WO2007092803A3 - Laser-based removal of target link structures - Google Patents

Laser-based removal of target link structures Download PDF

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Publication number
WO2007092803A3
WO2007092803A3 PCT/US2007/061592 US2007061592W WO2007092803A3 WO 2007092803 A3 WO2007092803 A3 WO 2007092803A3 US 2007061592 W US2007061592 W US 2007061592W WO 2007092803 A3 WO2007092803 A3 WO 2007092803A3
Authority
WO
WIPO (PCT)
Prior art keywords
target link
laser output
link structure
laser
substrate
Prior art date
Application number
PCT/US2007/061592
Other languages
French (fr)
Other versions
WO2007092803A2 (en
Inventor
Bo Gu
Donald V Smart
James J Cordingley
Joohan Lee
Donald J Svetkoff
Shepard D Johnson
Jonathan S Ehrmann
Original Assignee
Gsi Group Corp
Bo Gu
Donald V Smart
James J Cordingley
Joohan Lee
Donald J Svetkoff
Shepard D Johnson
Jonathan S Ehrmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gsi Group Corp, Bo Gu, Donald V Smart, James J Cordingley, Joohan Lee, Donald J Svetkoff, Shepard D Johnson, Jonathan S Ehrmann filed Critical Gsi Group Corp
Priority to JP2008553540A priority Critical patent/JP2009526383A/en
Priority to KR1020087021624A priority patent/KR101370156B1/en
Publication of WO2007092803A2 publication Critical patent/WO2007092803A2/en
Publication of WO2007092803A3 publication Critical patent/WO2007092803A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

Laser-based methods and systems for removing one or more target link structures 107 of a circuit fabricated on a substrate 110 includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output ontothe target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
PCT/US2007/061592 2006-02-03 2007-02-05 Laser-based removal of target link structures WO2007092803A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008553540A JP2009526383A (en) 2006-02-03 2007-02-05 Laser-based method and system for removing one or more target link structures
KR1020087021624A KR101370156B1 (en) 2006-02-03 2007-02-05 Laser-based method and system for removing one or more target link structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76540106P 2006-02-03 2006-02-03
US60/765,401 2006-02-03

Publications (2)

Publication Number Publication Date
WO2007092803A2 WO2007092803A2 (en) 2007-08-16
WO2007092803A3 true WO2007092803A3 (en) 2008-09-18

Family

ID=38345903

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/061592 WO2007092803A2 (en) 2006-02-03 2007-02-05 Laser-based removal of target link structures

Country Status (5)

Country Link
JP (1) JP2009526383A (en)
KR (1) KR101370156B1 (en)
CN (1) CN101410219A (en)
TW (1) TWI379724B (en)
WO (1) WO2007092803A2 (en)

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US10307862B2 (en) 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
JP5552373B2 (en) 2010-06-02 2014-07-16 浜松ホトニクス株式会社 Laser processing method
DE102010025966B4 (en) * 2010-07-02 2012-03-08 Schott Ag Interposer and method for making holes in an interposer
TWI454006B (en) * 2011-11-18 2014-09-21 Ind Tech Res Inst Apparatus for controlling laser
US9724235B2 (en) 2013-02-27 2017-08-08 Novartis Ag Laser apparatus and method for laser processing a target material
KR101483759B1 (en) * 2013-07-19 2015-01-19 에이피시스템 주식회사 Apparatus for processing fragile substrate using multi lasers and method thereof
CN106330329B (en) * 2016-08-22 2018-07-03 浙江大学 Based on the wireless light communication devices and methods therefor for directly modulating DPSSL
JP6781649B2 (en) * 2017-03-13 2020-11-04 株式会社ディスコ Laser processing equipment
JP2018043034A (en) * 2017-11-27 2018-03-22 ノバルティス アーゲー Laser apparatus and method for processing target material by laser
US10352995B1 (en) 2018-02-28 2019-07-16 Nxp Usa, Inc. System and method of multiplexing laser triggers and optically selecting multiplexed laser pulses for laser assisted device alteration testing of semiconductor device
US10782343B2 (en) 2018-04-17 2020-09-22 Nxp Usa, Inc. Digital tests with radiation induced upsets
US20200316722A1 (en) * 2019-04-02 2020-10-08 Asm Technology Singapore Pte Ltd Optimised laser cutting
RU2736126C1 (en) * 2020-02-10 2020-11-11 Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) Method of three-stage laser facing
KR102363962B1 (en) * 2020-04-21 2022-02-17 국방과학연구소 System, method, computer-readable storage medium and computer program for photon-based target detection

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914663A (en) * 1988-04-22 1990-04-03 The Board Of Trustees Of Leland Stanford, Jr. University Generation of short high peak power pulses from an injection mode-locked Q-switched laser oscillator
US5745284A (en) * 1996-02-23 1998-04-28 President And Fellows Of Harvard College Solid-state laser source of tunable narrow-bandwidth ultraviolet radiation
US20020162973A1 (en) * 2001-03-29 2002-11-07 Cordingley James J. Methods and systems for processing a device, methods and systems for modeling same and the device
US20040243112A1 (en) * 2003-06-02 2004-12-02 Mark Bendett Apparatus and method for ophthalmologic surgical procedures using a femtosecond fiber laser
US20050041702A1 (en) * 1997-03-21 2005-02-24 Imra America, Inc. High energy optical fiber amplifier for picosecond-nanosecond pulses for advanced material processing applications
US20050215985A1 (en) * 2003-08-11 2005-09-29 Michael Mielke Method of generating an ultra-short pulse using a high-frequency ring oscillator

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040134894A1 (en) 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US20020016758A1 (en) 2000-06-28 2002-02-07 Grigsby Calvin B. Method and apparatus for offering, pricing, and selling securities over a network

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914663A (en) * 1988-04-22 1990-04-03 The Board Of Trustees Of Leland Stanford, Jr. University Generation of short high peak power pulses from an injection mode-locked Q-switched laser oscillator
US5745284A (en) * 1996-02-23 1998-04-28 President And Fellows Of Harvard College Solid-state laser source of tunable narrow-bandwidth ultraviolet radiation
US20050041702A1 (en) * 1997-03-21 2005-02-24 Imra America, Inc. High energy optical fiber amplifier for picosecond-nanosecond pulses for advanced material processing applications
US20020162973A1 (en) * 2001-03-29 2002-11-07 Cordingley James J. Methods and systems for processing a device, methods and systems for modeling same and the device
US20020167581A1 (en) * 2001-03-29 2002-11-14 Cordingley James J. Methods and systems for thermal-based laser processing a multi-material device
US20040243112A1 (en) * 2003-06-02 2004-12-02 Mark Bendett Apparatus and method for ophthalmologic surgical procedures using a femtosecond fiber laser
US20050215985A1 (en) * 2003-08-11 2005-09-29 Michael Mielke Method of generating an ultra-short pulse using a high-frequency ring oscillator

Also Published As

Publication number Publication date
CN101410219A (en) 2009-04-15
KR20090061607A (en) 2009-06-16
TW200735992A (en) 2007-10-01
TWI379724B (en) 2012-12-21
WO2007092803A2 (en) 2007-08-16
KR101370156B1 (en) 2014-03-06
JP2009526383A (en) 2009-07-16

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