WO2007123806A3 - Imprint lithography system - Google Patents

Imprint lithography system Download PDF

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Publication number
WO2007123806A3
WO2007123806A3 PCT/US2007/008076 US2007008076W WO2007123806A3 WO 2007123806 A3 WO2007123806 A3 WO 2007123806A3 US 2007008076 W US2007008076 W US 2007008076W WO 2007123806 A3 WO2007123806 A3 WO 2007123806A3
Authority
WO
WIPO (PCT)
Prior art keywords
lithography system
imprint lithography
substrate
normal
angle relative
Prior art date
Application number
PCT/US2007/008076
Other languages
French (fr)
Other versions
WO2007123806A2 (en
Inventor
Pawan K Nimmakayala
Byung-Jin Choi
Tom H Rafferty
Philip D Schumaker
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of WO2007123806A2 publication Critical patent/WO2007123806A2/en
Publication of WO2007123806A3 publication Critical patent/WO2007123806A3/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

A imprint lithography system operable for imprinting a pattern into a material deposited between an imprint mold and a substrate, the system including, inter alia, a first set of imaging units positioned at a first angle relative to normal of the substrate; and a second set of imaging units positioned at a second angle relative to normal of the substrate, wherein the first and second angles are not equal to each other.
PCT/US2007/008076 2006-04-03 2007-04-02 Imprint lithography system WO2007123806A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US78880906P 2006-04-03 2006-04-03
US78881006P 2006-04-03 2006-04-03
US60/788,810 2006-04-03
US60/788,809 2006-04-03

Publications (2)

Publication Number Publication Date
WO2007123806A2 WO2007123806A2 (en) 2007-11-01
WO2007123806A3 true WO2007123806A3 (en) 2007-12-27

Family

ID=38625509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/008076 WO2007123806A2 (en) 2006-04-03 2007-04-02 Imprint lithography system

Country Status (3)

Country Link
US (2) US20070231421A1 (en)
TW (1) TW200745791A (en)
WO (1) WO2007123806A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8012395B2 (en) 2006-04-18 2011-09-06 Molecular Imprints, Inc. Template having alignment marks formed of contrast material
US7837907B2 (en) * 2007-07-20 2010-11-23 Molecular Imprints, Inc. Alignment system and method for a substrate in a nano-imprint process
US20090147237A1 (en) * 2007-12-05 2009-06-11 Molecular Imprints, Inc. Spatial Phase Feature Location
US8237133B2 (en) * 2008-10-10 2012-08-07 Molecular Imprints, Inc. Energy sources for curing in an imprint lithography system
US8345242B2 (en) 2008-10-28 2013-01-01 Molecular Imprints, Inc. Optical system for use in stage control
US8432548B2 (en) * 2008-11-04 2013-04-30 Molecular Imprints, Inc. Alignment for edge field nano-imprinting
US8231821B2 (en) * 2008-11-04 2012-07-31 Molecular Imprints, Inc. Substrate alignment
CN102438841A (en) * 2009-03-23 2012-05-02 因特瓦克公司 A process for optimization of island to trench ratio in patterned media
JP5774598B2 (en) 2009-11-24 2015-09-09 エーエスエムエル ネザーランズ ビー．ブイ． Alignment and imprint lithography
NL2006454A (en) 2010-05-03 2011-11-07 Asml Netherlands Bv Imprint lithography method and apparatus.
KR20120073615A (en) * 2010-12-27 2012-07-05 삼성전자주식회사 Shielding local printing apparatus and method thereof
JP5706861B2 (en) 2011-10-21 2015-04-22 キヤノン株式会社 Detector, detection method, imprint apparatus, and article manufacturing method
JP6012209B2 (en) * 2012-03-15 2016-10-25 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6671160B2 (en) * 2015-11-30 2020-03-25 キヤノン株式会社 Imprint apparatus, article manufacturing method and alignment method
JP6860709B2 (en) * 2020-01-17 2021-04-21 キヤノン株式会社 Imprint equipment, article manufacturing method and alignment method
JP2023512917A (en) 2020-02-05 2023-03-30 エーエスエムエル ホールディング エヌ．ブイ． Apparatus for sensing alignment marks
US20220373880A1 (en) * 2021-05-20 2022-11-24 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and article manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580505B1 (en) * 2000-06-22 2003-06-17 Kla-Tencor Corporation Overlay alignment mark design
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
US20040257571A1 (en) * 2003-02-22 2004-12-23 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US6954275B2 (en) * 2000-08-01 2005-10-11 Boards Of Regents, The University Of Texas System Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography

Family Cites Families (178)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3783520A (en) * 1970-09-28 1974-01-08 Bell Telephone Labor Inc High accuracy alignment procedure utilizing moire patterns
FR2325018A1 (en) * 1975-06-23 1977-04-15 Ibm INTERVAL MEASURING DEVICE FOR DEFINING THE DISTANCE BETWEEN TWO OR MORE FACES
GB1578259A (en) 1977-05-11 1980-11-05 Philips Electronic Associated Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby
US4326805A (en) * 1980-04-11 1982-04-27 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer members
US4444801A (en) 1981-01-14 1984-04-24 Hitachi, Ltd. Method and apparatus for correcting transparent defects on a photomask
FR2538923A1 (en) * 1982-12-30 1984-07-06 Thomson Csf METHOD AND DEVICE FOR OPTICALLY ALIGNING PATTERNS IN TWO PLANS RECONCILED IN AN EXPOSURE APPARATUS COMPRISING A DIVERGENT RADIATION SOURCE
US4512848A (en) 1984-02-06 1985-04-23 Exxon Research And Engineering Co. Procedure for fabrication of microstructures over large areas using physical replication
US5571471A (en) * 1984-08-08 1996-11-05 3D Systems, Inc. Method of production of three-dimensional objects by stereolithography
JPS61116358A (en) 1984-11-09 1986-06-03 Mitsubishi Electric Corp Photomask material
US4776695A (en) 1986-05-16 1988-10-11 Prometrix Corporation High accuracy film thickness measurement system
KR900004269B1 (en) * 1986-06-11 1990-06-18 가부시기가이샤 도시바 Method and device for positioing 1st body and 2nd body
US4929083A (en) * 1986-06-19 1990-05-29 Xerox Corporation Focus and overlay characterization and optimization for photolithographic exposure
JPS6334108A (en) * 1986-07-30 1988-02-13 Hitachi Ltd Manufacture of substrate for optical disc and device therefor
US4707611A (en) * 1986-12-08 1987-11-17 Rockwell International Corporation Incremental monitoring of thin films
US4757207A (en) 1987-03-03 1988-07-12 International Business Machines Corporation Measurement of registration of overlaid test patterns by the use of reflected light
US4731155A (en) 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
US5028366A (en) 1988-01-12 1991-07-02 Air Products And Chemicals, Inc. Water based mold release compositions for making molded polyurethane foam
EP0355496A3 (en) * 1988-08-15 1990-10-10 Sumitomo Heavy Industries Co., Ltd. Position detector employing a sector fresnel zone plate
JP2546350B2 (en) * 1988-09-09 1996-10-23 キヤノン株式会社 Alignment device
US4887283A (en) 1988-09-27 1989-12-12 Mitsubishi Denki Kabushiki Kaisha X-ray mask and exposure method employing the same
US5876550A (en) * 1988-10-05 1999-03-02 Helisys, Inc. Laminated object manufacturing apparatus and method
US5235400A (en) 1988-10-12 1993-08-10 Hitachi, Ltd. Method of and apparatus for detecting defect on photomask
US5171490A (en) * 1988-11-29 1992-12-15 Fudim Efrem V Method and apparatus for production of three-dimensional objects by irradiation of photopolymers
JP2704001B2 (en) * 1989-07-18 1998-01-26 キヤノン株式会社 Position detection device
US4964145A (en) 1989-07-24 1990-10-16 International Business Machines Corporation System for magnification correction of conductive X-ray lithography mask substrates
US5151754A (en) * 1989-10-06 1992-09-29 Kabushiki Kaisha Toshiba Method and an apparatus for measuring a displacement between two objects and a method and an apparatus for measuring a gap distance between two objects
JP3197010B2 (en) * 1990-03-05 2001-08-13 株式会社東芝 Interval setting method and interval setting device
US5160402A (en) 1990-05-24 1992-11-03 Applied Materials, Inc. Multi-channel plasma discharge endpoint detection method
US5331371A (en) 1990-09-26 1994-07-19 Canon Kabushiki Kaisha Alignment and exposure method
US5072126A (en) 1990-10-31 1991-12-10 International Business Machines Corporation Promixity alignment using polarized illumination and double conjugate projection lens
US5270222A (en) 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
JP2796899B2 (en) 1991-02-16 1998-09-10 住友重機械工業株式会社 Illumination method for band light and multicolor light in a chromatic aberration double focus device
JP2985323B2 (en) 1991-03-04 1999-11-29 株式会社日立製作所 Pattern inspection method and apparatus
US5155749A (en) 1991-03-28 1992-10-13 International Business Machines Corporation Variable magnification mask for X-ray lithography
US5563702A (en) 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
JPH05157521A (en) 1991-08-29 1993-06-22 Nkk Corp Measuring method of ellipso parameter and ellipsometer
JPH0580530A (en) 1991-09-24 1993-04-02 Hitachi Ltd Production of thin film pattern
US5877032A (en) 1995-10-12 1999-03-02 Lucent Technologies Inc. Process for device fabrication in which the plasma etch is controlled by monitoring optical emission
JP3074579B2 (en) * 1992-01-31 2000-08-07 キヤノン株式会社 Position shift correction method
US5204739A (en) 1992-02-07 1993-04-20 Karl Suss America, Inc. Proximity mask alignment using a stored video image
US5545367A (en) 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
EP0568478A1 (en) * 1992-04-29 1993-11-03 International Business Machines Corporation Darkfield alignment system using a confocal spatial filter
WO1994002832A1 (en) 1992-07-15 1994-02-03 On-Line Technologies, Inc. Method and apparatus for monitoring layer processing
US5601641A (en) 1992-07-21 1997-02-11 Tse Industries, Inc. Mold release composition with polybutadiene and method of coating a mold core
JPH06183561A (en) * 1992-12-18 1994-07-05 Canon Inc Moving stage device
JP2821073B2 (en) 1992-12-18 1998-11-05 松下電器産業株式会社 Gap control device and gap control method
US6153886A (en) * 1993-02-19 2000-11-28 Nikon Corporation Alignment apparatus in projection exposure apparatus
US5565114A (en) 1993-03-04 1996-10-15 Tokyo Electron Limited Method and device for detecting the end point of plasma process
DE69405451T2 (en) 1993-03-16 1998-03-12 Koninkl Philips Electronics Nv Method and device for producing a structured relief image from cross-linked photoresist on a flat substrate surface
US5386119A (en) 1993-03-25 1995-01-31 Hughes Aircraft Company Apparatus and method for thick wafer measurement
US5414514A (en) * 1993-06-01 1995-05-09 Massachusetts Institute Of Technology On-axis interferometric alignment of plates using the spatial phase of interference patterns
JP2866559B2 (en) 1993-09-20 1999-03-08 大日本スクリーン製造株式会社 Film thickness measurement method
US6776094B1 (en) 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5776748A (en) 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
US5573877A (en) * 1994-03-15 1996-11-12 Matsushita Electric Industrial Co., Ltd. Exposure method and exposure apparatus
US5477058A (en) * 1994-11-09 1995-12-19 Kabushiki Kaisha Toshiba Attenuated phase-shifting mask with opaque reticle alignment marks
US5563684A (en) 1994-11-30 1996-10-08 Sgs-Thomson Microelectronics, Inc. Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer
JP2999679B2 (en) 1994-11-30 2000-01-17 大日本スクリーン製造株式会社 Pattern defect inspection equipment
JPH08232087A (en) 1994-12-08 1996-09-10 Sumitomo Metal Ind Ltd Method for detecting end point of etching and etching device
US6034378A (en) * 1995-02-01 2000-03-07 Nikon Corporation Method of detecting position of mark on substrate, position detection apparatus using this method, and exposure apparatus using this position detection apparatus
US5504793A (en) * 1995-02-17 1996-04-02 Loral Federal Systems Company Magnification correction for 1-X proximity X-Ray lithography
US5849209A (en) 1995-03-31 1998-12-15 Johnson & Johnson Vision Products, Inc. Mold material made with additives
US5820769A (en) 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
US5808742A (en) * 1995-05-31 1998-09-15 Massachusetts Institute Of Technology Optical alignment apparatus having multiple parallel alignment marks
US5625193A (en) 1995-07-10 1997-04-29 Qc Optics, Inc. Optical inspection system and method for detecting flaws on a diffractive surface
JP3624476B2 (en) * 1995-07-17 2005-03-02 セイコーエプソン株式会社 Manufacturing method of semiconductor laser device
JPH0933222A (en) 1995-07-18 1997-02-07 Dainippon Screen Mfg Co Ltd Film-thickness measuring apparatus
US5849222A (en) 1995-09-29 1998-12-15 Johnson & Johnson Vision Products, Inc. Method for reducing lens hole defects in production of contact lens blanks
US5545570A (en) * 1995-09-29 1996-08-13 Taiwan Semiconductor Manufacturing Company Method of inspecting first layer overlay shift in global alignment process
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US7758794B2 (en) 2001-10-29 2010-07-20 Princeton University Method of making an article comprising nanoscale patterns with reduced edge roughness
US20040036201A1 (en) 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US20040137734A1 (en) 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
JP2842362B2 (en) * 1996-02-29 1999-01-06 日本電気株式会社 Superposition measurement method
US5669303A (en) 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US6355198B1 (en) 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
US20030179354A1 (en) 1996-03-22 2003-09-25 Nikon Corporation Mask-holding apparatus for a light exposure apparatus and related scanning-exposure method
US5802914A (en) 1996-05-30 1998-09-08 Eastman Kodak Company Alignment mechanism using flexures
US6023338A (en) * 1996-07-12 2000-02-08 Bareket; Noah Overlay alignment measurement of wafers
US5717518A (en) * 1996-07-22 1998-02-10 Kla Instruments Corporation Broad spectrum ultraviolet catadioptric imaging system
US5837892A (en) 1996-10-25 1998-11-17 Camelot Systems, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US6112588A (en) 1996-10-25 2000-09-05 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
JPH10172897A (en) 1996-12-05 1998-06-26 Nikon Corp Substrate adaptor, substrate holder and method for holding substrate
US5694207A (en) 1996-12-09 1997-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Etch rate monitoring by optical emission spectroscopy
US6049373A (en) * 1997-02-28 2000-04-11 Sumitomo Heavy Industries, Ltd. Position detection technique applied to proximity exposure
DE19710420C2 (en) * 1997-03-13 2001-07-12 Helmut Fischer Gmbh & Co Method and device for measuring the thicknesses of thin layers by means of X-ray fluorescence
US6051179A (en) * 1997-03-19 2000-04-18 Replicator Systems, Inc. Apparatus and method for production of three-dimensional models by spatial light modulator
JP3296239B2 (en) * 1997-03-27 2002-06-24 ウシオ電機株式会社 Proximity exposure apparatus with gap setting mechanism
US5948470A (en) 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US6278809B1 (en) 1997-05-30 2001-08-21 Ion Optics, Inc. Fiber optic reflectance apparatus for in situ characterization of thin films
US5798837A (en) 1997-07-11 1998-08-25 Therma-Wave, Inc. Thin film optical measurement system and method with calibrating ellipsometer
US6278519B1 (en) 1998-01-29 2001-08-21 Therma-Wave, Inc. Apparatus for analyzing multi-layer thin film stacks on semiconductors
US6204895B1 (en) 1997-09-30 2001-03-20 Kabushiki Kaisha Toshiba Display panel associated with light collecting plate and position adjusting method using microlenses for the display panel
US5877861A (en) * 1997-11-14 1999-03-02 International Business Machines Corporation Method for overlay control system
US5991022A (en) * 1997-12-09 1999-11-23 N&K Technology, Inc. Reflectance spectrophotometric apparatus with toroidal mirrors
US6019166A (en) 1997-12-30 2000-02-01 Intel Corporation Pickup chuck with an integral heatsink
US6081334A (en) 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes
US6753972B1 (en) 1998-04-21 2004-06-22 Hitachi, Ltd. Thin film thickness measuring method and apparatus, and method and apparatus for manufacturing a thin film device using the same
US6068783A (en) 1998-04-28 2000-05-30 Winbond Electronics Corp In-situ and non-intrusive method for monitoring plasma etch chamber condition utilizing spectroscopic technique
JP3780700B2 (en) 1998-05-26 2006-05-31 セイコーエプソン株式会社 Pattern forming method, pattern forming apparatus, pattern forming plate, pattern forming plate manufacturing method, color filter manufacturing method, conductive film manufacturing method, and liquid crystal panel manufacturing method
US6239590B1 (en) 1998-05-26 2001-05-29 Micron Technology, Inc. Calibration target for calibrating semiconductor wafer test systems
US6150231A (en) * 1998-06-15 2000-11-21 Siemens Aktiengesellschaft Overlay measurement technique using moire patterns
US6016696A (en) 1998-09-25 2000-01-25 Lucent Technologies Inc. Method for determining volume changes in viscous liquids
US6713238B1 (en) 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6248486B1 (en) * 1998-11-23 2001-06-19 U.S. Philips Corporation Method of detecting aberrations of an optical imaging system
JP4846888B2 (en) * 1998-12-01 2011-12-28 キヤノン株式会社 Alignment method
US6388755B1 (en) * 1998-12-03 2002-05-14 Advanced Optical Technologies, Inc. Wireless position and orientation detecting system
US6204922B1 (en) * 1998-12-11 2001-03-20 Filmetrics, Inc. Rapid and accurate thin film measurement of individual layers in a multi-layered or patterned sample
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6052183A (en) 1999-04-14 2000-04-18 Winbond Electronics Corp In-situ particle monitoring
US6522411B1 (en) * 1999-05-25 2003-02-18 Massachusetts Institute Of Technology Optical gap measuring apparatus and method having two-dimensional grating mark with chirp in one direction
KR100549776B1 (en) * 1999-07-01 2006-02-06 에이에스엠엘 네델란즈 비.브이. Apparatus and method of image enhancement through spatial filtering
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6091485A (en) * 1999-12-15 2000-07-18 N & K Technology, Inc. Method and apparatus for optically determining physical parameters of underlayers
AU779699B2 (en) 1999-12-23 2005-02-10 Universitat Konstanz Methods and apparatus for forming submicron patterns on films
US6245581B1 (en) 2000-04-19 2001-06-12 Advanced Micro Devices, Inc. Method and apparatus for control of critical dimension using feedback etch control
JP2001358056A (en) 2000-06-15 2001-12-26 Canon Inc Exposure apparatus
CN100504598C (en) * 2000-07-16 2009-06-24 得克萨斯州大学系统董事会 High-resolution overlay alignment methods and systems for imprint lithography
US6696220B2 (en) 2000-10-12 2004-02-24 Board Of Regents, The University Of Texas System Template for room temperature, low pressure micro-and nano-imprint lithography
US7635262B2 (en) 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US7211214B2 (en) 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US20050037143A1 (en) 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor
AU2001286573A1 (en) 2000-08-21 2002-03-04 Board Of Regents, The University Of Texas System Flexure based macro motion translation stage
US6451705B1 (en) * 2000-08-31 2002-09-17 Micron Technology, Inc. Self-aligned PECVD etch mask
US6718630B2 (en) * 2000-09-18 2004-04-13 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting components on substrate
US6633391B1 (en) 2000-11-07 2003-10-14 Applied Materials, Inc Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy
US6603538B1 (en) 2000-11-21 2003-08-05 Applied Materials, Inc. Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system
US6790763B2 (en) 2000-12-04 2004-09-14 Ebara Corporation Substrate processing method
US6819426B2 (en) 2001-02-12 2004-11-16 Therma-Wave, Inc. Overlay alignment metrology using diffraction gratings
US6489068B1 (en) * 2001-02-21 2002-12-03 Advanced Micro Devices, Inc. Process for observing overlay errors on lithographic masks
US6387787B1 (en) 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
US6791669B2 (en) * 2001-04-12 2004-09-14 Nikon Corporation Positioning device and exposure apparatus including the same
US6383888B1 (en) * 2001-04-18 2002-05-07 Advanced Micro Devices, Inc. Method and apparatus for selecting wafer alignment marks based on film thickness variation
US6847433B2 (en) 2001-06-01 2005-01-25 Agere Systems, Inc. Holder, system, and process for improving overlay in lithography
US6561706B2 (en) 2001-06-28 2003-05-13 Advanced Micro Devices, Inc. Critical dimension monitoring from latent image
US20050064344A1 (en) 2003-09-18 2005-03-24 University Of Texas System Board Of Regents Imprint lithography templates having alignment marks
EP1417474B1 (en) 2001-07-25 2021-12-29 The Trustees Of Princeton University Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
JP2003057027A (en) 2001-08-10 2003-02-26 Ebara Corp Measuring instrument
CN100347608C (en) 2001-09-25 2007-11-07 米卢塔技术株式会社 Method for forming a micro-pattern on a substrate by using capillary force
US20030080472A1 (en) 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
US6771374B1 (en) 2002-01-16 2004-08-03 Advanced Micro Devices, Inc. Scatterometry based measurements of a rotating substrate
US20030133126A1 (en) 2002-01-17 2003-07-17 Applied Materials, Inc. Spectral reflectance for in-situ film characteristic measurements
DE10307518B4 (en) * 2002-02-22 2011-04-14 Hoya Corp. Halftone phase shift mask blank, halftone phase shift mask and method of making the same
CA2482566C (en) * 2002-04-16 2010-07-20 Princeton University Gradient structures interfacing microfluidics and nanofluidics, methods for fabrication and uses thereof
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US6900881B2 (en) 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US6908861B2 (en) 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
US6665119B1 (en) * 2002-10-15 2003-12-16 Eastman Kodak Company Wire grid polarizer
US6929762B2 (en) 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US7750059B2 (en) 2002-12-04 2010-07-06 Hewlett-Packard Development Company, L.P. Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
JP4563181B2 (en) 2002-12-13 2010-10-13 モレキュラー・インプリンツ・インコーポレーテッド Magnification correction using substrate surface curvature
US6770852B1 (en) 2003-02-27 2004-08-03 Lam Research Corporation Critical dimension variation compensation across a wafer by means of local wafer temperature control
EP1606834B1 (en) 2003-03-27 2013-06-05 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp
SG147288A1 (en) 2003-04-29 2008-11-28 Asml Netherlands Bv Lithographic apparatus, device manufacturing method and angular encoder
TWI228638B (en) 2003-06-10 2005-03-01 Ind Tech Res Inst Method for and apparatus for bonding patterned imprint to a substrate by adhering means
US7136150B2 (en) * 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
EP1774407B1 (en) 2004-06-03 2017-08-09 Board of Regents, The University of Texas System System and method for improvement of alignment and overlay for microlithography
US20050270516A1 (en) 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
US7785526B2 (en) * 2004-07-20 2010-08-31 Molecular Imprints, Inc. Imprint alignment method, system, and template
US7292326B2 (en) * 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
US7630067B2 (en) * 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
JP5198071B2 (en) 2004-12-01 2013-05-15 モレキュラー・インプリンツ・インコーポレーテッド Exposure method for thermal management in imprint lithography process
US7802978B2 (en) 2006-04-03 2010-09-28 Molecular Imprints, Inc. Imprinting of partial fields at the edge of the wafer
KR20090003153A (en) 2006-04-03 2009-01-09 몰레큘러 임프린츠 인코퍼레이티드 Method of concurrently patterning a substrate having a plurality of fields and alignment marks
US7547398B2 (en) 2006-04-18 2009-06-16 Molecular Imprints, Inc. Self-aligned process for fabricating imprint templates containing variously etched features
US7837907B2 (en) 2007-07-20 2010-11-23 Molecular Imprints, Inc. Alignment system and method for a substrate in a nano-imprint process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580505B1 (en) * 2000-06-22 2003-06-17 Kla-Tencor Corporation Overlay alignment mark design
US6954275B2 (en) * 2000-08-01 2005-10-11 Boards Of Regents, The University Of Texas System Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
US20040257571A1 (en) * 2003-02-22 2004-12-23 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry

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US20070231421A1 (en) 2007-10-04

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