WO2007106642A3 - Method for forming embedded capacitors on a printed circuit board, and resultant printed circuit board - Google Patents

Method for forming embedded capacitors on a printed circuit board, and resultant printed circuit board Download PDF

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Publication number
WO2007106642A3
WO2007106642A3 PCT/US2007/062376 US2007062376W WO2007106642A3 WO 2007106642 A3 WO2007106642 A3 WO 2007106642A3 US 2007062376 W US2007062376 W US 2007062376W WO 2007106642 A3 WO2007106642 A3 WO 2007106642A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
dielectric layer
embedded capacitors
forming embedded
Prior art date
Application number
PCT/US2007/062376
Other languages
French (fr)
Other versions
WO2007106642A2 (en
Inventor
Jovica Savic
Remy J Chelini
Gregory J Dunn
Original Assignee
Motorola Inc
Jovica Savic
Remy J Chelini
Gregory J Dunn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc, Jovica Savic, Remy J Chelini, Gregory J Dunn filed Critical Motorola Inc
Publication of WO2007106642A2 publication Critical patent/WO2007106642A2/en
Publication of WO2007106642A3 publication Critical patent/WO2007106642A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Abstract

A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more electrodes situated on the PCB. Another electrode is formed on top of the first dielectric layer and a second dielectric layer is deposited on top of that electrode. A third electrode is formed on top of the second dielectric layer. The two dielectric layers are abrasively delineated in a single step by a method such as sand blasting to define portions of the first and second dielectric layers to create a multilayer capacitive structure.
PCT/US2007/062376 2006-03-10 2007-02-19 Method for forming embedded capacitors on a printed circuit board, and resultant printed circuit board WO2007106642A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/276,688 US7444727B2 (en) 2006-03-10 2006-03-10 Method for forming multi-layer embedded capacitors on a printed circuit board
US11/276,688 2006-03-10

Publications (2)

Publication Number Publication Date
WO2007106642A2 WO2007106642A2 (en) 2007-09-20
WO2007106642A3 true WO2007106642A3 (en) 2007-11-29

Family

ID=38477452

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/062376 WO2007106642A2 (en) 2006-03-10 2007-02-19 Method for forming embedded capacitors on a printed circuit board, and resultant printed circuit board

Country Status (2)

Country Link
US (1) US7444727B2 (en)
WO (1) WO2007106642A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101019476A (en) * 2004-08-11 2007-08-15 三井金属矿业株式会社 Method for producing dielectric layer-constituting material, dielectric layer-constituting material produced by such method, method for manufacturing capacitor circuit-forming member using such dielec
DE102005047106B4 (en) * 2005-09-30 2009-07-23 Infineon Technologies Ag Power semiconductor module and method of manufacture
US7444727B2 (en) * 2006-03-10 2008-11-04 Motorola, Inc. Method for forming multi-layer embedded capacitors on a printed circuit board
US20080037198A1 (en) * 2006-08-10 2008-02-14 Borland William J Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packages
SG154342A1 (en) * 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
US8756778B2 (en) * 2009-10-01 2014-06-24 Stmicroelectronics Sa Method of adjustment during manufacture of a circuit having a capacitor
CN102196668B (en) * 2010-03-08 2013-06-19 宏恒胜电子科技（淮安）有限公司 Method for manufacturing circuit board
US20140174812A1 (en) * 2012-12-21 2014-06-26 Raul Enriquez Shibayama Method and Apparatus for Far End Crosstalk Reduction in Single Ended Signaling
US9041148B2 (en) * 2013-06-13 2015-05-26 Qualcomm Incorporated Metal-insulator-metal capacitor structures
US20160055976A1 (en) * 2014-08-25 2016-02-25 Qualcomm Incorporated Package substrates including embedded capacitors
EP3245664B1 (en) * 2015-01-13 2021-07-21 Director General, Centre For Materials For Electronics Technology A non-conductive substrate with tracks formed by sand blasting
US9859358B2 (en) * 2015-05-26 2018-01-02 Altera Corporation On-die capacitor (ODC) structure
US9881738B2 (en) * 2015-08-05 2018-01-30 Globalfoundries Inc. Capacitor structures with embedded electrodes and fabrication methods thereof
US10141908B2 (en) * 2016-08-18 2018-11-27 Qualcomm Incorporated Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
US11515247B2 (en) * 2021-01-14 2022-11-29 Qualcomm Incorporated Capacitance fine tuning by fin capacitor design

Citations (2)

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US20020011351A1 (en) * 2000-06-14 2002-01-31 Kouki Ogawa Printed-wiring substrate and method for fabricating the same
US20060002097A1 (en) * 2004-07-01 2006-01-05 Borland William J Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

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US4232059A (en) * 1979-06-06 1980-11-04 E-Systems, Inc. Process of defining film patterns on microelectronic substrates by air abrading
US5370766A (en) * 1993-08-16 1994-12-06 California Micro Devices Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
US6005197A (en) * 1997-08-25 1999-12-21 Lucent Technologies Inc. Embedded thin film passive components
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
US6349456B1 (en) * 1998-12-31 2002-02-26 Motorola, Inc. Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
US6565730B2 (en) * 1999-12-29 2003-05-20 Intel Corporation Self-aligned coaxial via capacitors
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
US6370012B1 (en) * 2000-08-30 2002-04-09 International Business Machines Corporation Capacitor laminate for use in printed circuit board and as an interconnector
TWI226101B (en) * 2003-06-19 2005-01-01 Advanced Semiconductor Eng Build-up manufacturing process of IC substrate with embedded parallel capacitor
US7012022B2 (en) * 2003-10-30 2006-03-14 Chartered Semiconductor Manufacturing Ltd. Self-patterning of photo-active dielectric materials for interconnect isolation
US7056800B2 (en) * 2003-12-15 2006-06-06 Motorola, Inc. Printed circuit embedded capacitors
US7193838B2 (en) * 2003-12-23 2007-03-20 Motorola, Inc. Printed circuit dielectric foil and embedded capacitors
US7444727B2 (en) * 2006-03-10 2008-11-04 Motorola, Inc. Method for forming multi-layer embedded capacitors on a printed circuit board

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20020011351A1 (en) * 2000-06-14 2002-01-31 Kouki Ogawa Printed-wiring substrate and method for fabricating the same
US20060002097A1 (en) * 2004-07-01 2006-01-05 Borland William J Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

Also Published As

Publication number Publication date
WO2007106642A2 (en) 2007-09-20
US7444727B2 (en) 2008-11-04
US20070209178A1 (en) 2007-09-13

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