WO2007092515A3 - Heat sink gasket - Google Patents

Heat sink gasket Download PDF

Info

Publication number
WO2007092515A3
WO2007092515A3 PCT/US2007/003292 US2007003292W WO2007092515A3 WO 2007092515 A3 WO2007092515 A3 WO 2007092515A3 US 2007003292 W US2007003292 W US 2007003292W WO 2007092515 A3 WO2007092515 A3 WO 2007092515A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
receptacle
gasket
opening
electronic module
Prior art date
Application number
PCT/US2007/003292
Other languages
French (fr)
Other versions
WO2007092515A2 (en
Inventor
Alexandros Pirillis
Joseph R Llorens
Original Assignee
Methode Electronics Inc
Alexandros Pirillis
Joseph R Llorens
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Methode Electronics Inc, Alexandros Pirillis, Joseph R Llorens filed Critical Methode Electronics Inc
Publication of WO2007092515A2 publication Critical patent/WO2007092515A2/en
Publication of WO2007092515A3 publication Critical patent/WO2007092515A3/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0058Casings specially adapted for optoelectronic applications

Abstract

A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the receptacle cavity. The heat sink may have a groove in which the gasket is mounted and upon mounting the heat sink to the receptacle, the gasket surrounds the opening in the receptacle and provides a resilient shield to maintain a seal during movement of the heat sink due to insertion of the electronic module within the receptacle.
PCT/US2007/003292 2006-02-07 2007-02-07 Heat sink gasket WO2007092515A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/348,647 US7355857B2 (en) 2006-02-07 2006-02-07 Heat sink gasket
US11/348,647 2006-02-07

Publications (2)

Publication Number Publication Date
WO2007092515A2 WO2007092515A2 (en) 2007-08-16
WO2007092515A3 true WO2007092515A3 (en) 2008-06-26

Family

ID=38333832

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/003292 WO2007092515A2 (en) 2006-02-07 2007-02-07 Heat sink gasket

Country Status (2)

Country Link
US (1) US7355857B2 (en)
WO (1) WO2007092515A2 (en)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020073545A1 (en) * 2000-12-19 2002-06-20 Adc Telecommunications, Inc. Enhanced heat transfer for housings
JP2005352787A (en) * 2004-06-10 2005-12-22 Matsushita Electric Ind Co Ltd Method and apparatus for timing analysis
US7529094B2 (en) * 2006-04-28 2009-05-05 Tyco Electronics Corporation Integrated heat sink and light pipe mounting assembly
WO2008070873A2 (en) * 2006-12-07 2008-06-12 Finisar Corporation Electromagnetic radiation containment and heat management in an electronic module
US7764504B2 (en) * 2007-05-16 2010-07-27 Tyco Electronics Corporation Heat transfer system for a receptacle assembly
US7589968B1 (en) * 2007-06-11 2009-09-15 Majr Products Corp. Heat-dissipating electromagnetic shield
TW200901496A (en) * 2007-06-22 2009-01-01 Ama Precision Inc LED light module
US7539018B2 (en) * 2007-10-31 2009-05-26 Tyco Electronics Corporation Heat sink retaining clip for an electrical connector assembly
US7621773B2 (en) * 2008-04-11 2009-11-24 Tyco Electronics Corporation Receptacle assembly including a light pipe structure
US7733652B2 (en) * 2008-09-17 2010-06-08 Tyco Electronics Corporation Heat sink assembly for a pluggable module
US7625223B1 (en) * 2008-10-01 2009-12-01 Tyco Electronics Corporation Connector system with floating heat sink
US8068338B1 (en) * 2009-03-24 2011-11-29 Qlogic, Corporation Network device with baffle for redirecting cooling air and associated methods
US8035973B2 (en) 2009-08-31 2011-10-11 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage
US8339784B2 (en) * 2010-01-06 2012-12-25 Methode Electronics, Inc. Thermal management for electronic device housing
CN201726632U (en) * 2010-04-15 2011-01-26 鸿富锦精密工业(深圳)有限公司 Cooling plate fixing structure of electronic products
US8537540B2 (en) * 2010-11-02 2013-09-17 Technology Advancement Group, Inc. Field serviceable CPU module
US8885342B2 (en) 2010-12-29 2014-11-11 Methode Electronics, Inc. Thermal management for electronic device housing
US9818670B2 (en) * 2011-07-29 2017-11-14 Infinera Corporation Cooling device installation using a retainer assembly
US8670236B2 (en) * 2011-08-03 2014-03-11 Tyco Electronics Corporation Cage assembly for receiving a pluggable module
US8634195B2 (en) * 2011-09-01 2014-01-21 International Business Machines Corporation Heatsink with substance embedded to suppress electromagnetic interference
US9516795B2 (en) * 2012-01-10 2016-12-06 Brocade Communications Systems, Inc Printed circuit board cover
US8599559B1 (en) 2012-05-30 2013-12-03 Tyco Electronics Corporation Cage with a heat sink mounted on its mounting side and an EMI gasket with its fingers electrically connected to the mounting side
US9077098B2 (en) * 2012-06-14 2015-07-07 Magna Electronics Inc. Electrical connector with sealed pins
KR20140006392A (en) * 2012-07-05 2014-01-16 엘에스산전 주식회사 Electronic component box for vehicle
CN103676027B (en) * 2012-09-14 2016-01-27 泰科电子(上海)有限公司 Connector
US9048124B2 (en) * 2012-09-20 2015-06-02 Apple Inc. Heat sinking and electromagnetic shielding structures
JP6007723B2 (en) * 2012-10-19 2016-10-12 オムロン株式会社 Equipment with heat sink
US9603286B2 (en) * 2012-10-19 2017-03-21 Thomson Licensing Heat sink attachment apparatus and method
JP6003519B2 (en) * 2012-10-19 2016-10-05 オムロン株式会社 Mounting plate, equipment, and system to which equipment is attached
US9408334B2 (en) * 2013-04-30 2016-08-02 Apple Inc. Electronic device with component shielding structures and input-output connectors
US9612632B2 (en) 2013-04-30 2017-04-04 Apple Inc. Wireless electronic device with component cooling structures
US9912107B2 (en) 2014-04-01 2018-03-06 Te Connectivity Corporation Plug and receptacle assembly having a thermally conductive interface
CN104977664B (en) * 2014-04-04 2017-05-03 泰科电子(上海)有限公司 Connector, connector assembly and device
US20150330716A1 (en) * 2014-05-18 2015-11-19 Asia Vital Components Co., Ltd. Base plate fixing structure for a heat dissipating module
CN105988170B (en) * 2015-03-03 2018-09-25 泰科电子(上海)有限公司 Connector, connector assembly and equipment
US9391407B1 (en) * 2015-06-12 2016-07-12 Tyco Electronics Corporation Electrical connector assembly having stepped surface
US10884203B2 (en) * 2015-11-16 2021-01-05 Accedian Networks Inc. Cooling apparatus for pluggable modules
WO2017105616A1 (en) * 2015-12-18 2017-06-22 Continental Automotive Systems, Inc Sliding thermal shield
CN106990488B (en) * 2016-01-21 2019-02-05 正淩精密工业股份有限公司 Connector shell radiator structure
US10772245B2 (en) 2016-04-04 2020-09-08 Commscope Technologies Llc Systems and methods for thermal management for high power density EMI shielded electronic devices
EP3456162B1 (en) * 2016-05-12 2022-11-09 Continental Automotive Technologies GmbH Integrated aluminum heat sink, elastomer on talc filled pp housing for electronic module
US10624245B2 (en) * 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
US10965333B2 (en) 2016-07-26 2021-03-30 Laird Technologies, Inc. Thermal management assemblies suitable for use with transceivers and other devices
US10389397B2 (en) 2016-07-26 2019-08-20 Laird Technologies, Inc. Small form-factor pluggable (SFP) transceivers
US9893474B1 (en) * 2016-10-12 2018-02-13 International Business Machines Corporation Active cable heat sink
CN107046206B (en) * 2017-01-23 2021-07-20 富士康(昆山)电脑接插件有限公司 Electrical connector
CN106873097B (en) * 2017-03-29 2019-02-22 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN106842444B (en) * 2017-03-29 2019-12-03 青岛海信宽带多媒体技术有限公司 A kind of optical module
US10711979B2 (en) 2017-03-29 2020-07-14 Hisense Broadband Multimedia Technologies Co., Ltd. Optical module
JP6888434B2 (en) * 2017-06-16 2021-06-16 株式会社オートネットワーク技術研究所 Circuit unit
TWI677276B (en) * 2018-01-10 2019-11-11 正淩精密工業股份有限公司 High-frequency connecting device with enhanced cooling efficiency of optical module
CN108281831B (en) 2018-01-23 2020-05-12 泰科电子(上海)有限公司 Socket assembly and heat transfer assembly
US10571638B2 (en) * 2018-01-31 2020-02-25 Juniper Networks, Inc. Apparatus system, and method for mitigating electromagnetic noise in connection with optical modules in telecommunications devices
CN207588071U (en) * 2018-03-14 2018-07-06 泰科电子(上海)有限公司 Connector and radiator
CN110602905B (en) * 2018-06-13 2022-03-25 泰科电子(上海)有限公司 Connector and connector housing
US20190387650A1 (en) * 2018-06-14 2019-12-19 Cisco Technology, Inc. Heat sink for pluggable module cage
TWI737017B (en) * 2018-08-02 2021-08-21 台灣莫仕股份有限公司 Shield assembly
US10942322B2 (en) 2018-08-02 2021-03-09 Molex, Llc Shield cage assembly
CN110972444B (en) * 2018-09-30 2022-09-06 泰科电子(上海)有限公司 Heat sink and housing assembly
US10782492B2 (en) * 2019-02-08 2020-09-22 Ciena Corporation Heatsink for pluggable optical devices for the prevention of heatsink clip deformation
TWI732491B (en) * 2019-03-19 2021-07-01 美商莫仕有限公司 Computing box and its card components
TWI735857B (en) * 2019-03-29 2021-08-11 佳必琪國際股份有限公司 Pluggable connector housing structure
US10833438B1 (en) * 2019-05-01 2020-11-10 Hewlett Packard Enterprise Development Lp Apparatus for surface mount connectors
CN112531371B (en) * 2019-09-17 2022-06-03 美国莫列斯有限公司 Connector assembly
CN210430205U (en) * 2019-09-30 2020-04-28 东莞讯滔电子有限公司 Electrical connector
TWM599039U (en) * 2020-02-07 2020-07-21 貿聯國際股份有限公司 Connector with fin set
CN111208611A (en) * 2020-02-28 2020-05-29 东莞立讯技术有限公司 Connector with a locking member
CN113471748B (en) * 2020-03-30 2024-01-30 莫列斯有限公司 Connector assembly
US11249264B2 (en) 2020-07-02 2022-02-15 Google Llc Thermal optimizations for OSFP optical transceiver modules
US11462852B2 (en) 2020-08-14 2022-10-04 Google Llc Blind mate thermal cooling solution for small form factor pluggable transceiver
US11374339B2 (en) * 2020-09-18 2022-06-28 TE Connectivity Services Gmbh Circuit card locating features for pluggable module
CN114256699A (en) * 2020-09-25 2022-03-29 莫列斯有限公司 Connector assembly
US20230107130A1 (en) * 2021-09-30 2023-04-06 Nanning Fulian Fugui Precision Industrial Co., Ltd. Computer expansion module providing cooling for components placed therein
US11789220B1 (en) * 2022-03-28 2023-10-17 Amazon Technologies, Inc. Liftable heat sink design with thermal interface material for pluggable optical modules

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
US6816376B2 (en) * 2002-03-06 2004-11-09 Tyco Electronics Corporation Pluggable electronic module and receptacle with heat sink

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO141299C (en) 1974-10-10 1980-02-06 Siemens Ag PACKING FOR HIGH-FREQUENCY CONNECTION OF RELIABLE METAL SHIELDING ELEMENTS
US4678716A (en) 1985-08-06 1987-07-07 Chomerics, Inc. Electromagnetic shielding
US4945633A (en) * 1989-03-01 1990-08-07 Nokia-Mobira Oy Method of mounting a printed circuit board and securing the earthing to a casing
US5280191A (en) * 1989-12-26 1994-01-18 At&T Bell Laboratories Lightwave packaging for pairs of optical devices having thermal dissipation means
US5030793A (en) 1990-05-07 1991-07-09 Motorola Inc. Integrated EMI filter and thermal heat sink
US5187621A (en) * 1991-03-25 1993-02-16 Quantum Corporation RFI/EMI reduction for head and disk assembly
JP2945760B2 (en) 1991-08-09 1999-09-06 タンデム コンピューターズ インコーポレイテッド Electronic assembly with improved ground and electromagnetic interference shielding
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
US5252782A (en) * 1992-06-29 1993-10-12 E-Systems, Inc. Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board
JPH06164265A (en) * 1992-11-16 1994-06-10 Toshiba Corp Microwave amplifier
US5381314A (en) 1993-06-11 1995-01-10 The Whitaker Corporation Heat dissipating EMI/RFI protective function box
US5416668A (en) * 1993-11-09 1995-05-16 At&T Corp. Shielded member
EP0655882B1 (en) 1993-11-16 1996-08-21 Digital Equipment Corporation EMI shielding for electronic components
DE4340108C3 (en) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Shielding element and method for its production
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US5566052A (en) 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US5703754A (en) 1996-02-26 1997-12-30 Delco Electronics Corporation Fastenerless sealed electronic module
US5761042A (en) 1996-10-02 1998-06-02 Motorola, Inc. Radio frequency compatible multi-board cluster
US5804875A (en) * 1996-12-10 1998-09-08 Dell Computer Corporation Computer system with heat sink having an integrated grounding tab
US5947753A (en) 1997-01-13 1999-09-07 Amphenol Corporation High density connector arrangement for a circuit board module
SE511926C2 (en) 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Screen enclosure as well as process for making and using a screen enclosure and mobile phone with screen enclosure
US6065530A (en) 1997-05-30 2000-05-23 Alcatel Usa Sourcing, L.P. Weatherproof design for remote transceiver
US5880930A (en) 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
US6128194A (en) 1997-08-05 2000-10-03 3Com Corporation PC card with electromagnetic and thermal management
US6023415A (en) 1997-09-30 2000-02-08 Hewlett-Packard Company Apparatus for electro-magnetic interference (EMI) and radio frequency interference (RFI) containment with in a chassis
US5982620A (en) * 1998-06-01 1999-11-09 Asia Vital Components Co., Ltd. CPU casing structure with improved heat dissipator anchoring configuration
US6058014A (en) 1998-10-13 2000-05-02 International Business Machines Corporation Enhanced mounting hardware for a circuit board
US6061235A (en) 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6137051A (en) 1998-12-09 2000-10-24 Nortel Networks Corporation EMI shield/ gasket enclosure
US6198630B1 (en) 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6157546A (en) 1999-03-26 2000-12-05 Ericsson Inc. Shielding apparatus for electronic devices
US6116924A (en) 1999-05-25 2000-09-12 3Com Corporation Electromagnetic emissions shielding structure for circuit board connector assembly
US6219239B1 (en) 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly
US6220873B1 (en) * 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
US6243265B1 (en) 1999-10-06 2001-06-05 Intel Corporation Processor EMI shielding
US6624432B1 (en) * 1999-10-12 2003-09-23 Shielding For Electronics, Inc. EMI containment apparatus
US6892796B1 (en) * 2000-02-23 2005-05-17 General Motors Corporation Apparatus and method for mounting a power module
US6483719B1 (en) * 2000-03-21 2002-11-19 Spraylat Corporation Conforming shielded form for electronic component assemblies
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US20020135983A1 (en) * 2001-03-20 2002-09-26 Christpher Freitas Energy conversion apparatus
US6515861B1 (en) 2001-04-02 2003-02-04 Advanced Micro Devices, Inc. Method and apparatus for shielding electromagnetic emissions from an integrated circuit
US6935882B2 (en) 2002-06-21 2005-08-30 Jds Uniphase Corporation Pluggable optical transceiver latch
US6944025B2 (en) 2002-08-20 2005-09-13 Sun Microsystems, Inc. EMI shielding apparatus
US6884937B1 (en) 2003-10-08 2005-04-26 Nortel Networks Limited Electromagnetic compliant shield having electrostatic discharge protection
US7145773B2 (en) * 2004-02-26 2006-12-05 Nortel Networks Limited Pluggable electronic module
US6980437B2 (en) 2004-03-03 2005-12-27 Tyco Electronics Corporation Pluggable electronic receptacle with heat sink assembly
US7168971B2 (en) * 2005-05-31 2007-01-30 Qlogic Corporation Gasket retainer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
US6816376B2 (en) * 2002-03-06 2004-11-09 Tyco Electronics Corporation Pluggable electronic module and receptacle with heat sink

Also Published As

Publication number Publication date
US7355857B2 (en) 2008-04-08
WO2007092515A2 (en) 2007-08-16
US20070183128A1 (en) 2007-08-09

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