WO2007120662A3 - Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers - Google Patents

Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers Download PDF

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Publication number
WO2007120662A3
WO2007120662A3 PCT/US2007/008840 US2007008840W WO2007120662A3 WO 2007120662 A3 WO2007120662 A3 WO 2007120662A3 US 2007008840 W US2007008840 W US 2007008840W WO 2007120662 A3 WO2007120662 A3 WO 2007120662A3
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
heat
loop
personal computer
thermal bus
Prior art date
Application number
PCT/US2007/008840
Other languages
French (fr)
Other versions
WO2007120662A2 (en
Inventor
Richard Grant Brewer
Norman Chow
James Hom
Original Assignee
Cooligy Inc
Richard Grant Brewer
Norman Chow
James Hom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, Richard Grant Brewer, Norman Chow, James Hom filed Critical Cooligy Inc
Priority to JP2009505435A priority Critical patent/JP2009533764A/en
Priority to EP07755197A priority patent/EP2016357A2/en
Publication of WO2007120662A2 publication Critical patent/WO2007120662A2/en
Publication of WO2007120662A3 publication Critical patent/WO2007120662A3/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to- air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.
PCT/US2007/008840 2006-04-11 2007-04-09 Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers WO2007120662A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009505435A JP2009533764A (en) 2006-04-11 2007-04-09 Cooling system
EP07755197A EP2016357A2 (en) 2006-04-11 2007-04-09 Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US79124206P 2006-04-11 2006-04-11
US60/791,242 2006-04-11
US11/784,298 2007-04-06
US11/784,298 US7715194B2 (en) 2006-04-11 2007-04-06 Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers

Publications (2)

Publication Number Publication Date
WO2007120662A2 WO2007120662A2 (en) 2007-10-25
WO2007120662A3 true WO2007120662A3 (en) 2008-02-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/008840 WO2007120662A2 (en) 2006-04-11 2007-04-09 Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers

Country Status (4)

Country Link
US (1) US7715194B2 (en)
EP (1) EP2016357A2 (en)
JP (1) JP2009533764A (en)
WO (1) WO2007120662A2 (en)

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