WO2007120887A3 - Packaging a mems device using a frame - Google Patents

Packaging a mems device using a frame Download PDF

Info

Publication number
WO2007120887A3
WO2007120887A3 PCT/US2007/009275 US2007009275W WO2007120887A3 WO 2007120887 A3 WO2007120887 A3 WO 2007120887A3 US 2007009275 W US2007009275 W US 2007009275W WO 2007120887 A3 WO2007120887 A3 WO 2007120887A3
Authority
WO
WIPO (PCT)
Prior art keywords
frame
packaging
mems device
transparent substrate
backplate
Prior art date
Application number
PCT/US2007/009275
Other languages
French (fr)
Other versions
WO2007120887A2 (en
Inventor
Bangalore R Natarajan
Original Assignee
Qualcomm Inc
Bangalore R Natarajan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc, Bangalore R Natarajan filed Critical Qualcomm Inc
Priority to EP07775497A priority Critical patent/EP1979268A2/en
Publication of WO2007120887A2 publication Critical patent/WO2007120887A2/en
Publication of WO2007120887A3 publication Critical patent/WO2007120887A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing

Abstract

A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.
PCT/US2007/009275 2006-04-13 2007-04-12 Packaging a mems device using a frame WO2007120887A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07775497A EP1979268A2 (en) 2006-04-13 2007-04-12 Packaging a mems device using a frame

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79173006P 2006-04-13 2006-04-13
US60/791,730 2006-04-13

Publications (2)

Publication Number Publication Date
WO2007120887A2 WO2007120887A2 (en) 2007-10-25
WO2007120887A3 true WO2007120887A3 (en) 2008-01-31

Family

ID=38562921

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2007/009275 WO2007120887A2 (en) 2006-04-13 2007-04-12 Packaging a mems device using a frame
PCT/US2007/009271 WO2007120885A2 (en) 2006-04-13 2007-04-12 Mems devices and processes for packaging such devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2007/009271 WO2007120885A2 (en) 2006-04-13 2007-04-12 Mems devices and processes for packaging such devices

Country Status (3)

Country Link
US (2) US7746537B2 (en)
EP (1) EP1979268A2 (en)
WO (2) WO2007120887A2 (en)

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US20070242341A1 (en) 2007-10-18
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