WO2007078714A3 - Integrated capacitors in package-level structures, processes of making same, and systems containing same - Google Patents

Integrated capacitors in package-level structures, processes of making same, and systems containing same Download PDF

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Publication number
WO2007078714A3
WO2007078714A3 PCT/US2006/047331 US2006047331W WO2007078714A3 WO 2007078714 A3 WO2007078714 A3 WO 2007078714A3 US 2006047331 W US2006047331 W US 2006047331W WO 2007078714 A3 WO2007078714 A3 WO 2007078714A3
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WO
WIPO (PCT)
Prior art keywords
same
package
processes
top electrode
systems containing
Prior art date
Application number
PCT/US2006/047331
Other languages
French (fr)
Other versions
WO2007078714A2 (en
Inventor
John J Tang
Xiang Yin Zeng
Jiangqi He
Ding Hai
Original Assignee
Intel Corp
John J Tang
Xiang Yin Zeng
Jiangqi He
Ding Hai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, John J Tang, Xiang Yin Zeng, Jiangqi He, Ding Hai filed Critical Intel Corp
Priority to KR1020137012718A priority Critical patent/KR20130056365A/en
Priority to CN2006800501422A priority patent/CN101351873B/en
Priority to KR1020117021787A priority patent/KR101312135B1/en
Publication of WO2007078714A2 publication Critical patent/WO2007078714A2/en
Publication of WO2007078714A3 publication Critical patent/WO2007078714A3/en

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
PCT/US2006/047331 2005-12-30 2006-12-11 Integrated capacitors in package-level structures, processes of making same, and systems containing same WO2007078714A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020137012718A KR20130056365A (en) 2005-12-30 2006-12-11 Integrated capacitors in package-level structures, processes of making same, and systems containing same
CN2006800501422A CN101351873B (en) 2005-12-30 2006-12-11 Integrated capacitors in package-level structures, processes of making same, and systems containing same
KR1020117021787A KR101312135B1 (en) 2005-12-30 2006-12-11 Integrated capacitors in package-level structures, processes of making same, and systems containing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/323,312 2005-12-30
US11/323,312 US7670919B2 (en) 2005-12-30 2005-12-30 Integrated capacitors in package-level structures, processes of making same, and systems containing same

Publications (2)

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WO2007078714A2 WO2007078714A2 (en) 2007-07-12
WO2007078714A3 true WO2007078714A3 (en) 2007-10-04

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US (2) US7670919B2 (en)
KR (3) KR20130056365A (en)
CN (1) CN101351873B (en)
TW (1) TWI334615B (en)
WO (1) WO2007078714A2 (en)

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US7477197B2 (en) * 2006-12-29 2009-01-13 Intel Corporation Package level integration of antenna and RF front-end module
FR2961345A1 (en) * 2010-06-10 2011-12-16 St Microelectronics Tours Sas PASSIVE INTEGRATED CIRCUIT
US9923101B2 (en) 2012-09-13 2018-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure
US10910305B2 (en) 2016-12-30 2021-02-02 Intel Corporation Microelectronic devices designed with capacitive and enhanced inductive bumps

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Also Published As

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US20070158818A1 (en) 2007-07-12
KR101312135B1 (en) 2013-09-26
US7989916B2 (en) 2011-08-02
KR20110107876A (en) 2011-10-04
US20100059858A1 (en) 2010-03-11
US7670919B2 (en) 2010-03-02
CN101351873B (en) 2010-09-01
WO2007078714A2 (en) 2007-07-12
CN101351873A (en) 2009-01-21
TW200733161A (en) 2007-09-01
TWI334615B (en) 2010-12-11
KR20080081291A (en) 2008-09-09
KR20130056365A (en) 2013-05-29

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