WO2007082059B1 - Wideband optical coupling into thin soi cmos photonic integrated circuit - Google Patents
Wideband optical coupling into thin soi cmos photonic integrated circuitInfo
- Publication number
- WO2007082059B1 WO2007082059B1 PCT/US2007/000813 US2007000813W WO2007082059B1 WO 2007082059 B1 WO2007082059 B1 WO 2007082059B1 US 2007000813 W US2007000813 W US 2007000813W WO 2007082059 B1 WO2007082059 B1 WO 2007082059B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- arrangement
- lensing
- waveguide
- thin silicon
- endface
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
Abstract
An arrangement for providing optical coupling into and out of a relatively thin silicon waveguide formed in the SOI layer of an SOI structure includes a lensing element and a defined reference surface within the SOI structure for providing optical coupling in an efficient manner. The input to the waveguide may come from an optical fiber or an optical transmitting device (laser). A similar coupling arrangement may be used between a thin silicon waveguide and an output fiber (either single mode fiber or multimode fiber).
Claims
AMENDED CLAIMS [Received by the International Bureau on 08 May 2008 (08.05.2008)]
What is claimed is:
I. An arrangement for providing optical coupling to/from a relatively thin silicon waveguide formed in an upper silicon layer (SOI layer) of a silicon-on-insulator (SOI) structure comprising a silicon substrate, an overlying buried oxide layer and the upper silicon layer (SOI layer), the thin silicon waveguide formed to include an endface termination at a deep trench formed through a portion of the thickness of the SOI structure into the silicon substrate, the coupling arrangement comprising: an optical transmitting device disposed on a relatively shallow trench formed through the SOl layer into the silicon substrate a lensing component for coupling a propagating optical signal from the optical transmitting device into of the endface termination of the thin silicon waveguide; a reference plane defined at the interface between adjacent layers of the SOI structure; and a lensing fixture for supporting the lensing component, the lensing fixture attached to the SOI structure along the deep trench for providing focusing alignment between said thin silicon waveguide endface and said lensing component, said lensing fixture including a reference surface of a dimension sufficient to span the width of said deep trench and providing optical alignment between said lensing component and said endface termination of said thin silicon waveguide.
2. cancelled
3. The arrangement as defined in claim 1 wherein the lensing fixture comprises a silicon component.
4. The arrangement as defined in claim 1 wherein the shallow trench and deep trench are formed using a reactive ion etching process.
5. The arrangement as defined in claim I wherein the arrangement further comprises an active alignment element for adjusting the position of the lensing fixture with respect to the waveguide endface termination to provide maximum coupling efficiency.
6. The arrangement as defined in claim 5 wherein the active alignment element comprises a tap-out waveguide disposed adjacent to a section of the thin silicon waveguide so as to out-couple a portion of the propagating signal and a photodetector coupled to receive the optical signal propagating along the tap-out waveguide and generate therefrom a control signal for adjusting the position of the lensing fixture along the deep trench until maximum coupling efficiency is achieved.
7. An arrangement as defined in claim I wherein the arrangement is further utilized in conjunction with an optical fiber, the arrangement further comprising an alignment block including a top major surface, the alignment block including a trench formed through the top major surface to hold the optical fiber such that the fiber core is aligned with said top major surface, the alignment block mated with the SOI structure such that said top major surface is attached to the SOI structure so as to align the optical fiber core with the endface termination of the thin silicon waveguide.
8. The arrangement as defined in claim 7 wherein the optical fiber includes a lensed endface as the lensing component for coupling into/out of the thin silicon waveguide endface termination.
9. The arrangement as defined in claim 7 wherein the alignment block further comprises a deep trench formed at an end termination of the trench that supports the fiber endface for supporting a separate lensing element.
10. The arrangement as defined in claim 7 wherein the alignment block comprises silicon.
11. The arrangement as defined in claim 1 wherein the relatively thin silicon waveguide comprises sub-micron dimensions.
12. The arrangement as defined in claim 11 wherein the endface termination of the sub-micron dimensioned waveguide is configured to provide polarization independent coupling.
13. The arrangement as defined in claim 1 wherein the buried oxide layer comprises a thickness of no greater than three microns.
14. The arrangement as defined in claim 1 wherein the interface between the silicon substrate and the buried oxide layer is used as the reference plane for the alignment arrangement.
15. The arrangement as defined in claim 1 wherein then optical coupling is provided between an input optical signal and a thin silicon waveguide.
16. The arrangement as defined in claim 1 wherein the optical coupling is provided between a thin silicon waveguide and an output optical fiber.
13
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020087019511A KR101258725B1 (en) | 2006-01-11 | 2007-01-11 | Wideband optical coupling into thin soi cmos photonic integrated circuit |
| CA2636930A CA2636930C (en) | 2006-01-11 | 2007-01-11 | Wideband optical coupling into thin soi cmos photonic integrated circuit |
| CN2007800022329A CN101371175B (en) | 2006-01-11 | 2007-01-11 | Wideband optical coupling into thin SOI CMOS photonic integrated circuit |
| JP2008550424A JP5131856B2 (en) | 2006-01-11 | 2007-01-11 | Broadband optical coupling into thin SOICMOS optoelectronic integrated circuits. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75796206P | 2006-01-11 | 2006-01-11 | |
| US60/757,962 | 2006-01-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| WO2007082059A2 WO2007082059A2 (en) | 2007-07-19 |
| WO2007082059A3 WO2007082059A3 (en) | 2008-06-12 |
| WO2007082059B1 true WO2007082059B1 (en) | 2008-07-24 |
Family
ID=38257039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/000813 WO2007082059A2 (en) | 2006-01-11 | 2007-01-11 | Wideband optical coupling into thin soi cmos photonic integrated circuit |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7415184B2 (en) |
| JP (1) | JP5131856B2 (en) |
| KR (1) | KR101258725B1 (en) |
| CN (1) | CN101371175B (en) |
| CA (1) | CA2636930C (en) |
| WO (1) | WO2007082059A2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8971679B2 (en) * | 2002-08-28 | 2015-03-03 | Optonet Inc. | Apparatus and method for passive alignment of optical devices |
| WO2009017589A2 (en) * | 2007-07-26 | 2009-02-05 | Lightwire, Inc. | Offset launch mode from nanotaper waveguide into multimode fiber |
| US8121450B2 (en) * | 2007-12-12 | 2012-02-21 | Lightwire, Inc. | Coupling between free space and optical waveguide using etched coupling surfaces |
| US8352873B2 (en) * | 2008-06-06 | 2013-01-08 | Apple Inc. | Media content and chat integration |
| WO2010044746A1 (en) * | 2008-10-16 | 2010-04-22 | Agency For Science, Technology And Research | An integrated assembly and a method of manufacturing the same |
| US8437585B2 (en) * | 2010-12-07 | 2013-05-07 | Intel Corporation | Low-cost passive optical waveguide using Si substrate |
| US8938142B2 (en) | 2010-12-15 | 2015-01-20 | Cisco Technology, Inc. | Silicon-based opto-electronic integrated circuit with reduced polarization dependent loss |
| US8728863B2 (en) | 2011-08-09 | 2014-05-20 | Soitec | Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods |
| US8842945B2 (en) | 2011-08-09 | 2014-09-23 | Soitec | Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates |
| US8617925B2 (en) | 2011-08-09 | 2013-12-31 | Soitec | Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods |
| US9229169B2 (en) * | 2011-08-16 | 2016-01-05 | International Business Machines Corporation | Lens array optical coupling to photonic chip |
| US8901576B2 (en) | 2012-01-18 | 2014-12-02 | International Business Machines Corporation | Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer |
| US9329336B2 (en) * | 2012-07-06 | 2016-05-03 | Micron Technology, Inc. | Method of forming a hermetically sealed fiber to chip connection |
| GB2506408A (en) | 2012-09-28 | 2014-04-02 | Ibm | Aligning optical components with optical waveguides using a cavity and two step structures |
| GB2506406A (en) | 2012-09-28 | 2014-04-02 | Ibm | Optical adaptor with horizontal and vertical reference surfaces |
| US20140161385A1 (en) * | 2012-12-07 | 2014-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and Apparatus for Coupling to an Optical Waveguide in a Silicon Photonics Die |
| KR102064908B1 (en) | 2013-01-25 | 2020-01-10 | 삼성전자주식회사 | Optical coupling system and optical sensor including the same |
| US9164235B1 (en) | 2014-07-02 | 2015-10-20 | Cisco Technology, Inc. | Dual tip optical coupler |
| JP6380069B2 (en) * | 2014-12-11 | 2018-08-29 | 住友電気工業株式会社 | Optical transmission module |
| US9618699B2 (en) | 2015-03-15 | 2017-04-11 | Cisco Technology, Inc. | Multilayer photonic adapter |
| US9921378B2 (en) * | 2015-04-17 | 2018-03-20 | Cisco Technology, Inc. | Optical bench for aligning an optical device |
| US9874693B2 (en) | 2015-06-10 | 2018-01-23 | The Research Foundation For The State University Of New York | Method and structure for integrating photonics with CMOs |
| US9933566B2 (en) | 2015-11-13 | 2018-04-03 | Cisco Technology, Inc. | Photonic chip with an evanescent coupling interface |
| US10025033B2 (en) | 2016-03-01 | 2018-07-17 | Advanced Semiconductor Engineering, Inc. | Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same |
| US10241264B2 (en) | 2016-07-01 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages |
| US10641976B2 (en) * | 2017-02-23 | 2020-05-05 | Ayar Labs, Inc. | Apparatus for optical fiber-to-photonic chip connection and associated methods |
| US11487059B2 (en) | 2021-02-19 | 2022-11-01 | Globalfoundries U.S. Inc. | Photonics integrated circuit with silicon nitride waveguide edge coupler |
| US11774686B2 (en) * | 2021-05-06 | 2023-10-03 | Globalfoundries U.S. Inc. | Edge couplers including a rounded region adjacent to an opening in the interconnect structure |
| US20230095039A1 (en) * | 2021-09-17 | 2023-03-30 | Intel Corporation | Technologies for optical coupling to photonic integrated circuits |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| GB2186990B (en) * | 1985-12-24 | 1990-03-21 | Herzl Laor | Integrated optic switch |
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| KR100277695B1 (en) * | 1998-09-12 | 2001-02-01 | 정선종 | Method for manufacturing a substrate for hybrid optical integrated circuit using S-O optical waveguide |
| US6839474B2 (en) | 2000-11-16 | 2005-01-04 | Shipley Company, L.L.C. | Optical assembly for coupling with integrated optical devices and method for making |
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| GB2384620A (en) * | 2002-01-25 | 2003-07-30 | Denselight Semiconductors Pte | A high speed waveguide photodetector |
| GB0201969D0 (en) * | 2002-01-29 | 2002-03-13 | Qinetiq Ltd | Integrated optics devices |
| US6832028B2 (en) | 2002-10-08 | 2004-12-14 | Innovative Technology Licensing, Llc | Liquid crystal adaptive coupler for steering a light beam relative to a light-receiving end of an optical waveguide |
| JP2005070507A (en) * | 2003-08-26 | 2005-03-17 | Sumitomo Electric Ind Ltd | Optical module and optical coupling alignment method |
| US7151738B2 (en) | 2003-11-20 | 2006-12-19 | Seagate Technology Llc | Apparatus and method for coupling light to a thin film optical waveguide |
| US7013067B2 (en) | 2004-02-11 | 2006-03-14 | Sioptical, Inc. | Silicon nanotaper couplers and mode-matching devices |
| US7274835B2 (en) * | 2004-02-18 | 2007-09-25 | Cornell Research Foundation, Inc. | Optical waveguide displacement sensor |
-
2007
- 2007-01-11 CA CA2636930A patent/CA2636930C/en active Active
- 2007-01-11 KR KR1020087019511A patent/KR101258725B1/en active IP Right Grant
- 2007-01-11 CN CN2007800022329A patent/CN101371175B/en active Active
- 2007-01-11 JP JP2008550424A patent/JP5131856B2/en not_active Expired - Fee Related
- 2007-01-11 US US11/652,348 patent/US7415184B2/en active Active
- 2007-01-11 WO PCT/US2007/000813 patent/WO2007082059A2/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN101371175B (en) | 2010-11-03 |
| CA2636930C (en) | 2014-11-25 |
| KR101258725B1 (en) | 2013-04-26 |
| US20070274630A1 (en) | 2007-11-29 |
| CN101371175A (en) | 2009-02-18 |
| WO2007082059A2 (en) | 2007-07-19 |
| CA2636930A1 (en) | 2007-07-19 |
| JP2009523264A (en) | 2009-06-18 |
| US7415184B2 (en) | 2008-08-19 |
| JP5131856B2 (en) | 2013-01-30 |
| KR20080108414A (en) | 2008-12-15 |
| WO2007082059A3 (en) | 2008-06-12 |
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