006330796A1 (en) 2007-07-05
US7569932B2 (en) 2009-08-04
EP1964162A2 (en) 2008-09-03
CA2629773C (en) 2012-07-10
ES2384056T3 (en) 2012-06-28
JP2009516921A (en) 2009-04-23
CN101361165A (en) 2009-02-04
US20090269882A1 (en) 2009-10-29
CA2629773A1 (en) 2007-07-05
CN101361165B (en) 2011-12-07
WO2007076189A2 (en) 2007-07-05

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