WO2007108110A1 - 通電試験用プローブおよびプローブ組立体 - Google Patents
通電試験用プローブおよびプローブ組立体 Download PDFInfo
- Publication number
- WO2007108110A1 WO2007108110A1 PCT/JP2006/305631 JP2006305631W WO2007108110A1 WO 2007108110 A1 WO2007108110 A1 WO 2007108110A1 JP 2006305631 W JP2006305631 W JP 2006305631W WO 2007108110 A1 WO2007108110 A1 WO 2007108110A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- tip
- needle tip
- mark
- alignment mark
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Definitions
- the present invention relates to a probe and a probe assembly suitable for use in an energization test of a semiconductor device such as a semiconductor integrated circuit.
- a plug assembly generally called a probe card is used.
- This probe assembly is assembled to a tester for an electric current test, and a large number of probes (contacts) provided in the probe assembly are pressed against the corresponding electrodes of the object to be inspected on the stage.
- the test object is connected to the tester through this probe assembly, and is subjected to an energization test.
- the probe tip of this probe is subject to wear due to contact with each electrode of the object to be inspected, and is also susceptible to contamination due to adhesion of electrode shavings. Therefore, using the needle tip as an alignment mark makes it difficult to obtain accurate needle tip coordinates, and makes it difficult to accurately position the probe assembly.
- the probe tip of such a probe is arranged close to several tens of ⁇ , and the probe board is positioned by the positioning pin, but the image area captured by each area sensor is defined.
- an object of the present invention is to provide an energization test probe provided with a mark that can determine the mounting posture relatively easily.
- Another object of the present invention is to determine which of the alignment marks to be used is conventionally used even when the alignment marks of a plurality of adjacent probes are observed at the same time. It is an object of the present invention to provide a probe assembly including a current test probe provided with an alignment mark that can be easily determined as compared with the above. Means for solving the problem
- the probe for current test is a surface parallel to the surface on which the needle tip is provided and oriented in the same direction as the surface on which the needle tip is provided at a height position recessed from the needle tip.
- the direction in which the needle tip exists can be easily known from the information of the alignment mark.
- the plurality of probes in advance alternately reverse their placement postures so that, for example, the positional relationship between the alignment marks of adjacent probes and their needle tips are alternately reversed.
- the direction in which the needle tip of each probe is observed Information is compared with information about the direction in which the tip of the predetermined probe is provided in advance. Based on the comparison, it is possible to easily determine which of the observed alignment marks is the alignment mark for the predetermined probe to be used for alignment. it can.
- the probe alignment mark can be used for alignment of individual probes when arranging each probe.
- the probe can be provided with a seat portion that has a mounting surface to the support substrate and rises from the mounting surface, an arm portion that extends laterally from the top of the seat portion, and a tip portion that is continuous with the arm portion. .
- the tip portion projects from the arm portion to the side opposite to the side where the mounting surface of the seat portion is located.
- the needle tip is provided at the tip.
- the alignment mark is provided on the tip portion or the arm portion. Accordingly, the present invention can be applied without causing a substantial change in the configuration of the conventional system that performs alignment by observing the conventional needle tip.
- the alignment mark may be composed of two mark portions formed at a distance from each other in the longitudinal direction of the arm portion.
- the two mark portions have different width dimensions along the longitudinal direction of the arm. In this case, the direction in which the needle tip exists can be easily known by comparing the width dimensions of both mark portions.
- Both the mark portions can be formed by forming a concave groove across the shelf surface on a flat shelf surface formed at a position recessed from the end surface of the tip portion provided with the needle tip.
- the alignment mark including the position information of the needle tip can be formed relatively easily without being subjected to wear or contamination like the needle tip.
- the alignment mark is formed at a distance from each other in the width direction of the arm part, and a pair of extension parts extending in the longitudinal direction of the arm, It can be formed into a U-shape composed of connecting portions that connect opposite ends.
- the U-shaped alignment mark is formed on a flat rectangular shelf surface formed at a position recessed from the end surface of the tip portion where the needle tip is provided, and from the center portion of the shelf surface to the key. It can be formed by forming a recess that reaches the edge in the longitudinal direction of the groove part and opens to the edge.
- the probe according to the present invention can be applied to a probe assembly provided with the probe.
- a probe assembly includes a support substrate and a plurality of probes arranged on the support substrate.
- Each probe is provided with a needle tip and an alignment mark having a predetermined positional relationship with the needle tip, and the alignment mark is parallel to the surface on which the needle tip is provided. It is formed on the surface of the probe which is present and is in the same direction as the surface at a position recessed from the surface.
- the probes are arranged such that the needle tip positions are aligned on a virtual straight line on the support substrate, and the positions of the respective alignment marks are alternately positioned on the left and right sides along the virtual line.
- the posture is alternately reversed and supported by the support substrate, and the alignment mark displays information indicating an existing direction of the needle tip when the alignment mark is observed from the protruding direction of the needle tip. Including.
- the probe assembly of the present invention as in the probe, information on the direction in which the tip of the needle is present from the plurality of alignment marks observed, and a predetermined position to be used for the predetermined alignment.
- information on the direction of presence of the probe needle tip it is possible to easily determine whether the misalignment alignment mark should be used for alignment.
- the probe of the present invention since the information for the position of the probe tip of the probe is included in the alignment mark, the needle tip obtained from the alignment mark is used.
- the position information is used by the probe for alignment. It is possible to easily determine whether the probe is a target probe or not.
- FIG. 1 is a front view showing a probe according to the present invention.
- FIG. 2 is an enlarged perspective view showing a part of the probe shown in FIG.
- FIG. 3 is a bottom view showing a three-dimensional probe according to the present invention.
- FIG. 4 is a side view showing a probe la solid according to the present invention.
- FIG. 5 is an enlarged perspective view showing a part of the probe assembly according to the present invention.
- FIG. 6 is an explanatory diagram for explaining the procedure for determining the probe tip position of the probe by the alignment mark provided on the probe of the assembly according to the present invention.
- (A) is a CCD camera.
- FIG. 2 is an explanatory diagram schematically showing the relationship between the probe and the alignment mark of the probe, and (b) is a diagram illustrating a part of a photographed image obtained by the CCD camera.
- FIG. 7 is a drawing similar to FIG. 2 showing another embodiment of the present invention.
- a probe 10 is a support substrate. Fixed to each connection land portion 14 a of the wiring 14 corresponding to each of the large number of wirings 14 formed on the lobe substrate 12.
- the probe 10 includes a plate-like probe body 16 as a whole.
- the probe main body 16 includes a flat rectangular end surface 16 a serving as a mounting surface to each connection land portion 14 a of the probe board 12 and a plate-shaped seat portion 18 rising from the end surface at an angle.
- an arm portion 20 extending at an obtuse angle 0 in a direction substantially parallel to the longitudinal direction of the end face 16 a from the front end of the seat portion 18 on a plane including the seat portion.
- a tip portion 2 2 that rises away from the end surface 16 a of the seat portion 18 is formed, and the needle tip 24 is formed on the end surface 2 2 a.
- the probe body 16 except the needle tip 24 is made of a metal material having high toughness such as nickel, its alloy, or phosphor bronze.
- a long hole 26 is formed that penetrates in the plate thickness direction of the arm portion and extends along the longitudinal direction of the arm portion 20.
- the needle tip 24 can be formed integrally with the probe body using the same metal material as the probe body 16. However, in order to improve durability, as shown in the figure, the pyramid-shaped needle tip 24 is formed of a hard metal material such as conoret, rhodium or an alloy thereof, and this needle tip 24 is formed in the arm portion. It is preferably embedded in the end face of the front end part 22 connected to 20.
- the side surface 20 0 a located on the opposite side of the mounting surface 16 6 a of the arm portion 20 to the probe board 12 is continuous with the inclined surface 2 2 b of the distal end portion 2 2.
- a step portion 30 that defines a flat shelf surface 28 is formed in the vicinity of the arm portion 20 of the inclined surface 2 2 b.
- the shelf surface 28 is formed into two rectangular portions 2 8 a and 2 8 b by a concave groove 3 2 extending in the plate thickness direction of the probe body 1 6. It is partitioned.
- the concave groove 32 is a V-shaped groove, but a desired cross-sectional shape can be given to the concave groove.
- Both rectangular portions 2 8 a and 2 8 b each have a rectangular planar shape whose longitudinal direction is the plate thickness direction of the probe body 16, and in the illustrated example, one rectangular portion located on the needle tip 2 4 side.
- the width dimension W 1 of the portion 2 8 a is set larger than the width dimension W 2 of the other rectangular portion 2 8 b.
- the difference between the width dimensions W 1 and W 2 can be easily and instantaneously determined by image processing using a camera image (to be described later). It is desirable to set to an extent to obtain.
- the shelf surface 28 has a predetermined positional relationship with the needle tip 24 so that the coordinate position of the needle tip 24 can be known by knowing the coordinate position of the center point of the shelf surface, for example. Is formed.
- the shelf surface 28 can be used as an alignment mark for the probe 10 itself or as an alignment mark for a probe assembly as described later.
- the flat shelf surface 28 is provided in the vicinity of the arm 20 on the inclined surface 2 2 b of the tip 22, the end surface 2 2 of the tip 22 on which the needle tip 24 is provided. It is formed at a position recessed by a distance D from a.
- the shelf surface 28 used as a positioning mark is at a height position recessed from the tip surface of the needle tip 24, contamination due to contact with the object to be inspected can be prevented.
- a sufficient height position D is separated from the end surface 22a as shown in the figure.
- the probe body 16 described above can be formed as follows, for example. First, a concave pattern imitating the planar shape of the probe main body 16 as shown in FIG. 1 is formed on the base by a photo resist using a photolithography technique used in the semiconductor manufacturing process. Next, a metal material for the probe main body 16 is sequentially deposited in the thickness direction by a method such as elect port forming or sputtering or the like in the concave portion imitated by the resist pattern. Thereafter, the resist pattern is removed, and the probe body 16 is removed from the base.
- the probe main body 16 having both the rectangular portions 2 8 a and 2 8 b described above, it is possible to use the above-described deposition method in the thickness direction of the probe main body 1 with a single resist pattern. 6 is desirable in that it can be formed.
- FIGS. 3 and 4 show a probe assembly 40 in which the probe 10 according to the present invention is used.
- the probe assembly 40 is applied to a continuity test of a semiconductor integrated circuit such as a large number of semiconductor chips arranged in a matrix on a semiconductor wafer (not shown).
- the probe assembly 40 includes a circular wiring board 42 and a rectangular probe board 12 arranged on the lower surface of the wiring board.
- ⁇ S-line board 42 A number of tester lands 4 2 a connected to the motor are formed.
- the probe substrate 12 includes an electrical insulating plate such as ceramic, and a large number of wirings 14 are formed on the lower surface of the insulating plate.
- Each wiring 14 is electrically connected to each corresponding tester land 4 2 a (see Fig. 3). Further, the probe 10 is fixed to the connection land portion 14 a formed in each wiring 14 using, for example, solder.
- the needle tips 24 are arranged so as to be alternately inserted on the straight lines L1 to Ln from both sides of each.
- the probes 10 arranged with the needle tips 24 aligned on the straight lines L1 to Ln are aligned with the adjacent probes 10 on the straight lines L1 to Ln.
- the arrangement posture is alternately reversed so that the positional relationship between the flat shelf surface 28 used as a mark and the needle tip 24 is alternately reversed.
- the probe assembly 40 is used for an energization test of each chip region formed on a semiconductor wafer.
- a semiconductor wafer as an object to be inspected is positioned on a well-known stage (xyz ⁇ stage) (not shown) with the electrodes of each chip region formed thereon facing upward.
- the probe assembly 40 is arranged on the tester above the stage so that the tip 24 of each probe 10 faces the electrode of each tip region.
- the probe assembly is However, in order to ensure that the probe tips 4 of each probe 10 of the probe assembly 40 are in proper contact with the corresponding electrodes, it is then shown in Fig. 6 (a).
- three CCD cameras 44 mounted in a distributed manner on the stage, and three predetermined probes 10 corresponding to the CCD cameras 44, respectively.
- the shelf surface 2 8 is shot as an alignment mark. It is.
- the captured image is subjected to data processing by a well-known image processing method.
- data processing as shown in FIG. 6 (b), for example, the center position coordinates (x 1, y 1) of the flat shelf surface 28 obtained from each captured image 46 are obtained, and each center position coordinate is obtained.
- the coordinates (x, y) of the probe tips 24 of the three predetermined probes 10 are determined.
- the stage is finely adjusted so that the coordinates obtained by actual measurement of these three force points and the predetermined three coordinates coincide with each other.
- the probe assembly solid 40 is lowered toward the semiconductor wafer.
- the probe assembly 40 Prior to this lowering, the probe assembly 40 is aligned by the fine adjustment described above, so that the needle tips 24 of all the probes 10 can be brought into contact with the corresponding electrodes. . Therefore, an appropriate energization test for each chip region of the semiconductor wafer becomes possible.
- the center position coordinates (X1, y1) of the flat shelf surface 28 of each probe 10 described above are used to obtain the coordinate position of the needle tip 24 of each corresponding probe 10 or to confirm it. Can be used.
- the probes 10 arranged on the probe substrate 12 are aligned with the alignment marks 2 of the adjacent probes 10 on the straight lines L 1 to Ln.
- the arrangement posture is alternately reversed so that the positional relationship between 8 and the needle tip 24 is alternately reversed. Therefore, even when the marks 28 of both probes 10 adjacent to each other in one captured image ⁇ are captured, the posture of the predetermined probe 10 used for alignment, that is, the above-described needle tip direction
- the posture of each of the probes 10 in the captured image is determined from the arrangement of the rectangular portions 2 8 a and 2 8 b of both detection marks 28 in the captured image, In other words, the posture is determined, and then the determined posture of each probe 10 is used for alignment.
- the posture of the probe 10 to be used is compared, and from this comparison result, it is possible to quickly determine which mark 28 information should be adopted as positioning information.
- the proper mark 28 can be identified by a relatively simple determination method based on the binary determination of the attitude of the probe 10 without requiring a complicated program processing as in the past. it can.
- a recess 48 can be formed which reaches the edge in the longitudinal direction and opens to the edge.
- a U-shaped mark composed of 2 8 d and the shelf surface 28 can be formed.
- the example shown in 7 shows the case where the probe body 16 is formed by sequentially depositing metal materials in the height direction of the probe body 16 from the mounting surface 16 a to the end surface 2 2 a. This is advantageous in terms of forming a photoresist pattern.
- the present invention has been described along the example in which the shelf surface 28 is formed on the tip portion 22.
- the arm portion 20 of the probe 10 or the like is not limited to this.
- the mark surface as described above can be formed in a portion where the predetermined positional relationship can be maintained.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/305631 WO2007108110A1 (ja) | 2006-03-15 | 2006-03-15 | 通電試験用プローブおよびプローブ組立体 |
US12/160,199 US7602200B2 (en) | 2006-03-15 | 2006-03-15 | Probe for electrical test comprising a positioning mark and probe assembly |
JP2008506117A JP4841620B2 (ja) | 2006-03-15 | 2006-03-15 | 通電試験用プローブおよびプローブ組立体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/305631 WO2007108110A1 (ja) | 2006-03-15 | 2006-03-15 | 通電試験用プローブおよびプローブ組立体 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007108110A1 true WO2007108110A1 (ja) | 2007-09-27 |
Family
ID=38522150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/305631 WO2007108110A1 (ja) | 2006-03-15 | 2006-03-15 | 通電試験用プローブおよびプローブ組立体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7602200B2 (ja) |
JP (1) | JP4841620B2 (ja) |
WO (1) | WO2007108110A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7960988B2 (en) | 2007-12-21 | 2011-06-14 | Kabushiki Kaisha Nihon Micronics | Contactor for electrical test, electrical connecting apparatus using the same, and method for manufacturing contactor |
JP2011117758A (ja) * | 2009-12-01 | 2011-06-16 | Micronics Japan Co Ltd | 電気的試験用プローブ及びこれを用いた電気的接続装置 |
JP2019505791A (ja) * | 2016-01-15 | 2019-02-28 | カスケード マイクロテック インコーポレイテッドCascade Microtech,Incorporated | 基準マーク付きプローブ、該プローブを含むプローブシステム、及び関連する方法 |
WO2022259454A1 (ja) * | 2021-06-10 | 2022-12-15 | 日本電子材料株式会社 | プローブカード |
WO2023181754A1 (ja) * | 2022-03-23 | 2023-09-28 | 株式会社日本マイクロニクス | プローブ、プローブ保持装置およびプローブの製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101688886A (zh) * | 2007-07-24 | 2010-03-31 | 株式会社爱德万测试 | 接触器、探针卡及接触器的安装方法 |
JP5530191B2 (ja) * | 2010-01-15 | 2014-06-25 | 株式会社日本マイクロニクス | 電気的試験用プローブ及びその製造方法、並びに電気的接続装置及びその製造方法 |
TWI534432B (zh) * | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | 用於微電路測試器之電氣傳導針腳 |
JP7353859B2 (ja) * | 2019-08-09 | 2023-10-02 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
CN113376413B (zh) * | 2020-03-10 | 2023-12-19 | 台湾中华精测科技股份有限公司 | 垂直式探针头及其双臂式探针 |
TWI792995B (zh) * | 2022-04-29 | 2023-02-11 | 中華精測科技股份有限公司 | 懸臂式探針卡裝置及其對焦型探針 |
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JPH0566510U (ja) * | 1992-02-14 | 1993-09-03 | 株式会社三協精機製作所 | ワーク位置検出装置 |
JP2004340654A (ja) * | 2003-05-14 | 2004-12-02 | Micronics Japan Co Ltd | 通電試験用プローブ |
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US5177438A (en) * | 1991-08-02 | 1993-01-05 | Motorola, Inc. | Low resistance probe for semiconductor |
US6255126B1 (en) * | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
KR100500469B1 (ko) * | 2001-01-12 | 2005-07-12 | 삼성전자주식회사 | 정렬마크와 이를 이용하는 노광정렬시스템 및 그 정렬방법 |
US6933738B2 (en) * | 2001-07-16 | 2005-08-23 | Formfactor, Inc. | Fiducial alignment marks on microelectronic spring contacts |
JP2005533263A (ja) | 2002-07-15 | 2005-11-04 | フォームファクター,インコーポレイテッド | 超小型電子ばね接触子の基準位置合わせ目標 |
JP4421481B2 (ja) * | 2003-05-13 | 2010-02-24 | 株式会社日本マイクロニクス | 通電試験用プローブ |
JP3967701B2 (ja) * | 2003-09-10 | 2007-08-29 | 沖電気工業株式会社 | 半導体装置 |
CN101006347A (zh) * | 2004-08-26 | 2007-07-25 | Sv探针私人有限公司 | 叠层针尖悬臂式电连接器 |
US7355422B2 (en) * | 2005-09-17 | 2008-04-08 | Touchdown Technologies, Inc. | Optically enhanced probe alignment |
JP2008203036A (ja) * | 2007-02-19 | 2008-09-04 | Micronics Japan Co Ltd | 電気的接続装置 |
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2006
- 2006-03-15 US US12/160,199 patent/US7602200B2/en active Active
- 2006-03-15 WO PCT/JP2006/305631 patent/WO2007108110A1/ja active Application Filing
- 2006-03-15 JP JP2008506117A patent/JP4841620B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0566510U (ja) * | 1992-02-14 | 1993-09-03 | 株式会社三協精機製作所 | ワーク位置検出装置 |
JP2004340654A (ja) * | 2003-05-14 | 2004-12-02 | Micronics Japan Co Ltd | 通電試験用プローブ |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7960988B2 (en) | 2007-12-21 | 2011-06-14 | Kabushiki Kaisha Nihon Micronics | Contactor for electrical test, electrical connecting apparatus using the same, and method for manufacturing contactor |
JP2011117758A (ja) * | 2009-12-01 | 2011-06-16 | Micronics Japan Co Ltd | 電気的試験用プローブ及びこれを用いた電気的接続装置 |
JP2019505791A (ja) * | 2016-01-15 | 2019-02-28 | カスケード マイクロテック インコーポレイテッドCascade Microtech,Incorporated | 基準マーク付きプローブ、該プローブを含むプローブシステム、及び関連する方法 |
WO2022259454A1 (ja) * | 2021-06-10 | 2022-12-15 | 日本電子材料株式会社 | プローブカード |
JP7202550B1 (ja) * | 2021-06-10 | 2023-01-12 | 日本電子材料株式会社 | プローブカード |
WO2023181754A1 (ja) * | 2022-03-23 | 2023-09-28 | 株式会社日本マイクロニクス | プローブ、プローブ保持装置およびプローブの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4841620B2 (ja) | 2011-12-21 |
US20090009201A1 (en) | 2009-01-08 |
JPWO2007108110A1 (ja) | 2009-07-30 |
US7602200B2 (en) | 2009-10-13 |
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