WO2007109483A1 - Shifted segment layout for differential signal traces to mitigate bundle weave effect - Google Patents
Shifted segment layout for differential signal traces to mitigate bundle weave effect Download PDFInfo
- Publication number
- WO2007109483A1 WO2007109483A1 PCT/US2007/064015 US2007064015W WO2007109483A1 WO 2007109483 A1 WO2007109483 A1 WO 2007109483A1 US 2007064015 W US2007064015 W US 2007064015W WO 2007109483 A1 WO2007109483 A1 WO 2007109483A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- trace
- segment
- longitudinal axis
- segments
- distance
- Prior art date
Links
- 230000000694 effects Effects 0.000 title description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000000306 component Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
Definitions
- the core component of some conventional printed circuit boards is non- homogeneous.
- the conventional FR4 material is formed of a weave of glass fiber bundles embedded in an epoxy resin.
- the non-homogeneity of the board material may have an adverse effect on signal propagation in a differential bus on the board, particularly in the case of data rates higher than about 1 Gb/s to 2 Gb/s. This adverse effect may be referred to as the "bundle weave effect".
- the bundle weave effect is a result of the difference in dielectric constant between the glass fiber material and the epoxy resin.
- the direction of a pair of traces for a differential bus may be parallel to one of the weave directions.
- one of the traces may overlie a glass fiber bundle along the length of the trace, while the other trace may overlie epoxy resin along the length of the trace (and disregarding the cross bundles in the weave).
- the difference in dielectric constant between the two materials causes the respective signals in the two traces to propagate at different propagation velocities, leading to phase skew and reduction or elimination of the signal eye width (also known as the timing window). As a result the transmitted signal may not be properly received.
- the bundle weave effect increases linearly with the length of the bus, and also increases linearly with data rate. Thus, the bundle weave effect can be expected to become of increasing concern as data rates increase.
- FIG. 1 is a schematic plan view of a differential bus trace layout according to some embodiments.
- FIG. 2 is a schematic plan view of a differential bus trace layout according to some other embodiments.
- FIG. 3 is a graph that shows estimated worst case levels of bundle weave effect for various data rates and bus lengths when conventional straight trace layouts are employed.
- FIG. 4 is a graph that shows estimated worst case levels of bundle weave effect for various data rates and bus lengths when four-segment trace layouts are employed in accordance with the embodiment of FIG. 2.
- FIG. 5 is a schematic side view of a PCB according to some embodiments.
- FIG. 6 is a schematic plan view of the PCB of FIG. 5.
- FIG. 1 is a schematic plan view of a differential bus trace layout according to some embodiments.
- the lightly shaded regions 102, 104, 106 correspond to regions on the surface of a PCB which overlie glass bundles (disregarding cross bundles in the weave structure, which are not indicated) and darkly shaded regions 108, 110, 112 correspond to regions on the surface of the PCB which overlie epoxy resin regions between the glass bundles (again disregarding cross bundles in the weave structure).
- Reference numeral 114 indicates a differential bus, formed of parallel traces 116, 118. (In accordance with conventional practices, the traces 116, 118 may be formed of copper.) The traces are shifted relative to each other, in a transverse direction, by a trace pitch distance that may be standard for a given trace geometry.
- Trace 116 includes a first segment 120 and a second segment 122 that is continuously joined (at 124) to the first segment 120 and is shifted in the transverse direction by the pitch distance relative to the first segment 120. Segments 120 and 122 are substantially equal to each other in length.
- Trace 118 includes a first segment 126 that runs alongside the segment 120 of trace 116, and a second segment 128 that runs alongside the segment 122 of trace 116.
- the segment 128 is continuously joined (at 130) to the segment 126.
- Segments 126 and 128 are substantially equal in length to each other and to segments 120, 122.
- Segment 128 is shifted relative to segment 126 in the same manner that segment 122 is shifted relative to segment 120, so that segment 128 of trace 118 is aligned with segment 120 of trace 116.
- the propagation velocity of the signal in segment 128 of trace 118 is substantially equal to the propagation velocity of the signal in segment 120 of trace 116.
- the illustrative example shown in FIG. 1 assumes, as is typically the case in PCB fabrication, that the weave directions are parallel to the edges of the board and the trace directions are also parallel to the edges of the board. It will be appreciated that the shape of the board is typically rectangular.
- the pitch between glass bundles may, but need not, be twice the trace pitch distance as illustrated in FIG. 1.
- each trace may have four segments, as shown in the embodiment shown in FIG. 2.
- FIG. 2 is a schematic plan view of a differential bus trace layout.
- the lightly shaded regions 202, 204, 206, 208, 210, 212 correspond to regions on the surface of a PCB which overlie glass bundles (disregarding cross bundles in the weave structure, which are not indicated).
- Darkly shaded regions 214, 216, 218, 220, 222, 224 correspond to regions on the surface of the PCB which overlie epoxy resin regions between the glass bundles (again disregarding cross bundles in the weave structure).
- Reference numeral 226 indicates a differential bus, formed of parallel traces 228, 230 which constitute a pair of traces.
- the traces 228, 230 may be formed of copper, for example. Although the traces are indicated as being on the surface of the PCB, in alternative embodiments the traces may be part of a metallization layer inside the PCB. Thus the traces may be on or in the PCB.
- Trace 228 includes a first segment 232 and a second segment 234 which is continuously joined (at 236) to the first segment 232. Trace 228 further includes a third segment 238 continuously joined (at 240) to segment 234, and a fourth segment 242 continuously joined (at 244) to segment 238.
- Trace 230 includes a first segment 246 that runs alongside segment 232 of trace 228. Trace 230 also includes a second segment 248 that runs alongside segment 234 of trace 228. Segment 248 of trace 230 is continuously joined (at 250) to segment 246 of trace 230. Trace 230 further includes a third segment 252 that runs alongside segment 238 of trace 228. Segment 252 of trace 230 is continuously joined (at 254) to segment 248 of trace 230. In addition, trace 230 includes a fourth segment 256 that runs alongside segment 242 of trace 228. Segment 256 of trace 230 is continuously joined (at 258) to segment 252 of trace 230.
- Segment 232 of trace 228 and segment 248 of trace 230 both coincide with a longitudinal axis 260 and consequently experience essentially the same underlying local board composition.
- Segment 246 coincides with a longitudinal axis 262 that is parallel to longitudinal axis 260. Longitudinal axis 262 is shifted from longitudinal axis 260 by the trace pitch distance and in the direction indicated by arrow mark 264. The direction indicated by arrow mark 264 is perpendicular to longitudinal axis 260.
- Segment 234 of trace 228 and segment 252 of trace 230 both coincide with a longitudinal axis 266 and consequently experience essentially the same underlying local board composition.
- Longitudinal axis 266 is parallel to longitudinal axis 260 and is shifted from longitudinal axis 260 by the trace pitch distance and in the opposite direction from the direction indicated by arrow mark 264.
- Segment 238 of trace 228 and segment 256 of trace 230 both coincide with a longitudinal axis 268 and consequently experience essentially the same underlying local board composition.
- Longitudinal axis 268 is parallel to longitudinal axis 266 and is shifted from longitudinal axis 266 by the trace pitch distance and in the opposite direction from the direction indicated by arrow mark 264.
- Segment 242 of trace 228 coincides with a longitudinal axis 270 that is parallel to longitudinal axis 268.
- Longitudinal axis 270 is shifted from longitudinal axis 268 by the trace pitch distance and in the opposite direction from the direction indicated by arrow mark 264.
- AU of the segments 232, 234, 238, 242, 246, 248, 252 and 256 may be substantially parallel to each other and to one of the directions of the bundle weave structure.
- AU of the segments 232, 234, 238, 242, 246, 248, 252 and 256 may be substantially equal to each other in length.
- AU of the longitudinal axes 260, 262, 266, 268 and 270 may be parallel to an edge (not shown) of the PCB and all of the segments 232, 234, 238, 242, 248, 252 and 256 may be parallel to all of the longitudinal axes 260, 262, 266, 268 and 270 and to the edge of the PCB.
- both weave directions of the bundle weave structure may be parallel to edges of the PCB.
- the PCB may be rectangular, in accordance with conventional practices.
- segment 232 of trace 228 is shifted from the segment 246 of trace 230 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264.
- Both of the directions referred to in the previous sentence may be considered transverse directions relative to the longitudinal axes of the segments.
- Segment 234 of trace 228 is shifted from segment 232 of trace 228 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264.
- Segment 234 is also shifted from segment 232 in the longitudinal direction of the segments by a distance slightly greater than the length of each segment.
- Segment 248 of trace 230 is shifted from segment 246 of trace 230 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264.
- Segment 248 is also shifted from segment 246 in the longitudinal direction of the segments by a distance slightly greater than the length of each segment.
- Segment 238 of trace 228 is shifted from segment 234 of trace 228 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264.
- Segment 238 is also shifted from segment 234 in the longitudinal direction of the segments by a distance slightly greater than the length of each segment.
- Segment 252 of trace 230 is shifted from segment 232 of trace 228 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264.
- Segment 252 is also shifted from segment 248 of trace 230 in the longitudinal direction of the segments by a distance slightly greater than the length of each segment.
- Segment 242 of trace 228 is shifted from segment 238 of trace 228 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264. Segment 242 is also shifted from segment 238 in the longitudinal direction of the segments by a distance slightly greater than the length of each segment.
- Segment 256 of trace 230 is shifted from segment 234 of trace 228 by the trace pitch distance in the direction opposite to the direction indicated by arrow mark 264. Segment 256 is also shifted from segment 252 of trace 230 in the longitudinal direction of the segments by a distance slightly greater than the length of each segment.
- segment 248 of trace 230 is aligned with segment 232 of trace 228 so that the two segments are effectively paired with each other in terms of the underlying board composition experienced by the two segments.
- segment 252 of trace 230 is aligned with segment 234 of trace 228 so that the two segments are effectively paired with each other in terms of the underlying board composition experienced by the two segments.
- segment 256 of trace 230 is aligned with segment 238 of trace 228 so that the two segments are effectively paired with each other in terms of the underlying board composition experienced by the two segments.
- the trace direction may comply with conventional practices by paralleling the board edges, so that trace layout does not become significantly more complicated than in conventional trace layout techniques.
- the number of segments in the differential bus may be two, three, four or any other larger number. For many purposes four segments (leading to reduction of worst case bundle weave effect by at least 75%) will be adequate.
- the number of segments to be formed may be decided upon based on the length of the bus, the data rate, and the desired level of mitigation of the bundle weave effect.
- propagation velocity is a function of dielectric constant.
- v is the propagation velocity
- ⁇ reff is the effective dielectric constant
- Timing noise T noise An estimate of the timing noise T noise can be calculated as follows:
- z is the length of the differential bus
- v D + is the propagation velocity in one of the traces
- v D- is the propagation velocity in the other one of the traces
- ⁇ ref/ D+ is the effective dielectric constant seen by one of the traces
- ⁇ reff D _ is the effective dielectric constant seen by the other one of the traces.
- the unit interval is the inverse of the data rate.
- FIG. 3 is a graph that shows estimated worst case levels of bundle weave effect for various data rates and bus lengths when conventional straight trace layouts are employed.
- Graph line 302 in FIG. 3 shows the estimated worst case timing noise (as a percent of the UI) as a function of bus length when the data rate is 2 Gb/s.
- Graph line 304 shows the estimated worst case timing noise as a function of bus length when the data rate is 5 Gb/s.
- Graph line 306 shows the estimated worst case timing noise as a function of bus length when the data rate is 10 Gb/s.
- FIG. 4 is a graph that shows estimated worst case levels of bundle weave effect for various data rates and bus lengths when four-segment trace layouts are employed in accordance with the embodiment of FIG. 2 (i.e., with the estimated worst case reduced by
- Graph line 402 in FIG. 4 shows the estimated worst case timing noise as a function of bus length (for a four-segment trace layout) when the data rate is 2 Gb/s.
- Graph line 404 shows the estimated worst case timing noise as a function of bus length (for a four- segment trace layout) when the data rate is 5 Gb/s.
- Graph line 406 shows the estimated worst case timing noise as a function of bus length (for a four-segment trace layout) when the data rate is 10 Gb/s.
- FIG. 5 is a schematic side view of a PCB 500 according to some embodiments.
- FIG. 6 is a schematic plan view of the PCB.
- the PCB 500 includes a board substrate 502, a first electronic device 504 mounted on the board substrate 502 and a second electronic device 506 mounted on the board substrate 502.
- PCB refers both to a finished PCB including electronic devices, as well as to the board substrate as it exists before one or more devices or components are mounted thereon.
- circuit board refers both to the board substrate as well as to the PCB as a whole with some or all of the required electronic devices or components mounted thereon.
- the electronic devices 504, 506 may each take the form of a packaged integrated circuit (or circuits) each mounted via a socket (not separately shown) or by another technique to the board substrate 502.
- one of the devices may be a system CPU (microprocessor) and the other one of the devices may be a chipset, with the PCB being the motherboard of a desktop computer.
- the number of electronic devices and other components mounted on the board substrate 502 may be greater than two.
- Dashed line 508 in FIG. 5 schematically represents a differential signal bus that interconnects the electronic devices 504, 506.
- the differential bus 508 is constituted by a pair of signal traces laid out on or in the board substrate 502 in accordance, e.g., with the layouts shown in FIG. 1 or FIG. 2 or with a total number of segments per trace other than two or four. (It will be recognized that a trace layout having a total of four segments per trace can be said to include two segments per trace, as can any trace layout having a total of two or more segments per trace.)
- Reference numeral 510 in FIG. 6 indicates an edge of the board substrate 502. All of the segments of the traces (as seen, e.g., in FIGS.
- the differential bus 508 may be substantially parallel to edge 510 of board substrate 502.
- the longitudinal axes shown in FIG. 2 may all be substantially parallel to edge 510.
- the board substrate 502 may be primarily formed of FR4, incorporating a glass bundle weave structure as described above.
- a trace segment "coincides” with a longitudinal axis if both of the endpoints of the trace segment fall on the longitudinal axis, and two axes “coincide” with each other if every point on one axis falls on the other axis.
- An “axis” is a straight line.
- a “segment” is a portion of a trace that is shifted in a transverse direction relative to another portion of the trace.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112007000628.5T DE112007000628B4 (en) | 2006-03-21 | 2007-03-14 | An article of manufacture and a system |
GB0818538A GB2450280B (en) | 2006-03-21 | 2007-03-14 | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
CN2007800092798A CN101406114B (en) | 2006-03-21 | 2007-03-14 | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/385,093 | 2006-03-21 | ||
US11/385,093 US7427719B2 (en) | 2006-03-21 | 2006-03-21 | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007109483A1 true WO2007109483A1 (en) | 2007-09-27 |
Family
ID=38522769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/064015 WO2007109483A1 (en) | 2006-03-21 | 2007-03-14 | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
Country Status (6)
Country | Link |
---|---|
US (3) | US7427719B2 (en) |
CN (1) | CN101406114B (en) |
DE (1) | DE112007000628B4 (en) |
GB (1) | GB2450280B (en) |
TW (1) | TWI334758B (en) |
WO (1) | WO2007109483A1 (en) |
Cited By (4)
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EP2086293A1 (en) * | 2008-01-24 | 2009-08-05 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
EP2079289A3 (en) * | 2008-01-08 | 2010-05-19 | Fujitsu Limited | Printed wiring board and printed substrate unit |
EP2373130A1 (en) * | 2010-03-29 | 2011-10-05 | Fujitsu Limited | Printed wiring board manufacturing method and printed wiring board |
EP2397587A1 (en) * | 2010-06-21 | 2011-12-21 | Fujitsu Limited | Wiring substrate and method for manufacturing the wiring substrate |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8108710B2 (en) * | 2008-01-08 | 2012-01-31 | Mayo Foundation For Medical Education And Research | Differential communication link with skew compensation circuit |
TWI409010B (en) * | 2008-02-15 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Circuit board |
US8237058B2 (en) * | 2010-05-06 | 2012-08-07 | Oracle America, Inc. | Printed circuit board with low propagation skew between signal traces |
US9655231B2 (en) | 2014-05-12 | 2017-05-16 | Fujitsu Limited | Compensating for intra-pair skew in differential signaling |
US10167550B2 (en) * | 2014-06-03 | 2019-01-01 | Aurora Flight Sciences Corporation | Multi-functional composite structures |
US10368401B2 (en) | 2014-06-03 | 2019-07-30 | Aurora Flight Sciences Corporation | Multi-functional composite structures |
US10285219B2 (en) | 2014-09-25 | 2019-05-07 | Aurora Flight Sciences Corporation | Electrical curing of composite structures |
CN105704931B (en) * | 2014-11-28 | 2021-01-22 | 中兴通讯股份有限公司 | Wiring method of differential signal line and PCB |
US10973115B2 (en) * | 2016-05-20 | 2021-04-06 | Ciena Corporation | Spread weave induced skew minimization |
CN109451651A (en) * | 2018-10-23 | 2019-03-08 | 惠科股份有限公司 | A kind of the difference cabling and circuit board of circuit board |
CN111698832B (en) * | 2020-06-12 | 2021-10-15 | 广东浪潮大数据研究有限公司 | Signal transmission method, device and medium for high-speed differential signal line of circuit board |
JP2023000823A (en) * | 2021-06-18 | 2023-01-04 | キオクシア株式会社 | Printed board and electronic equipment |
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Also Published As
Publication number | Publication date |
---|---|
TW200806143A (en) | 2008-01-16 |
CN101406114A (en) | 2009-04-08 |
GB2450280A (en) | 2008-12-17 |
US7977581B2 (en) | 2011-07-12 |
GB2450280B (en) | 2011-03-16 |
TWI334758B (en) | 2010-12-11 |
CN101406114B (en) | 2011-03-09 |
DE112007000628T5 (en) | 2009-07-09 |
GB0818538D0 (en) | 2008-11-19 |
US7723618B2 (en) | 2010-05-25 |
DE112007000628B4 (en) | 2016-04-28 |
US20070223205A1 (en) | 2007-09-27 |
US20080308306A1 (en) | 2008-12-18 |
US20100202118A1 (en) | 2010-08-12 |
US7427719B2 (en) | 2008-09-23 |
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